Abstract: This invention is for a wedge for bonding an elongated conductor, such as a wire, to a bond pad on a microelectronic device. A wire passes through an aperture in the wedge into a pocket or an open notch. A sidewall on each side of the pocket or open notch prevents the wire from moving sideways. The wire passes over a foot that extends below the sidewalls by an amount sufficient to prevent the sidewalls from contacting the surface of the microelectronic device during bonding. The wire is bonded to a bond pad on a microelectronic device by feeding the wire through the aperture of the wedge and over the foot, pressing said wire between the foot and the bond pad, and applying bonding energy, such as ultrasonic energy, to the wire.

Abstract: A workpiece holding assembly for a machine apparatus is provided having an adjustable rail clamp attached to a rail which is secured to a work table of the apparatus. The rail is provided with front and back side referencing surfaces and the rail clamp includes an inner channel having an inside wall which comprises a reference surface for engagement with either the front or back side surfaces of the rail. The rail clamp includes a rail fastener means which functions to create a downward and inward force component which securely draws the inside wall against the rail reference surfaces to ensure a solid rigid connection. The rail clamp further is provided with a leveler connector means providing a quick release with a leveler head. The leveler head is provided with a connector portion that forms a corresponding connection with the leveler connector means.