Patents Assigned to Fusion Semiconductor Systems
  • Patent number: 4548688
    Abstract: Photoresist is hardened by exposing it to UV radiation while subjecting it to elevated temperatures upon an increase in the degree of polymerization due to exposure to the radiation. The temperature of the photoresist can be controlled by a thermal chuck which contains a thermal ballast of heat conducting material.
    Type: Grant
    Filed: May 23, 1983
    Date of Patent: October 22, 1985
    Assignee: Fusion Semiconductor Systems
    Inventor: John C. Matthews