Abstract: A method and apparatus are disclosed for placing solder balls 320 on electronic pads 910 or 1010 on a component 900 or substrate 1000, such as for a ball grid array (BGA) applicator 100. The solder balls 320 are held to openings 202 in a foil 130 against a second layer 350 by a holding force, whereby the second layer is of a porous material and laminated to the foil 130. One such holding force can be a vacuum force 222 applied to the solder balls 320 through the openings 202 in a foil 130. After locating the solder balls 320 at electronic pads 910 or 1010 on a component 900 or substrate 1000, by removing the holding force 222, the solder balls 320 are released and placed on the electronic pads 910, 1010. Optionally, a plurality of pins may provide a releasing and/or placing force.

Abstract: A method and apparatus are disclosed for releasing solder spheres during the locating and/or placing of a pattern of conductive preforms 32 on a respective pattern of electronic pads 14 on a receiving substrate 12 for such uses as a Ball Grid Array component 24. The release mechanisms are of either compliant mechanical 11, vibratory 90, air pressure 100 or 120, or sound pressure waves 140. Additionally, a method and apparatus is disclosed for the electrical inspection for presence or absence of the complete pattern of conductive preforms.

Abstract: A method and apparatus are disclosed for a flexible support system using elongated support members to support a face of a module. The flexible support member(s) are arranged through a primary member with apertures, where the elongated support members are automatically returned to a home position by a self restoring mechanism, the position of the elongated support members are adjusted by the contacting forces applied by bringing the module and the flexible support apparatus together, then applying a clamping force to secure the elongated support members where the elongated support members can sustain the loads applied onto a module during an assembly process.