Abstract: Methods and apparatus for preparing a grinding wheel and performing a grinding operation are provided in accordance with the teachings of the instant invention wherein a single treatment cylinder is employed to profile a grinding wheel. Initially, a circumferential speed relation which is smaller than one (1) is employed between the grinding wheel and treatment cylinder to cause initial profiling to occur in a manner to avoid damage to the binding material. Thereafter, when a desired minimum area of contact is achieved, the circumferential speed relationship is increased to approximately one (1) to achieve a profiling having a desired grinding efficiency. A rough grinding operation may then be commenced. Upon the completion of the rough grinding operation, profiling of the grinding wheel may be again established using a circumferential speed relationship which is small to achieve a fine grinding profile. Thereafter, a fine grinding operation may be performed.