Patents Assigned to Furukawa Electric Co., Ltd.
  • Publication number: 20240150227
    Abstract: An optical fiber includes a core portion made of silica-based glass; and a cladding portion made of silica-based glass having lower maximum refractive index than the core portion, the cladding portion surrounding an outer periphery of the core portion. The core portion is doped with an alkali metal element and chlorine. An average concentration of chlorine is higher than 800 atomic ppm on a cross-section perpendicular to a longitudinal direction of the core portion. A region doped with the alkali metal element is larger than a region doped with chlorine at 800 atomic ppm or higher.
    Type: Application
    Filed: December 13, 2023
    Publication date: May 9, 2024
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kazunori MUKASA, Keiichi AISO
  • Publication number: 20240151897
    Abstract: A multi-core fiber includes: a plurality of core portions; and a cladding portion surrounding outer circumferences of the plurality of core portions and having a refractive index lower than a maximum refractive index of the plurality of core portions. The multi-core fiber has a mode field diameter of 5 ?m or smaller at a wavelength of 1550 nm, the multi-core fiber has a core pitch of 20 ?m or smaller, the core pitch being an interval between centers of nearest neighboring ones of the plurality of core portions in a cross section orthogonal to a longitudinal direction. The multi-core fiber has inter-core crosstalk of ?20 dB/km or less. The multi-core fiber has a macrobending loss of 0.1 dB/m or less at the wavelength of 1550 nm when the multi-core fiber is bent at a radius of 5 mm.
    Type: Application
    Filed: January 16, 2024
    Publication date: May 9, 2024
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Masanori TAKAHASHI, Ryuichi SUGIZAKI
  • Publication number: 20240151898
    Abstract: An optical fiber bundle structure includes: plural optical fiber core wires; a crossing preventing member; and a grasping member. Further, the crossing preventing member has slits and the widths of the slits positioned at the respective sides are each equal to or larger than a difference between: a length of one side of a polygon circumscribing the plural optical fiber core wires at a hindmost end portion of the slits at the trailing end; and a length of one side of a polygon circumscribing the plural optical fiber core wires at the leading end.
    Type: Application
    Filed: January 11, 2024
    Publication date: May 9, 2024
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kohei KAWASAKI, Ryuichi SUGIZAKI, Masayoshi TSUKAMOTO, Masanori TAKAHASHI, Shigehiro TAKASAKA, Koichi MAEDA
  • Publication number: 20240150622
    Abstract: An adhesive composition containing an epoxy resin (A), an epoxy resin curing agent (B), a polyurethane resin (C), and an inorganic filler (D), wherein the polyurethane resin (C) has a tan ? peak top temperature of 0° C. or higher in dynamic mechanical analysis, and the proportion of the polyurethane resin (C) based on the total content of the epoxy resin (A) and the polyurethane resin (C) is from 2 to 50 mass %.
    Type: Application
    Filed: December 18, 2023
    Publication date: May 9, 2024
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventor: Minoru MORITA
  • Patent number: 11977146
    Abstract: To provide a radar device capable of detecting a position of a target in a direction orthogonal to a viewing angle. In a radar device which detects a target by using a radio wave, the radar device includes: a receiving array antenna (receiving array antenna 17) where a plurality of receiving antenna elements (first receiving antenna 17-1 to eighth receiving antenna 17-8) each having a predetermined length in a first direction are arranged to be disposed in a second direction almost orthogonal to the first direction; a dispersion part (dispersion part 31) which is disposed in a vicinity of the receiving array antenna, and dispersion properties of the radio wave change with respect to the first direction; and a detection part (control and process part 15) which detects the position of the target in the first direction based on the radio wave reflected by the dispersion part.
    Type: Grant
    Filed: February 22, 2018
    Date of Patent: May 7, 2024
    Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA AUTOMOTIVE SYSTEMS INC.
    Inventors: Taishi Kagimoto, Hiroyuki Kobayashi, Takeo Okaniwa, Tadataka Wakabishi, Sadao Matsushima
  • Publication number: 20240141216
    Abstract: A film adhesive containing: an epoxy resin (A); an epoxy resin curing agent (B); and a phenoxy resin (C), wherein a content of the epoxy resin curing agent (B) in the film adhesive is 0.30 to 12.0 mass %; and wherein a light transmittance T1 of the film adhesive at a wavelength of 400 nm is 90% or less, a light transmittance T2 of a cured product obtained by thermally curing the film adhesive at a wavelength of 400 nm is 85% or more, and T1<T2 is satisfied.
    Type: Application
    Filed: December 12, 2023
    Publication date: May 2, 2024
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Koyuki SAKAI, Minoru MORITA
  • Publication number: 20240142697
    Abstract: An optical fiber bundle structure includes: plural optical fiber core wires; a crossing preventing member; and a grasping member. Further, the crossing preventing member has slits and the widths of the slits positioned at the respective sides are each equal to or larger than a difference between: a length of one side of a polygon circumscribing the plural optical fiber core wires at a hindmost end portion of the slits at the trailing end; and a length of one side of a polygon circumscribing the plural optical fiber core wires at the leading end.
