Patents Assigned to GA-TEK Inc. (dba Gould Electronics Inc.)
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Publication number: 20020146556Abstract: A resistor foil comprised of a layer of copper foil and a coating of an organic molecular semiconductor material on one side of the copper foil.Type: ApplicationFiled: April 4, 2001Publication date: October 10, 2002Applicant: GA-TEK Inc. (dba Gould Electronics Inc.)Inventors: Joel W. Pankow, Michael A. Centanni
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Publication number: 20020119342Abstract: A component for use in manufacturing articles such as printed circuit boards, the component comprising:Type: ApplicationFiled: February 23, 2001Publication date: August 29, 2002Applicant: GA-TEK Inc. (dba Gould Electronics Inc.)Inventor: R. Richard Steiner
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Publication number: 20020071637Abstract: A package for a fiber optic device or fiber optic component having at least one optical fiber extending therefrom. The package is comprised of a support substrate for supporting the optical device or optic component, the support substrate having at least one optical fiber extending therefrom. A housing surrounds the substrate and has an opening at one end. At least one optical fiber extends through the opening. A layer of metal seals the opening of each end of the tube and the glass fiber cladding where the optical fiber extends through the layer of metal.Type: ApplicationFiled: December 11, 2000Publication date: June 13, 2002Applicant: GA-TEK Inc. (dba Gould Electronics Inc.)Inventors: Michael A. Centanni, Mark Kusner
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Publication number: 20020050400Abstract: A component for use in forming a multi-layer printed circuit comprised of a film substrate formed of a first polymeric material. At least one layer of a flash metal is applied to a first side of the film substrate, and at least one layer of copper is applied on the layer of flash metal. A discrete area of a resistive material is disposed on a second side of the film substrate.Type: ApplicationFiled: April 5, 2001Publication date: May 2, 2002Applicant: GA-TEK Inc. (dba Gould Electronics Inc.)Inventors: Mark Kusner, Michael A. Centanni
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Publication number: 20020047773Abstract: A resistor foil, comprised of a copper layer having a first side and a second side. A tiecoat metal layer having a thickness of between 5 Å and 70 Å is disposed on the first side of the copper layer. A first layer of a first resistor metal having a thickness of between 100 Å and 500 Å is disposed on the tiecoat metal layer, and a second layer of a second resistor metal having a thickness of between 100 Å and 500 Å is disposed on the first layer of the first resistor metal. The first resistor metal has a resistance different from the second resistor metal.Type: ApplicationFiled: August 2, 2001Publication date: April 25, 2002Applicant: GA-TEK Inc. (dba Gould Electronics Inc.)Inventors: Jiangtao Wang, Michael A. Centanni, Sidney J. Clouser
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Publication number: 20020020549Abstract: A component for use in manufacturing printed circuits that in a finished printed circuit constitutes a functional element. The component is comprised of a film substrate formed of a first polymeric material having a first side and a second side. At least one layer of a tiecoat metal is applied to the first side of the film substrate. At least one layer of copper on the at least one layer of a tiecoat metal, the layer of copper having an essentially uncontaminated exposed surface facing away from the at least one layer of tiecoat metal. A plurality of spaced apart, adhesion promoting areas of a tiecoat metal are provided on the second side of the film substrate defining regions of exposed polymeric material on the second side of the film substrate.Type: ApplicationFiled: April 5, 2001Publication date: February 21, 2002Applicant: GA-TEK Inc. (dba Gould Electronics Inc.)Inventors: Michael A. Centanni, Mark Kusner
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Publication number: 20020021204Abstract: A component for use in forming a multi-layer printed circuit comprised of a film substrate formed of a first polymeric material. At least one layer of a flash metal is applied to a first side of the film substrate, and at least one layer of copper is applied on the layer of flash metal. A discrete area of an organic molecular semiconductor material is disposed on a second side of the film substrate.Type: ApplicationFiled: March 12, 2001Publication date: February 21, 2002Applicant: GA-TEK Inc. (dba Gould Electronics Inc.)Inventors: Joel Pankow, Michael A. Centanni, Mark Kusner
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Publication number: 20020020553Abstract: A component for use in forming a multi-layer printed circuit comprised of a film substrate formed of a first polymeric material. At least one layer of a flash metal is applied to a first side of the film substrate, and at least one layer of copper is applied on the layer of flash metal. A discrete area of a resistive material is disposed on a second side of the film substrate.Type: ApplicationFiled: April 5, 2001Publication date: February 21, 2002Applicant: GA-TEK Inc. (dba Gould Electronics Inc.)Inventors: Mark Kusner, Michael A. Centanni
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Patent number: 6224951Abstract: Method of forming a flexible circuit laminate for use in the production of flexible circuits, comprising the steps of electrodepositing a continuous layer of copper on a first side of a generally continuous strip of polyimide having a layer of metal on the first side, modifying a second side of the polyimide strip to increase the surface energy thereof, applying a preformed adhesive film on the second side of the generally continuous strip of polyimide, the adhesive strip being formed of a substantially uncured polymeric material, and curing the adhesive film wherein at least the outmost layer of the adhesive film is only partially cured.Type: GrantFiled: June 12, 2000Date of Patent: May 1, 2001Assignee: GA-TEK Inc. (dba Gould Electronics Inc.)Inventors: Michael A. Centanni, Mark Kusner