Abstract: A battery state detection device including a battery post terminal, a case accommodating a circuit board including a current sensing circuit that senses a current by being electrically connected to the battery post terminal, and a harness connection part provided on the case, the harness connection part being capable of having a harness connected thereto, in which the battery post terminal includes a holding part held on one of faces of the case, and an insert part provided in a region from the holding part along a face adjacent to the one of the faces of the case, the battery post terminal contacts the case via at least two faces, the two faces including the one of the faces and the face adjacent to the one of the faces, and the case includes a fitting part, the fitting part being adapted to fit around the insert part by accommodating the insert part.

Abstract: A medical device includes an extracorporeal unit including a power transmitting unit that transmits electric power from outside of a living body into the living body in a non-contact manner, and a medical instrument embedded in the living body. The medical instrument includes a power receiving unit that receives the electric power transmitted from the power transmitting unit, a soft portion through which an injection needle is inserted, and a plurality of light emitting units that are provided along an outer edge of the soft portion and are each configured to emit light using the electric power received by the power receiving unit. A light amount adjusting unit that adjusts a light amount of a light-irradiated region including one or more light-irradiated portions to be projected on a body surface from the plurality of light emitting units.

Abstract: A ferrule is formed with an optical fiber insertion hole into which an optical fiber is inserted, and includes a resin composition containing a thermoplastic resin and a filler, wherein a size of coarse particles originated from the filler is 50 ?m or less, or a size of aggregates originated from the filler is 50 ?m or less.

Abstract: A heat pipe structure includes a base block including a rear surface part thermally connectable to a heat generating body and a heat pipe fixed to a front surface part of the base block and including a heat receiving tubular portion disposed along an in-plane direction of the base block. The base block has a longitudinal direction and a width direction and includes a recessed part in which the heat receiving tubular portion is housed and a pair of wall parts projecting along an outer circumferential surface of the heat receiving tubular portion from width direction both sides of the recessed part, and a container of the heat pipe is caulked and fixed by the recessed part and the pair of wall parts and includes a projecting shape part projecting in a direction opposite to a direction of the caulking between distal end portions of the pair of wall parts.

Abstract: Provided is a thermally conductive film-like adhesive capable of sufficiently advancing a curing reaction under milder conditions, capable of effectively suppressing residual voids between the adhesive and a wiring board in a semiconductor package to be obtained when used as a die attach film, and capable of obtaining a semiconductor package excellent in heat releasing property inside the package. In addition, provided are a semiconductor package using the thermally conductive film-like adhesive and a method of producing the same.

Abstract: An object of the present disclosure is to provide a thin-film-like composite of nanocrystal, as a nanocrystalline material having excellent handling properties, which can overcome the above-mentioned problems of a nanocrystalline material having a powdery form while satisfactorily maintaining the properties of the nanocrystalline material (e.g., excellent catalytic activity). A thin-film-like composite of nanocrystal, characterized in that the thin-film-like composite of nanocrystal includes a thin-film-like connected assembly in which a plurality of nanocrystalline pieces each having a flake-like form and having a main surface and an end surface are connected to each other, the main surfaces of the plurality of nanocrystalline pieces exposed to the outside of the connected assembly are arranged so as to form gaps therebetween, and the connected assembly has a plan view area of 1 mm2 or more.

Abstract: A semiconductor laser module that can increase output of an optical fiber laser is provided. The semiconductor laser module includes: a mounted-base member having a mounted-base face; a plurality of semiconductor laser elements installed on the mounted-base face of the mounted-base member; a lens that collimates laser light emitted from the semiconductor laser element; a condensing lens that condenses the laser light; and an optical fiber to which the condensed laser light is optically coupled, and further includes: between the condensing lens that condenses the laser light and the lens that collimates laser light emitted from the semiconductor laser element, an aperture that restricts light in a slow axis direction of the laser light.

Abstract: A colored optical fiber includes a bare optical fiber, a primary layer formed of a first ultraviolet curing resin covering the bare optical fiber and a secondary layer formed of a second ultraviolet curing resin covering the primary layer. An outer diameter of the secondary layer is smaller than or equal to 210 ?m. A Young's modulus of the primary layer is smaller than or equal to 88% with respect to a saturated Young's modulus of the primary layer.

Abstract: An example thin substrate built-in hard disk drive includes a magnetic disk in a disk shape having a through-hole at the center, a spindle motor inserted into the through-hole of the magnetic disk and co-rotatably supporting the magnetic disk, and a base plate made of an aluminum alloy and supporting the spindle motor. The base plate has a metallographic structure in which a perimeter of a second phase particle having a longest diameter of 10 ?m or more is 3 mm/mm2 or more, and the number of second phase particles having a longest diameter of 500 ?m or more is 0 particles/mm2.

Abstract: An adhesive composition, containing an epoxy resin (A), an epoxy resin curing agent (B), a polymer component (C) and an inorganic filler (D), in which the inorganic filler (D) satisfies the condition (1) of (an average particle diameter (d50) is 0.1 to 3.5 ?m) and condition (2) of (a ratio of a particle diameter at 90% cumulative distribution frequency (d90) to the average particle diameter (d50) is 5.0 or less), and a proportion of the inorganic filler (D) in a total content of the epoxy resin (A), the epoxy resin curing agent (B), the polymer component (C) and the inorganic filler (D) is 20 to 70% by volume; a film-like adhesive and a production method thereof; and a semiconductor package and a production method thereof.

