Patents Assigned to G&CS CO., LTD.
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Patent number: 9117401Abstract: Disclosed is an organic light emitting diode display, including a first substrate including an organic light emitting diode and a driving circuit part for driving the light emitting diode, a second substrate facing the first substrate and covering the light emitting diode and the driving circuit part, a connection unit connected to the driving circuit part and extending from the first substrate along a rear side thereof, an electronic device disposed between the connection unit and the first substrate and transmitting a signal to the driving circuit part via the connection unit, and an electromagnetic wave-shielding sheet disposed on one side of the first substrate to directly face the electronic device and including a first conductive material layer, a buffer layer formed on one side of the first conductive material layer, and a first adhesive layer formed on the other side of the first conductive material layer.Type: GrantFiled: June 4, 2013Date of Patent: August 25, 2015Assignee: G&CS CO., LTDInventors: Suk-Hong Choi, Sang-Hee Park
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Patent number: 8939595Abstract: This invention relates to a backlight assembly having improved heat dissipation performance and a simplified structure and to a display device including the same. The backlight assembly includes a light source unit for generating light, a housing for accommodating the light source unit and having an aperture, a middle frame coupled to the housing and receiving the light source unit, and an LED fixing frame which is adjacent to the light source unit and is coupled to the housing and at least a part of which is exposed through the aperture.Type: GrantFiled: January 28, 2014Date of Patent: January 27, 2015Assignee: G&CS Co., LtdInventors: Suk-Hong Choi, Sang-Hee Park
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Patent number: 8784695Abstract: Disclosed herein is a method of manufacturing a nanocomposite using expanded graphite. The method is characterized in that monomers are formed into a polymer between the plate-shaped layers of the expanded graphite, and the polymer is intercalated therebetween, so that the plate-shaped layers of the expanded graphite are completely exfoliated or are formed into graphene, with the result that the expanded graphite is completely dispersed in a polymer matrix. The nanocomposite manufactured by this method has excellent electrical conductivity and thermal conductivity because the expanded graphite is uniformly dispersed in this nanocomposite.Type: GrantFiled: June 30, 2011Date of Patent: July 22, 2014Assignee: G&CS Co., Ltd.Inventors: Suk-Hong Choi, Sang-Hee Park
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Publication number: 20140146524Abstract: This invention relates to a backlight assembly having improved heat dissipation performance and a simplified structure and to a display device including the same. The backlight assembly includes a light source unit for generating light, a housing for accommodating the light source unit and having an aperture, a middle frame coupled to the housing and receiving the light source unit, and an LED fixing frame which is adjacent to the light source unit and is coupled to the housing and at least a part of which is exposed through the aperture.Type: ApplicationFiled: January 28, 2014Publication date: May 29, 2014Applicant: G&CS CO., LTDInventors: Suk-Hong CHOI, Sang-Hee PARK
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Patent number: 8646931Abstract: This invention relates to a backlight assembly having improved heat dissipation performance and a simplified structure and to a display device including the same. The backlight assembly includes a light source unit for generating light, a housing for accommodating the light source unit and having an aperture, a middle frame coupled to the housing and receiving the light source unit, and an LED fixing frame which is adjacent to the light source unit and is coupled to the housing and at least a part of which is exposed through the aperture.Type: GrantFiled: October 19, 2012Date of Patent: February 11, 2014Assignee: G&CS Co., LtdInventors: Suk-Hong Choi, Sang-Hee Park
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Publication number: 20130323499Abstract: Disclosed is an organic light emitting diode display, including a first substrate including an organic light emitting diode and a driving circuit part for driving the light emitting diode, a second substrate facing the first substrate and covering the light emitting diode and the driving circuit part, a connection unit connected to the driving circuit part and extending from the first substrate along a rear side thereof, an electronic device disposed between the connection unit and the first substrate and transmitting a signal to the driving circuit part via the connection unit, and an electromagnetic wave-shielding sheet disposed on one side of the first substrate to directly face the electronic device and including a first conductive material layer, a buffer layer formed on one side of the first conductive material layer, and a first adhesive layer formed on the other side of the first conductive material layer.Type: ApplicationFiled: June 5, 2013Publication date: December 5, 2013Applicant: G&CS CO., LTDInventors: Suk-Hong CHOI, Sang-Hee PARK
