Patents Assigned to Gel Pak L.L.C.
  • Method for deconstructing an integrated circuit package using lapping
    Patent number: 6813828
    Abstract: A method is provided for deconstructing an integrated circuit package comprising: taking an integrated circuit package comprising a lead frame having a plurality of wire bond pads for placing a die into electrical contact with the lead frame, and an encapsulant encapsulating the wire bond pads; and removing the encapsulant to expose the wire bond pads; wherein at least a portion of the encapsulant is removed by a lapping process.
    Type: Grant
    Filed: January 7, 2002
    Date of Patent: November 9, 2004
    Assignee: Gel Pak L.L.C.
    Inventors: Joseph J. Dlugokecki, Gerardo Bagalawig Nazareno, Carmencita I. Robbins, Steven David Swendrowski