Abstract: A metal forming head (113) is disclosed which includes a die (124) with a stamping portion (130), and a die holder (126) with a hole (136) therethrough. At least part of the stamping portion (130) of the die (124) is receivable through the hole (136) of the die holder (126). A bottom surface (144) of the die holder (126) which faces away from the die (124) is being adapted to abut a major surface (38a) of a sheet of metal (36). The die (124) is movable relative to an abutment part (138) of the die holder (126) to form the sheet of metal (36).

Abstract: A holder (13, 13a, 13b, 13c, 13d) for holding a sheet of metal (36) is disclosed which includes a base (40) for engaging with part of a first major surface (38b) of the sheet of metal (36) and a cover (50) for engaging with part of a second major surface (38a) of the sheet of metal (36). The base (40) and the cover (50) are engageable with each other to hold the sheet of metal (36) therebetween.

Abstract: This present disclosure combines a data storage drive, such as flash-based USB drive or a SSD drive with redundant, multiple levels of security protection. In an embodiment, the security protection includes password protection, fingerprint recognition, and real-time data encryption. The biometric sensors may be integrated into the storage device without substantially adding weight and size. Further, the secured device may have a built-in internal power source to self-sustain the protection without having to connect to a host device or an external power source. Thus, it is possible to remotely track the location of the secured device and disable or enable the security protection or manage the security setups.

Abstract: High-density memory assemblies and related methods for manufacturing and using such memory assemblies are included in the present disclosure. According to one exemplary embodiment, a high-density memory assembly includes stacked first and second panels. The first and second panels each comprise a substrate and at least one chip disposed on the substrate. The first and second panels each further comprise connecting tabs extending from the substrates of the first and second panels.

Abstract: This disclosure pertains to a flexible circuit module and related methods of manufacturing and applications for such a flexible circuit module. In one exemplary embodiment, the flexible circuit module comprises a flexible substrate, at least one flexible chip element, and a flexible top layer disposed over the flexible substrate and the flexible chip element. According to an aspect, a flexible circuit module is used in flexible electronic devices. According to another aspect, a flexible circuit module is attached to the inner surface of an electronic device and connected to the device main board. According to another aspect, a flexible circuit module is used in the place of a current PCB in a PCBA. According to another aspect, a flexible circuit module is rolled up and used inside an electronic device. According to another aspect, a flexible circuit module is molded.