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Publication number: 20130320851Abstract: Disclosed is an organic light emitting diode display, including a first substrate including an organic light emitting diode and a driving circuit part for driving the light emitting diode, a second substrate facing the first substrate and covering the light emitting diode and the driving circuit part, a connection unit connected to the driving circuit part and extending from the first substrate along a rear side thereof, an electronic device disposed between the connection unit and the first substrate and transmitting a signal to the driving circuit part via the connection unit, and an electromagnetic wave-shielding sheet disposed on one side of the first substrate to directly face the electronic device and including a first conductive material layer, a buffer layer formed on one side of the first conductive material layer, and a first adhesive layer formed on the other side of the first conductive material layer.Type: ApplicationFiled: June 4, 2013Publication date: December 5, 2013Applicant: G&CS CO., LTDInventors: Suk-Hong CHOI, Sang-Hee PARK
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Patent number: 8563970Abstract: Disclosed is an organic light emitting diode display, including a first substrate including an organic light emitting diode and a driving circuit part for driving the light emitting diode, a second substrate facing the first substrate and covering the light emitting diode and the driving circuit part, a connection unit connected to the driving circuit part and extending from the first substrate along a rear side thereof, an electronic device disposed between the connection unit and the first substrate and transmitting a signal to the driving circuit part via the connection unit, and an electromagnetic wave-shielding sheet disposed on one side of the first substrate to directly face the electronic device and including a first conductive material layer, a buffer layer formed on one side of the first conductive material layer to prevent the first substrate from breaking, and a first adhesive layer formed on the other side of the first conductive material layer.Type: GrantFiled: October 20, 2012Date of Patent: October 22, 2013Assignee: G&CS Co., LtdInventors: Suk-Hong Choi, Sang-Hee Park
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Publication number: 20130193415Abstract: Disclosed is an organic light emitting diode display, including a first substrate including an organic light emitting diode and a driving circuit part for driving the light emitting diode, a second substrate facing the first substrate and covering the light emitting diode and the driving circuit part, a connection unit connected to the driving circuit part and extending from the first substrate along a rear side thereof, an electronic device disposed between the connection unit and the first substrate and transmitting a signal to the driving circuit part via the connection unit, and an electromagnetic wave-shielding sheet disposed on one side of the first substrate to directly face the electronic device and including a first conductive material layer, a buffer layer formed on one side of the first conductive material layer to prevent the first substrate from breaking, and a first adhesive layer formed on the other side of the first conductive material layer.Type: ApplicationFiled: October 20, 2012Publication date: August 1, 2013Applicant: G&CS CO., LTDInventor: G&CS Co., Ltd.
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Publication number: 20130182412Abstract: This invention relates to a backlight assembly having improved heat dissipation performance and a simplified structure and to a display device including the same. The backlight assembly includes a light source unit for generating light, a housing for accommodating the light source unit and having an aperture, a middle frame coupled to the housing and receiving the light source unit, and an LED fixing frame which is adjacent to the light source unit and is coupled to the housing and at least a part of which is exposed through the aperture.Type: ApplicationFiled: October 19, 2012Publication date: July 18, 2013Applicant: G&CS CO., LTDInventor: G&CS CO., LTD
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Publication number: 20130001462Abstract: Disclosed herein is a method of manufacturing a nanocomposite using expanded graphite. The method is characterized in that monomers are formed into a polymer between the plate-shaped layers of the expanded graphite, and the polymer is intercalated therebetween, so that the plate-shaped layers of the expanded graphite are completely exfoliated or are formed into graphene, with the result that the expanded graphite is completely dispersed in a polymer matrix. The nanocomposite manufactured by this method has excellent electrical conductivity and thermal conductivity because the expanded graphite is uniformly dispersed in this nanocomposite.Type: ApplicationFiled: June 30, 2011Publication date: January 3, 2013Applicant: G&CS CO., LTD.Inventors: Suk-Hong CHOI, Sang-Hee PARK
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Publication number: 20120302668Abstract: Disclosed herein is a semiconductor sealing material composition, including: 9.0˜13 wt % of an epoxy resin; 6˜7 wt % of a hardener; 0.2˜0.3 wt % of a curing catalyst; 0.60˜0.68 wt % of at least one additive selected from the group consisting of a coupling agent, a release agent and a coloring agent; and 79˜84 wt % of a filler, wherein the filler is nano-graphene plate powder. The semiconductor sealing material composition has excellent crack resistance at a high temperature of 270° C. or more and has high thermal conductivity and excellent flame retardancy.Type: ApplicationFiled: May 25, 2012Publication date: November 29, 2012Applicant: G&CS CO., LTD.Inventors: Suk-Hong CHOI, Sang-Hee PARK