    Type: Application
    Filed: January 11, 2024
    Publication date: May 2, 2024
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kohei KAWASAKI, Ryuichi SUGIZAKI, Masayoshi TSUKAMOTO, Masanori TAKAHASHI, Shigehiro TAKASAKA, Koichi MAEDA
  • Patent number: 11971453
    Abstract: A battery state detection device including a battery post terminal, a case accommodating a circuit board including a current sensing circuit that senses a current by being electrically connected to the battery post terminal, and a harness connection part provided on the case, the harness connection part being capable of having a harness connected thereto, in which the battery post terminal includes a holding part held on one of faces of the case, and an insert part provided in a region from the holding part along a face adjacent to the one of the faces of the case, the battery post terminal contacts the case via at least two faces, the two faces including the one of the faces and the face adjacent to the one of the faces, and the case includes a fitting part, the fitting part being adapted to fit around the insert part by accommodating the insert part.
    Type: Grant
    Filed: September 24, 2021
    Date of Patent: April 30, 2024
    Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA AUTOMOTIVE SYSTEMS INC., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Jun Iwasaki, Ryosuke Takahashi, Kazuya Kato, Keita Saji, Ryusuke Kakoi
  • Publication number: 20240130804
    Abstract: A medical device includes an extracorporeal unit including a power transmitting unit that transmits electric power from outside of a living body into the living body in a non-contact manner, and a medical instrument embedded in the living body. The medical instrument includes a power receiving unit that receives the electric power transmitted from the power transmitting unit, a soft portion through which an injection needle is inserted, and a plurality of light emitting units that are provided along an outer edge of the soft portion and are each configured to emit light using the electric power received by the power receiving unit. A light amount adjusting unit that adjusts a light amount of a light-irradiated region including one or more light-irradiated portions to be projected on a body surface from the plurality of light emitting units.
    Type: Application
    Filed: January 11, 2022
    Publication date: April 25, 2024
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Katsuki SUEMATSU, Takeshi YAGI, Atsushi HIMURA, Kazutaka NARA, Tsunenori ARAI
  • Publication number: 20240134130
    Abstract: A ferrule is formed with an optical fiber insertion hole into which an optical fiber is inserted, and includes a resin composition containing a thermoplastic resin and a filler, wherein a size of coarse particles originated from the filler is 50 ?m or less, or a size of aggregates originated from the filler is 50 ?m or less.
    Type: Application
    Filed: December 13, 2023
    Publication date: April 25, 2024
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Masayoshi TSUKAMOTO, Takahiro MIURA, Masahiro HANDA
  • Patent number: 11964317
    Abstract: A heat pipe structure includes a base block including a rear surface part thermally connectable to a heat generating body and a heat pipe fixed to a front surface part of the base block and including a heat receiving tubular portion disposed along an in-plane direction of the base block. The base block has a longitudinal direction and a width direction and includes a recessed part in which the heat receiving tubular portion is housed and a pair of wall parts projecting along an outer circumferential surface of the heat receiving tubular portion from width direction both sides of the recessed part, and a container of the heat pipe is caulked and fixed by the recessed part and the pair of wall parts and includes a projecting shape part projecting in a direction opposite to a direction of the caulking between distal end portions of the pair of wall parts.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: April 23, 2024
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Chiyoshi Sasaki, Masakazu Isemura, Takahiro Katayama
  • Publication number: 20240128154
    Abstract: Provided is a thermally conductive film-like adhesive capable of sufficiently advancing a curing reaction under milder conditions, capable of effectively suppressing residual voids between the adhesive and a wiring board in a semiconductor package to be obtained when used as a die attach film, and capable of obtaining a semiconductor package excellent in heat releasing property inside the package. In addition, provided are a semiconductor package using the thermally conductive film-like adhesive and a method of producing the same.
    Type: Application
    Filed: December 6, 2023
    Publication date: April 18, 2024
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventor: Minoru MORITA
  • Patent number: 11962120
    Abstract: A semiconductor laser module that can increase output of an optical fiber laser is provided. The semiconductor laser module includes: a mounted-base member having a mounted-base face; a plurality of semiconductor laser elements installed on the mounted-base face of the mounted-base member; a lens that collimates laser light emitted from the semiconductor laser element; a condensing lens that condenses the laser light; and an optical fiber to which the condensed laser light is optically coupled, and further includes: between the condensing lens that condenses the laser light and the lens that collimates laser light emitted from the semiconductor laser element, an aperture that restricts light in a slow axis direction of the laser light.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: April 16, 2024
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yuta Ishige, Etsuji Katayama
  • Patent number: 11958756
    Abstract: An object of the present disclosure is to provide a thin-film-like composite of nanocrystal, as a nanocrystalline material having excellent handling properties, which can overcome the above-mentioned problems of a nanocrystalline material having a powdery form while satisfactorily maintaining the properties of the nanocrystalline material (e.g., excellent catalytic activity). A thin-film-like composite of nanocrystal, characterized in that the thin-film-like composite of nanocrystal includes a thin-film-like connected assembly in which a plurality of nanocrystalline pieces each having a flake-like form and having a main surface and an end surface are connected to each other, the main surfaces of the plurality of nanocrystalline pieces exposed to the outside of the connected assembly are arranged so as to form gaps therebetween, and the connected assembly has a plan view area of 1 mm2 or more.
