Abstract: A flexible circuit board and a method of fabricating the same are provided. The flexible circuit board includes a flexible substrate, in which the flexible substrate includes a first portion, two second portions, two third portions, two first bending portion and two second bending portions. The flexible circuit board includes first connecting circuit layers extending from an upper surface of the first portion through the first portions to upper surfaces of the second portions, second connecting circuit layers extending from lower surfaces of the second portions through the third portions to lower surfaces of the third portions, first circuit layers disposed on the upper surface of the first portion and second circuit layers disposed on the lower surfaces of the third portions. Therefore, the flexible circuit board can achieve no-via-hole and high density for circuit board.

Abstract: A packaging substrate includes a circuit board defining a through groove. The circuit board includes an insulating body and a first wiring layer formed on the insulating body. A colloid is formed in the through groove. The packaging substrate further includes at least one lead. Each lead includes a lead body and a lead terminal connected to an end of the lead body. The lead terminal protrudes from the colloid. Another end of the lead body away from the lead terminal is electrically connected to the circuit board, and the colloid covering the lead body.

Abstract: A transducer wiring board includes a movable unit, a fixing unit, plural suspensions, plural X-axis actuators, and plural Y-axis actuators. The movable unit includes a first movable section and plural second movable sections. The second movable sections are disposed on two sides of the first movable section along a Y axial direction. The fixing unit is spaced apart from the movable unit and includes plural fixing sections. The fixing sections are disposed on another two sides of the first movable section along an X axial direction. Each suspension connects the movable unit and the fixing unit. Each X-axis actuator connects one of the fixing sections and the first movable section. Each Y-axis actuator connects the first movable section and one of the second movable section.

Abstract: A circuit board and a method of fabricating the same are provided. The circuit board has a connecting part and a bending part, and this circuit board includes a plurality of flexible circuit substrates electrically connected to each other and an elastic material. The flexible circuit substrate with a corrugated region is located on the bending part and is disposed on another flexible circuit substrate. A spacing is formed between those two flexible circuit substrates, while this spacing is located at the bending part. The elastic material is located at one of the flexible circuit substrates and located inside the spacing, and the elastic material is located inside a trough of the corrugated region.

Abstract: A radio frequency transmission circuit board has a bending portion, a signal transmitting portion and a signal receiving portion, and includes a first multilayer structure, a second multilayer structure, a third multilayer structure, a blind hole, a lens and an optical fiber. The blind hole extends from the second multilayer structure to the first multilayer structure. A reflective layer is arranged in the blind hole. The lens is embedded in the first multilayer structure and partially exposed in the blind hole. The optical fiber is embedded in the first multilayer structure and connected to the lens. The bending portion does not include the second multilayer structure and the third multilayer structure. The blind hole and the lens are located in the signal transmitting portion. The optical fiber is located in the bending portion.

Abstract: A provided circuit board includes an embedded capacitor, a substrate, and an insulating layer. The embedded capacitor includes a dielectric layer, a first electrode and a second electrode. The dielectric layer has a first side surface, a second side surface adjacent to the first side surface, a third side surface opposite to the first side surface, and a fourth side surface opposite to the second side surface. The first and second electrodes respectively cover the first and third side surfaces. The substrate surrounds the embedded capacitor and is physically connected to the second and fourth side surfaces. The first electrode is between the first side surface and a sidewall of the substrate. The insulating layer covers the embedded capacitor and the substrate and extends from an upper surface to a lower surface of the substrate along the first electrode and the sidewall of the substrate.

Abstract: A flexible circuit board and a method for fabricating the same are provided. The flexible circuit board includes an insulation substrate with two trenches on its two opposite end surfaces separately. A signal wire is disposed in the insulation substrate, and thus the insulation substrate surrounds the signal wire. Two flexible circuit substrates are separately located on two opposite surfaces of the insulation substrate, and each flexible circuit substrate includes a conductive layer and a power layer. The conductive layer is extended from one surface to end surfaces of the insulation substrate, and then is extended to the trenches along the end surfaces. The power layer is located between the conductive layer and the insulation substrate and is electrically connected to the conductive layer. In each trench, one conductive layer is connected to the other conductive layer, and two conductive layers are electrically connected to each other.

