Patents Assigned to GEM-SUN Technologies Co., Ltd.
  • Patent number: 8164237
    Abstract: An LED lamp with a flow guide structure guides external air to dissipate heat from the LED lamp includes a lamp base, a heat dissipating body, a heat dissipating plate and an LED module installed in the lamp base, and heat dissipating holes formed on the lamp base. The heat dissipating body includes heat dissipating fins, and a heat dissipating passage defined between any two fins and disposed corresponding to the heat dissipating hole. The LED module is in a thermal contact with the heat dissipating plate. The heat dissipating plate is attached onto the heat dissipating fins and includes openings. A flow guide plate is formed at a lateral edge of each opening and extended from the heat dissipating plate for guiding external air into the heat dissipating passage and out from the heat dissipating hole to expedite a natural convection in the lamp and prevent a thermal aggregation.
    Type: Grant
    Filed: July 29, 2010
    Date of Patent: April 24, 2012
    Assignee: Gem-Sun Technologies Co., Ltd.
    Inventor: Fong-Yuan Wen
  • Patent number: 7972039
    Abstract: A light guiding diffuser used for assembling with a light emitting diode module to form an illuminating light source. The light guiding diffuser includes an elliptical ring-shaped base portion and a convex portion extended from a surface of the base portion and formed a space with the base portion for accommodating the light emitting diode module. The convex portion has a cross section which has a minimum thickness in a center thereof and the thickness of the cross section continuous increases from the center toward the base portion.
    Type: Grant
    Filed: May 4, 2009
    Date of Patent: July 5, 2011
    Assignees: Gem-Sun Technologies Co., Ltd, Stonlite Discrete & Opto Co., Ltd
    Inventor: Fong-Yuan Wen
  • Patent number: 7762845
    Abstract: A thin connector structure includes an upper iron shell, a lower iron shell, a circuit board, a protective layer and a glue layer. The circuit board is interposed between the upper and lower iron shells. Both sides on the inner surface of the lower iron shell are provided with a pin, respectively. Both sides of the circuit board have a fixing hole, respectively. The pins go through the corresponding fixing holes. The protective layer is interposed between the upper iron shell and the circuit board to prevent dissipation of electromagnetic waves. The glue layer is interposed between the lower iron shell and the circuit board for positioning the connector structure.
    Type: Grant
    Filed: May 11, 2009
    Date of Patent: July 27, 2010
    Assignee: GEM-SUN Technologies Co., Ltd.
    Inventors: Kuo-chih Huang, Wen-Tsan Huang