Abstract: Laser ablation devices that utilize beam profiling assemblies to clean and process surfaces are described herein. A method includes directing a laser beam in a geometrical pattern at an arcuate surface of a cylindrical target, blocking a portion of the laser beam to prevent a portion of the geometrical pattern from contacting the cylindrical target, and rotating the cylindrical target as the laser beam contacts the arcuate surface so as to ablate the cylindrical target.

Abstract: Systems and methods for ablating or processing a surface using a laser beam are provided. A method includes directing a laser beam at a surface to form a contact area. The method also includes moving the contact area to form a contact curve. The method includes tuning a wavelength and a power of the laser beam to process a material and/or ablate a coating. The wavelength and the power may be further tuned to not damage the surface beneath the coating. Moving the contact area may include forming a second contact curve by superimposing, at a same time, the second contact curve on the contact curve. A system includes a laser and a directing arrangement configured to direct a laser beam from the laser at a surface to form a contact area. A non-transitory processor-readable medium having instructions stored thereon is provided.