Abstract: A circuit board assembly includes a first circuit board. The first circuit board includes a first substrate, a first circuit structure, a first magnetic layer and a connecting pillar. The first circuit structure is connected to the first substrate. The first magnetic layer is connected to the first circuit structure and makes the first circuit structure be arranged between the first magnetic layer and the first substrate. The first magnetic layer is not electrically connected to the first circuit structure. The connecting pillar is connected to the first circuit structure. The connecting pillar extends in a direction from the first circuit structure toward the first magnetic layer and through the first magnetic layer, and the connecting pillar is electrically connected to the first circuit structure.

Abstract: A flexible circuit board and a method of fabricating the same are provided. The flexible circuit board includes a first dielectric layer, a second dielectric layer disposed on the first dielectric layer, a signal layer disposed within the second dielectric layer, a third dielectric layer disposed on the second dielectric layer, and liquid metal composites. The signal layer includes a trace and a pad. The liquid metal composites are disposed to surround the trace, but not enclose the pad, thereby satisfying requirements of the signal layer for great bending numbers and high frequency signal transmission.

Abstract: A circuit board includes a first multilayered structure, a second multilayered structure, a third multilayered structure, a first adhesive layer, a second adhesive layer and a plurality of hollow portions. The first adhesive layer is disposed between the first multilayered structure and the second multilayered structure. The second adhesive layer is disposed between the second multilayered structure and the third multilayered structure, wherein the second multilayered structure is arranged between the first adhesive layer and the second adhesive layer. The plurality of hollow portions are formed on at least one of the first multilayered structure, the second multilayered structure and the third multilayered structure. When the circuit board is bent, a force is applied on the plurality of hollow portions to make the plurality of hollow portions deform and change a cross-sectional area of each of the plurality of hollow portions.

Abstract: A circuit board with embedded resistors and a method for fabricating the same are provided. The circuit board includes the circuit substrate and the variable resistor region. The variable resistor region includes the first resistor layer, the second resistor layer and the liquid metal material. The first resistor layer is electrically connected to the circuit substrate, and the second resistor layer overlaps the first resistor layer. The liquid metal material is located on and is electrically connected to the first resistor layer. The liquid metal material is spaced from the second resistor layer without any electrical connection under the initial temperature. The liquid metal material is electrically connected to the second resistor layer under the first temperature which is higher than the initial temperature.

Abstract: A method for manufacturing a circuit board is provided, which includes a wiring board. The wiring board includes a first wiring layer, a dielectric layer and a second wiring layer stacked, and conductive pillars. Each conductive pillar connects the first wiring layer and the second wiring layer. A groove is recessed from a side of the dielectric layer facing away from the second wiring layer, and includes first recessed portion and second recessed portions recessed from a sidewall of the first recessed portion. An end surface of each conductive pillar is exposed from the at least two spaced second recessed portions, and a sidewall of each pillar close to the first recessed portion is exposed from the second recessed portion. An one electronic component is received in the first recessed portion, and is connected to the conductive pillars through electrical connecting portions received in the second recessed portions.

Abstract: A circuit board assembly includes an inner circuit substrate, a first outer circuit substrate, a second outer circuit substrate, a heat conducting block, an electronic component, and a reinforcing plate. The first outer circuit substrate and second outer circuit substrate are disposed on surfaces of the inner circuit substrate. The heat conducting block penetrates through the inner circuit substrate and connects to the first outer circuit substrate and the second outer circuit substrate. The heat conducting block made of aluminum nitride. An electronic component at least partially accommodated in the heat conducting block. The reinforcing plate is disposed on a surface of the second outer circuit substrate corresponding to the electronic component and faces away from the electronic component. The present disclosure further provides a method for manufacturing the circuit board assembly.