Abstract: A rotary connector device includes a stator, a rotator, an electrical cable, an electrical connector, and a connector coupling portion. The stator includes a first stator and a second stator. The connector coupling portion is configured to couple the electrical connector to the first stator. The connector coupling portion is configured to support the electrical connector in a cantilever manner with respect to the first stator such that a second surface becomes a free end in a state where the electrical connector is positioned in a first position and where the second stator is detached from the first stator.

Abstract: A chip on submount includes: a submount including a first surface directed in a first direction; a covering layer mounted on the first surface, extending to intersect the first direction, and including a second surface directed in the first direction; a laser element mounted on the second surface and including: a third surface directed in the first direction; and a light emission unit positioned at an intermediate portion of the laser element along a second direction intersecting the first direction, extending in a third direction intersecting the first direction and second direction, and configured to output laser light in the third direction; and a bonding wire attached onto the third surface and configured to exert a pressing force on the laser element, the pressing force including a component force directed in a direction opposite to the first direction.

Abstract: An optical fiber bundle structure includes: plural optical fiber core wires; a crossing preventing member; and a grasping member. Further, the crossing preventing member has slits and the widths of the slits positioned at the respective sides are each equal to or larger than a difference between: a length of one side of a polygon circumscribing the plural optical fiber core wires at a hindmost end portion of the slits at the trailing end; and a length of one side of a polygon circumscribing the plural optical fiber core wires at the leading end.

Abstract: An access optical node includes an optical signal processing unit that transmits a received optical signal to a destination node. The optical signal processing unit includes a path switching unit that switches between a first path for transmitting the received optical signal to the destination node as it is as an optical signal, and a second path for transmitting the received optical signal to an electric signal processing unit and transmitting the optical signal processed by the electric signal processing unit to the destination node.

Abstract: The present invention intends to improve accuracy of screening an optical fiber. A screening apparatus for an optical fiber according to the present invention comprising: a feeding unit that feeds out an optical fiber; a tension application unit that applies a tension to the optical fiber fed out from the feeding unit; and a winding unit that winds the optical fiber to which the tension is applied by the tension application unit; wherein the tension application unit includes a first pulley, a second pulley, a first capstan, and a second capstan, a diameter of the first pulley is smaller than a diameter of the second pulley, or the diameter of the first capstan is smaller than a diameter of the second capstan.

Abstract: A lead block includes a lead block body and a plurality of bus bars. The plurality of bus bars include a plurality of connection pins and a plurality of conductor connecting portions. At least one of the plurality of conductor connecting portions includes an exposed surface and a connection projection. The connection projection protrudes from the exposed surface in a perpendicular direction and is configured to be connected to a conductor of an electrical cable. The connection projection is disposed in a first region with respect to the exposed surface in the perpendicular direction. The lead block body includes a cable-facing surface provided facing the electrical cable in a state where the connection projection is connected to the conductor of the electrical cable. The cable-facing surface is offset in the perpendicular direction from the exposed surface and is disposed in the first region with respect to the exposed surface.

Abstract: A heat sink includes: a container having a cavity inside and a first surface and a second surface opposite the first surface; a working fluid encapsulated in the cavity; and a steam flow path in the cavity where the working fluid in a gas phase flows, the first surface having a flat part and a protruding part projecting from the flat part in an external direction, causing the container to have a flat portion and a protruding portion projecting from the flat portion in the external direction, an inner space of the protruding portion of the container being in communication with an inner space of the flat portion, causing the cavity to be formed, and a first heat radiating fin being provided on an exterior of the flat part of the first surface and a second heat radiating fin being provided on an exterior of the second surface.

Abstract: An optical power transmission apparatus includes: a light emitting unit including a first optical gain generating means and a first light reflecting means; an optical fiber; a second light reflecting means; and a light receiving means. Further, the second light reflecting means is arranged nearer to the light receiving means than the optical fiber is, a first laser resonator is formed, between the first light reflecting means and the second light reflecting means, by optical connection between the first optical gain generating means and the optical fiber, and first laser light generated by the first laser resonator is configured to be incident on the light receiving means.

Abstract: A reinforcing sleeve for collectively reinforcing spliced portions of a plurality of optical fiber core wires disposed side by side includes a heat-shrinkable tube, a heat-meltable member, a tension member, and so on. The tension member and the heat-meltable member are inserted into the heat-shrinkable member. A thick portion is provided at a substantially center portion of a width direction of the heat-meltable member. Thus, on a cross section perpendicular to a longitudinal direction of the heat-meltable member, an amount of the heat-meltable member at proximity of the center portion of the width direction of the heat-meltable member is greater than an amount of the heat-meltable member at proximity of the end portions of the width direction of the heat-meltable member. This forms a flow of the heat-meltable member from the center portion toward the end portions in the width direction at the time of melting the heat-meltable member.

Abstract: This magnetic disk device is a 3.5-inch magnetic disk device equipped with magnetic disks formed from an aluminum alloy substrate. The magnetic disks arranged in a stacked manner have a thickness Td of 0.3 mm to 0.6 mm, the number N of magnetic disks involved is 10 to 16, and spacers disposed between the magnetic disks have an outside diameter 2 Rso of 35 mm to 65 mm. The outside diameter 2 Rso (mm) of the spacers satisfies 2 Rso??60 Td+70 and 2 Rso??0.5 N2?+16.5 N?73.