Patents Assigned to Furui Precise Component (Kunshan) Co., Ltd.
  • Publication number: 20140102671
    Abstract: An exemplary flat heat pipe includes a hollow, flattened casing and a first wick structure and a second wick structure received in the casing. The casing includes a top plate and a bottom plate opposite to the top plate. The first wick structure is formed by weaving wires, and the second wick structure is made of sintered metal powder. The first and second wick structures are disposed at inner sides of the bottom and top plates of the casing, respectively. The first and second wick structures contact each other. The casing defines two vapor channels at opposite lateral sides of the combined first and second wick structures, respectively.
    Type: Application
    Filed: December 26, 2013
    Publication date: April 17, 2014
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.
    Inventors: SHENG-LIANG DAI, JIN-PENG LIU, YUE LIU, SHENG-GUO ZHOU, SHENG-LIN WU, NIEN-TIEN CHENG
  • Patent number: 8681499
    Abstract: An exemplary fastener includes a connecting member and a protecting member. The connecting member includes a head, and a connecting portion extending down away from the head. The protecting member includes a first engaging portion and a second engaging portion extending from the first engaging portion. The first and second engaging portions are coaxial. The connecting portion of the connecting member extends through the second engaging portion, the head of the connecting member is surrounded by the first engaging portion of the protecting member with a bottom surface of the head abutting a top end of the second engaging portion. A top end of the first engaging portion is above a top surface of the head and defines a receiving space above the head. The receiving space is adapted for receiving a tool therein.
    Type: Grant
    Filed: September 19, 2011
    Date of Patent: March 25, 2014
    Assignees: Furui Precise Component (Kunshan) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Jia Rao, Zhi-Hui Zhao
  • Patent number: 8667684
    Abstract: An exemplary flat heat pipe includes a hollow, flattened casing and a first wick structure and a second wick structure received in the casing. The casing includes a top plate and a bottom plate opposite to the top plate. The first wick structure is formed by weaving wires, and the second wick structure is made of sintered metal powder. The first and second wick structures are disposed at inner sides of the bottom and top plates of the casing, respectively. The first and second wick structures contact each other. The casing defines two vapor channels at opposite lateral sides of the combined first and second wick structures, respectively. A method for manufacturing the heat pipe is also provided.
    Type: Grant
    Filed: June 28, 2010
    Date of Patent: March 11, 2014
    Assignees: Furui Precise Component (Kunshan) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Sheng-Liang Dai, Jin-Peng Liu, Yue Liu, Sheng-Guo Zhou, Sheng-Lin Wu, Nien-Tien Cheng
  • Publication number: 20140060781
    Abstract: An exemplary heat pipe includes a first pipe and a second pipe. The first pipe includes a condenser section and an evaporator section extending from the condenser section along a longitudinal direction thereof. The second pipe encloses the condenser section of the first pipe. The evaporator section is located at an outside of the second pipe. The second pipe includes a casing enclosing the condenser section, second wick structures and working fluid contained in the second wick structures. Opposite ends of each second wick structure are respectively adhered to an inner wall of the casing and an outer periphery of the condenser section.
    Type: Application
    Filed: September 16, 2012
    Publication date: March 6, 2014
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.
    Inventors: ZHAO-HUI JIA, JIA-HONG WU, YU-LIANG LO
  • Patent number: 8622117
    Abstract: A heat pipe includes a casing, a main wick structure received in the casing, an auxiliary wick structure received in the main wick structure, and a working fluid contained in the casing. The main wick structure is attached to an inner surface of the casing. An inner peripheral surface of the main wick structure and an outer peripheral surface of the auxiliary wick structure cooperatively define a vapor channel. The auxiliary wick structure is hollow, and extends along a longitudinal direction of the casing. A liquid channel is defined in the auxiliary wick structure. Two ends of the auxiliary wick structure are both fixed on the two ends of the casing. The working fluid is saturated in the main wick structure and the auxiliary wick structure.