    Type: Grant
    Filed: September 6, 2019
    Date of Patent: April 16, 2024
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yoshikazu Tsuzuki, Mariko Wakae, Kazuhiko Kurusu
  • Publication number: 20240116808
    Abstract: A colored optical fiber includes a bare optical fiber, a primary layer formed of a first ultraviolet curing resin covering the bare optical fiber and a secondary layer formed of a second ultraviolet curing resin covering the primary layer. An outer diameter of the secondary layer is smaller than or equal to 210 ?m. A Young's modulus of the primary layer is smaller than or equal to 88% with respect to a saturated Young's modulus of the primary layer.
    Type: Application
    Filed: December 12, 2023
    Publication date: April 11, 2024
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kuniaki ISHIZUKI, Minoru KASAHARA, Mitsuhiro IWAYA
  • Publication number: 20240119967
    Abstract: An example thin substrate built-in hard disk drive includes a magnetic disk in a disk shape having a through-hole at the center, a spindle motor inserted into the through-hole of the magnetic disk and co-rotatably supporting the magnetic disk, and a base plate made of an aluminum alloy and supporting the spindle motor. The base plate has a metallographic structure in which a perimeter of a second phase particle having a longest diameter of 10 ?m or more is 3 mm/mm2 or more, and the number of second phase particles having a longest diameter of 500 ?m or more is 0 particles/mm2.
    Type: Application
    Filed: April 20, 2023
    Publication date: April 11, 2024
    Applicants: UACJ Corporation, Furukawa Electric Co., Ltd.
    Inventors: Kotaro KITAWAKI, Hideyuki HATAKEYAMA, Wataru KUMAGAI, Ryo SAKAMOTO
  • Patent number: 11952513
    Abstract: An adhesive composition, containing an epoxy resin (A), an epoxy resin curing agent (B), a polymer component (C) and an inorganic filler (D), in which the inorganic filler (D) satisfies the condition (1) of (an average particle diameter (d50) is 0.1 to 3.5 ?m) and condition (2) of (a ratio of a particle diameter at 90% cumulative distribution frequency (d90) to the average particle diameter (d50) is 5.0 or less), and a proportion of the inorganic filler (D) in a total content of the epoxy resin (A), the epoxy resin curing agent (B), the polymer component (C) and the inorganic filler (D) is 20 to 70% by volume; a film-like adhesive and a production method thereof; and a semiconductor package and a production method thereof.
    Type: Grant
    Filed: June 3, 2021
    Date of Patent: April 9, 2024
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventor: Minoru Morita
  • Publication number: 20240113485
    Abstract: A rotary connector device includes a stator, a rotator, an electrical cable, an electrical connector, and a connector coupling portion. The stator includes a first stator and a second stator. The connector coupling portion is configured to couple the electrical connector to the first stator. The connector coupling portion is configured to support the electrical connector in a cantilever manner with respect to the first stator such that a second surface becomes a free end in a state where the electrical connector is positioned in a first position and where the second stator is detached from the first stator.
    Type: Application
    Filed: December 14, 2023
    Publication date: April 4, 2024
    Applicants: FURUKAWA ELECTRIC CO., LTD., FURUKAWA AUTOMOTIVE SYSTEMS INC.
    Inventors: Satoshi KITAO, Tomohiro KITAMURA, Kenji YOSHIMURA
  • Publication number: 20240106189
    Abstract: A chip on submount includes: a submount including a first surface directed in a first direction; a covering layer mounted on the first surface, extending to intersect the first direction, and including a second surface directed in the first direction; a laser element mounted on the second surface and including: a third surface directed in the first direction; and a light emission unit positioned at an intermediate portion of the laser element along a second direction intersecting the first direction, extending in a third direction intersecting the first direction and second direction, and configured to output laser light in the third direction; and a bonding wire attached onto the third surface and configured to exert a pressing force on the laser element, the pressing force including a component force directed in a direction opposite to the first direction.
    Type: Application
    Filed: December 11, 2023
    Publication date: March 28, 2024
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yasumasa KAWAKITA, Masakazu MIURA, Hirotatsu ISHII, Tetsuya TAKEUCHI
  • Patent number: 11940649
    Abstract: An optical fiber bundle structure includes: plural optical fiber core wires; a crossing preventing member; and a grasping member. Further, the crossing preventing member has slits and the widths of the slits positioned at the respective sides are each equal to or larger than a difference between: a length of one side of a polygon circumscribing the plural optical fiber core wires at a hindmost end portion of the slits at the trailing end; and a length of one side of a polygon circumscribing the plural optical fiber core wires at the leading end.
    Type: Grant
    Filed: September 20, 2021
    Date of Patent: March 26, 2024
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kohei Kawasaki, Ryuichi Sugizaki, Masayoshi Tsukamoto, Masanori Takahashi, Shigehiro Takasaka, Koichi Maeda