Abstract: A circuit board includes a circuit substrate. The circuit substrate includes an insulating substrate and an electronic component embedded therein. The insulating substrate defines two first slots. A first phase change material fills in the two first slots and thermally connects to the electronic component. A first wiring layer is formed on a surface of the insulating substrate, the first wiring layer covers the two first slots and thermally connects to the first phase change material. A second wiring layer is formed on another surface of the insulating substrate. The second wiring layer includes a plurality of wiring portions and a wiring slot formed between adjacent wiring portions. The electronic component electrically connects to the second wiring portion. A second phase change material fills in at least one wiring slot and thermally connects a portion of the wiring portions together to form a heat dissipation zone.

Abstract: A circuit board with improved heat dissipation function and a method for manufacturing the circuit board are provided. The circuit board includes a heat dissipation substrate, an insulating layer on the heat dissipation substrate, an electronic component, a base layer on the insulating layer, and a circuit layer on the base layer. The heat dissipation substrate includes a phase change structure and a heat conductive layer wrapping the phase change structure. The heat dissipation substrate defines a first through hole. The insulating layer defines a groove for receiving the electronic component. A second through hole is defined in the circuit layer, the base layer, and the insulating layer. A bottom of the second through hole corresponds to the heat conductive layer. A heat conductive portion is disposed in the second through hole.

Abstract: A buried thermistor includes a lower substrate, an upper substrate, and a number of thermistor stacks. Each thermistor stack includes two resistor subjects. Each resistor subject includes a base layer, a medium layer, a metal layer, a resistor layer, a nanometal layer, and a conductive layer. Applicable material of the resistor layer becomes more diverse by disposing the number of thermistor stacks, and the buried thermistor shows variable thermal sensitivity.

Abstract: A method for manufacturing a photoelectric composite circuit board, includes providing a copper-clad carrier and an intermediate circuit, the copper-clad carrier includes a substrate layer and a bottom copper layer, a first groove is defined on the intermediate circuit. Forming an optical fiber in the first groove. Forming a first accommodating groove and a second accommodating groove at each end the optical fiber. Accommodating a first coupling element in the first accommodating groove. Removing the substrate layer. Removing the bottom copper layer corresponding to the optical fiber, the intermediate circuit on one side of the optical fiber and the bottom copper layer forming a first circuit substrate, the intermediate circuit on another side of the optical fiber and the bottom copper layer forming a second circuit substrate. Electrically connecting a chip to the first circuit substrate, and electrically connecting an electronic component to the second circuit substrate.

Abstract: A circuit board includes a dielectric substrate, a signal line and a pair of ground wires. The dielectric substrate includes a base and an elevated platform protruding from an upper surface of the base. The signal line is conformally disposed on the dielectric substrate and includes a first segment disposed on an upper surface of the elevated platform, a second segment extending on the upper surface of the base, and a third segment disposed on a sidewall of the elevated platform and connecting the first segment and the second segment. The pair of ground wires are disposed on the dielectric substrate and are spaced apart from the signal line. A projection of the second segment of the signal line on the upper surface of the base partly overlaps projections of the pair of ground wires on the upper surface of the base.

Abstract: A method for manufacturing a circuit board includes disposing an electronic component in a recess formed in a first circuit substrate, and bonding a second circuit substrate to the first circuit substrate to form a third circuit substrate with the electronic component embedded. The method includes forming an opening in the third circuit substrate to expose the electronic component and an inner surface of the third circuit substrate. The method includes disposing an insulation case in the opening. The insulation case has a first segment directly contacting the electronic component, a second segment facing the inner surface, an inner wall between the first and second segments, a first chamber surrounded by the first segment and the inner wall, and a second chamber surrounded by the second segment and the inner wall. The method includes adding a heat-exchanging fluid into the first chamber.

Abstract: A circuit board utilizing thermocouples for improved heat dissipation performance from circuit boards includes a heat dissipation module which itself includes a first circuit substrate, a thermocouple, and a second circuit substrate. The first circuit substrate includes a first wiring layer comprising first and second wiring portions. The thermocouple includes a P-type and an N-type semiconductor. The second circuit substrate includes a second wiring layer with a third wiring portion. Conductive members electrically connect the P-type semiconductor with the first wiring portion, connect the P-type semiconductor with the third wiring portion, connect the N-type semiconductor with the second wiring portion, and connect the N-type semiconductor with the third wiring portion, to transfer away heat generated by working elements mounted on the board.