    Type: Grant
    Filed: June 25, 2009
    Date of Patent: January 7, 2014
    Assignees: Furui Precise Component (Kunshan) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Sheng-Lin Wu, Yu-Liang Lo, Wen-Hu Chen, Yue Liu, Nien-Tien Cheng
  • Publication number: 20140000855
    Abstract: A heat dissipation device includes a conductive plate and a fastener. The fastener includes a fastening element and an elastic element coiled around the fastening element. The fastening element includes a pole portion and a head portion formed at one end of the pole portion. The conductive plate defines a supporting portion through the conductive plate. The supporting portion defines a hole, an upper groove and a lower groove communicating with one another. The upper groove and the lower groove are coaxial with each other. A flange protrudes from a circumference of the pole portion. The pole portion enters the upper groove. The flange abuts a bottom of the conductive plate and is received in the lower groove. The elastic element elastically abuts the top of the conductive plate.
    Type: Application
    Filed: August 2, 2012
    Publication date: January 2, 2014
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.
    Inventor: BEN-FAN XIA
  • Publication number: 20130340973
    Abstract: A heat dissipation device includes a base and a fastener. The fastener includes a neck portion, a head portion formed at one end of the neck portion, and an engaging portion formed at another opposite end of the neck portion. The base defines a receiving portion through the base. The receiving portion includes an inserting hole and a mounting hole communicating with the inserting hole. The engaging portion extends through the inserting hole from a top of the base to make the neck portion enter the inserting hole. The neck portion is then crushed into the mounting hole from the inserting hole. The engaging portion abuts the bottom side of the base at a periphery of the mounting hole. The head portion abuts the top side of the base at the periphery of the mounting hole.
    Type: Application
    Filed: August 23, 2012
    Publication date: December 26, 2013
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.
    Inventors: JIN-HUAI ZHOU, WEI-HSIANG CHANG, ZHEN TANG
  • Publication number: 20130343003
    Abstract: A heat dissipation device includes a base and a fastener. The fastener includes a neck portion, a head portion formed at one end of the neck portion, and an engaging portion formed at another opposite end of the neck portion. The base defines a receiving portion through the base. The receiving portion includes an inserting hole and a mounting hole communicating with the inserting hole. A flange extends upwardly from the base toward the mounting hole. The engaging portion extends through the inserting hole from a top of the base to make the neck portion enter the inserting hole. The neck portion is then crushed into the mounting hole from the inserting hole. A top face of the head portion abuts the flange, a bottom face of the head portion abuts the base.
    Type: Application
    Filed: August 23, 2012
    Publication date: December 26, 2013
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.
    Inventors: JIN-HUAI ZHOU, WEI-HSIANG CHANG, ZHEN TANG
  • Publication number: 20130306294
    Abstract: A heat dissipation device includes a conductive plate and a fastener. The fastener includes a fastening element and an elastic element coiled around the fastening element. The fastening element includes a pole portion and a head portion formed at one end of the pole portion. The conductive plate defines a supporting portion through the conductive plate. The supporting portion includes a hole and a groove communicating with the hole. A flange protrudes from a circumference of the pole portion. The pole portion enters the groove. The flange abuts a bottom of the conductive plate. The elastic element elastically abuts the top of the conductive plate.
    Type: Application
    Filed: August 2, 2012
    Publication date: November 21, 2013
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.
    Inventor: BEN-FAN XIA
  • Patent number: 8585336
    Abstract: A fastener includes a bolt, a ring engaged around the bolt, and a coil spring. The bolt includes a head, a threaded engaging portion, a shaft portion between the head and the threaded engaging portion, and a bottom flange extending radially and outwards from an end of the shaft portion connecting the threaded engaging portion. The shaft portion includes a main part connecting the head, a tail part connecting the bottom flange, and a guiding part connecting the main part and the tail part. A diameter of tail part is smaller than a diameter of the main part. A diameter of the guiding part increases from the tail part to the main part along an axial direction of the bolt. The coil spring coils the shaft portion and is sandwiched between the head of the bolt and the ring.
