Abstract: A method for forming an epitaxial layer involves depositing a buffer layer on a substrate by a first deposition process, followed by deposition of an epitaxial layer by a second deposition process. By using such a dual process, the first and second deposition processes can be optimized, with respect to performance, growth rate, and cost, for different materials of each layer. A semiconductor heterostructure prepared by a dual deposition process includes a buffer layer formed on a substrate by MOCVD, and an epitaxial layer formed on the buffer layer, the epitaxial layer deposited by hydride vapor-phase deposition.
Type:
Grant
Filed:
April 16, 1999
Date of Patent:
May 20, 2003
Assignees:
GBL Technologies, Inc., Matsushita Electric Industrial Co., Ltd
Inventors:
Glenn S. Solomon, David J. Miller, Tetsuzo Ueda