Abstract: Adherent matrix layers such as post-etch and other post-process residues are removed from a substrate by exposing them to a vapor phase solvent to allow penetration of the vapor phase solvent into the adherent matrix layers and condensing the vapor phase solvent into the adherent matrix layers and revaporized to promote fragmentation of the matrix and facilitate removal. Megasonic energy may be transmitted via a transmission member to the adherent matrix through the solvent condensed thereon to loosen fragments and particles. The substrate is typically rotated to improve contact between the megasonic energy transmission member and the condensed solvent and achieve more uniform cleaning. A co-solvent which is soluble in the vapor phase solvent may be added to enhance removal of specific adherent matrix materials.

Abstract: A substrate handling apparatus includes a transfer elevator and a process station disposed inside a load lock chamber. The process station includes a top module, a bottom module, and a seal ring which is disposed between the top module and the bottom module and is movable to open and close the process station. The transfer elevator has an upper station spaced above a lower station. A transfer device having a pair of transfer arms is used to transfer substrates between the transfer elevator and the process station. The transfer arms are movable toward one another to support a substrate and apart from one another to release the substrate. The transfer arms are mounted to rotate between the transfer elevator and the process station. When a substrate is being processed inside the process station, the transfer arms are disposed on opposite sides of the process station.

Abstract: An improved end effector includes an end effector body having a proximal end portion and a distal end portion. A contact member is attached to the top surface of the proximal end portion for supporting a substrate over a contact surface area. The contact member spaces the substrate from the end effector body to reduce the contact area between the end effector and the substrate. The contact member is made of a material with a low thermal conductivity. The reduced contact area and low thermal conductivity serve to decrease heat conduction between the contact member and the substrate so as to reduce a temperature gradient and thermal stresses in the substrate caused by the contact. The end effector body includes a plurality of apertures disposed between the proximal end portion and the distal end portion. At least some of the apertures overlap in position with portions of the substrate to provide open areas between blocked portions of the end effector body which overlap in position with the substrate.