    Type: Grant
    Filed: December 1, 2011
    Date of Patent: November 19, 2013
    Assignees: Furui Precise Component (Kunshan) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Tao Tao, Bo Hong
  • Patent number: 8578605
    Abstract: An exemplary method of manufacturing a heat dissipation device includes, firstly, providing a heat pipe including a condenser section having a planar outer surface, and providing a heat sink including a supporting surface defining a guiding line. The guiding line has a width smaller than a width of the outer surface of the condenser section. Next, an amount solder is spread on the supporting surface along the guiding line to form a solder layer on the supporting surface. The solder layer has a size not larger than a size of the outer surface of the condenser section. Then the outer surface of condenser section of the heat pipe is attached to the solder layer on the supporting surface of the heat sink.
    Type: Grant
    Filed: June 4, 2012
    Date of Patent: November 12, 2013
    Assignees: Furui Precise Component (Kunshan) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Ming-Tang Zhang, Wei-Hsiang Chang, Nien-Tien Cheng
  • Publication number: 20130255921
    Abstract: An exemplary heat pipe includes a tube, an evaporation section and a condenser section located at two opposite ends of the tube, a grid wick structure received in the tube and abutting an inner wall of the tube, and a working fluid sealed in the tube. The grid wick structure includes a plurality of rhombuses. Each rhombus includes two opposite first included angles, one of the first included angles is at a point of the rhombus nearest one of the ends of the tube, the other first included angle is at a point of the rhombus nearest the other end of the tube. Each first included angle is smaller than 90 degrees.
    Type: Application
    Filed: March 27, 2013
    Publication date: October 3, 2013
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.
    Inventors: SHENG-LIANG DAI, YU-LIANG LO, JIA-HONG WU
  • Publication number: 20130240179
    Abstract: An exemplary heat dissipation device includes a heat pipe and a fin unit. The heat pipe includes an evaporation section and a condensing section formed at opposite ends thereof, respectively. The fin unit includes plural stacked parallel fins. Each of the fins defines a through hole therein for receiving the condensing section of the heat pipe. A flange extends from a periphery of the through hole. The flange defines two slits to divide the flange into two separate portions. The slits communicate with the through hole. A compressible structure is formed in each fin at opposite sides of the through hole. The compressible structure is aligned with the slits such that when the fin is compressed along a direction transverse to the alignment, the compressible structure is compressed and the separate portions of the flange move toward each other and closely contact the condensing section of the heat pipe.
    Type: Application
    Filed: May 2, 2013
    Publication date: September 19, 2013
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.
    Inventors: YI-SHIH HSIEH, RUI-WEN SUN
  • Publication number: 20130233519
    Abstract: An exemplary flat heat pipe includes a cover, a wick structure adhered to part of an inner surface of the cover and working medium contained in the wick structure. The cover defines a receiving chamber therein. The wick structure is received in the receiving chamber and includes an interface surface away from the inner surface of the cover. The interface of the wick structure and the exposed inner surface of the cover cooperatively define a vapor passage therebetween.
    Type: Application
    Filed: April 1, 2012
    Publication date: September 12, 2013
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.
    Inventors: SHENG-LIANG DAI, YU-LIANG LO
  • Publication number: 20130233522
    Abstract: An exemplary heat dissipation device includes a heat pipe and a fin unit. The heat pipe includes an evaporation section and a condensing section formed at opposite ends thereof, respectively. The fin unit includes plural stacked parallel fins. Each of the fins defines a through hole therein for receiving the condensing section of the heat pipe. A flange extends from a periphery of the through hole. The flange defines two slits to divide the flange into two separate portions. The slits communicate with the through hole. A compressible structure is formed in each fin at opposite sides of the through hole. The compressible structure is aligned with the slits such that when the fin is compressed along a direction transverse to the alignment, the compressible structure is compressed and the separate portions of the flange move toward each other and closely contact the condensing section of the heat pipe.
    Type: Application
    Filed: May 2, 2013
    Publication date: September 12, 2013
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.
