Abstract: A multi-chip light emitting diode (LED) package includes red, green, and blue LED chips directly bonded on a silicon substrate for a controlling integrated circuit (IC), and a carrier to which the controlling IC is attached. The multi-chip LED package has reduced volume and enhanced heat-radiating power. The chips are directly driven and controlled by the controlling IC, so that the carrier is not necessarily a printed circuit board but may be made of any solid material.

Abstract: A support member for packaging a light-emitting element is provided at a top with a cup-shaped recess, which has a flat bearing bottom surface and a curved inner wall surface for stably bearing the light-emitting element therein. The support member is also provided with a plurality of venting and heat-dissipating holes irregularly distributed around the cup-shaped recess. A temperature difference between any two of these venting and heat-dissipating holes produces a minor turbulent airflow to naturally and quickly dissipate heat produced by the light-emitting element, so that a temperature rise of the light-emitting element is effectively reduced to maintain normal operation of the light-emitting element without decreasing the usable life and reliability thereof.