    Inventors: YI-SHIH HSIEH, RUI-WEN SUN
  • Publication number: 20130233520
    Abstract: An exemplary flat heat pipe includes a cover, a wick structure and a restricting plate. The cover defines a receiving chamber therein. The wick structure is received in the receiving chamber. The restricting plate is received in the receiving chamber and opposite ends thereof abut against opposite inner surfaces of the cover to divide the receiving chamber into two passages. The restricting plate divides the wick structure into two wick portions, the wick portions are adhered on lateral surfaces of the restricting plate and located at lateral sides of two passages, respectively.
    Type: Application
    Filed: April 3, 2012
    Publication date: September 12, 2013
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.
    Inventors: YU-LIANG LO, SHENG-LIANG DAI
  • Patent number: 8459336
    Abstract: A heat dissipation device with guiding line and soldered heat pipe includes a heat pipe and a heat sink. The heat pipe includes a condenser section and an evaporator section. The condenser section has a planar outer surface. The heat sink includes a supporting surface contacting the outer surface of the condenser section. A guiding line is defined in the supporting surface for spreading solder therealong. The guiding line has a width smaller than a width of the outer surface of the condenser section. The condenser section of the heat pipe is mounted on the supporting surface of the heat sink along the guiding line and firmly connected to the heat sink by the solder.
    Type: Grant
    Filed: June 4, 2012
    Date of Patent: June 11, 2013
    Assignees: Furui Precise Component (Kunshan) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Ming-Tang Zhang, Wei-Hsiang Chang, Nien-Tien Cheng
  • Patent number: 8459340
    Abstract: An exemplary flat heat pipe with an evaporator section and a condenser section includes a hollow casing, and a first wick structure and a second wick structure in the casing. The second structure contacts an inner surface of the casing at the evaporator section. The first structure at the evaporator section includes a first contact portion contacting an inner surface of the second structure, and a first isolated portion from the inner surface of the second structure. The first isolated portion and the inner surface of the second structure define a first channel therebetween. The first structure at the condenser section includes a second contact portion contacting the inner surface of the casing, and a second isolated portion from the inner surface of the casing. The second isolated portion and the inner surface of the casing define therebetween a second channel communicating with the first channel.
    Type: Grant
    Filed: June 17, 2010
    Date of Patent: June 11, 2013
    Assignees: Furui Precise Component (Kunshan) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Yue Liu, Sheng-Liang Dai, Jin-Peng Liu, Sheng-Guo Zhou, Sheng-Lin Wu, Yu-Liang Lo
  • Patent number: 8459339
    Abstract: A heat pipe includes a tube body and a sealing member. The tube body is made of titanium and has a sealed end and an open end at two opposite ends of the tube body. The sealing member is attached to the open end and seals the open end of the tube body. The sealing member is made of a material selected from one of copper, aluminum, stainless steel, low-carbon steel, iron, nickel, tungsten, tantalum, molybdenum, rhenium and columbium. The sealing member seals the open end.
    Type: Grant
    Filed: August 18, 2009
    Date of Patent: June 11, 2013
    Assignees: Furui Precise Component (Kunshan) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Yue Liu, Jin-Peng Liu, Sheng-Liang Dai, Sheng-Lin Wu, Yu-Liang Lo
  • Patent number: 8453716
    Abstract: An exemplary heat dissipation device includes a heat pipe and a fin unit. The heat pipe includes an evaporation section and a condensing section formed at opposite ends thereof, respectively. The fin unit includes plural stacked parallel fins. Each of the fins defines a through hole therein for receiving the condensing section of the heat pipe. A flange extends from a periphery of the through hole. The flange defines two slits to divide the flange into two separate portions. The slits communicate with the through hole. A compressible structure is formed in each fin at opposite sides of the through hole. The compressible structure is aligned with the slits such that when the fin is compressed along a direction transverse to the alignment, the compressible structure is compressed and the separate portions of the flange move toward each other and closely contact the condensing section of the heat pipe.
    Type: Grant
    Filed: July 8, 2010
    Date of Patent: June 4, 2013
    Assignees: Furui Precise Component (Kunshan) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Yi-Shih Hsieh, Rui-Wen Sun