Abstract: A method for manufacturing an integrally formed multi-layer light-emitting device is provided, in which a seat is integrally formed in such a manner that the light-emitting elements can be directly disposed in the chamber. The lens mask is used to seal the light-emitting elements in the chamber of the seat so that some packaging steps can be omitted, and the manufacturing process is simplified. The seat is made of metal having good thermal conductivity instead of plastic materials. The consumption of the package material is reduced, and the heat-dissipation efficiency is increased in the present invention.

Abstract: An LED light tube includes a modularized LED base having a recess, one illumination unit and one bridging unit being fixed in the recess, the illumination unit being constituted by LED dies and the bridging unit being constituted by conductive elements electrically connecting the LED dies; a heat dissipation base for receiving and supporting the modularized LED base thereon; a circuit unit disposed on the dissipation base to locate adjacent to one side of the recess; an optical layer covering the illumination unit and the bridging unit; a protection layer covering the optical layer; and a diffusion shield disposed above the dissipation base and having two peripheral sides formed with downwardly and inwardly bent projections slidably engaging two sliding grooves of the dissipation base, thereby enclosing the LED dies therein such that the diffusion shield is located above and transversely to a light emitting path of the LED dies.

Abstract: A light emitting diode (LED) light tube includes a heat dissipation base having a light emitting side formed with a recess and at least one illumination unit and a bridging unit disposed on a bottom surface of the recess. The illumination unit and the bridging unit are connected electrically relative to each other via wire-bond technique.

Abstract: A method for fabricating an LED light tube includes: fabricating a heat dissipation base having a light emitting side with a recess and a reception chamber; disposing one illumination unit and one bridging unit on the recess, wherein the illumination unit and the bridging unit are constituted by LED dies and conductive elements, respectively; fixing a circuit unit on the light emitting side in such a manner that the circuit is located adjacent to the recess; applying wire-bond technique to connect the LED dies and the conductive elements electrically; forming an optical layer over the LED dies; forming a protection layer on the optical layer; establishing electrical connection among the circuit unit, the conductive elements and the LED dies; installing a power supply source within the reception chamber; and disposing a diffusion shield over the dissipation base and two end caps respectively on two ends of the dissipation base.

Abstract: A Light Emitting Diode (LED) light tube includes a heat dissipation base having a light emitting side formed with a recess and at least one illumination unit and a bridging unit disposed on a bottom surface of the recess. The illumination unit and the bridging unit are connected electrically relative to each other via wire-bond technique. Two circuit units are disposed on the light emitting side of the heat dissipation base respectively located at two opposite sides of the recess.

Abstract: A Light Emitting Diode (LED) light tube includes a substrate having a light emitting side formed with a recess and at least one communication hole extending therethrough and at least one illumination unit disposed at a bottom of the recess. The illumination unit is constituted by a plurality of dies wire-bond together in series connection, thereby forming LED units. An optical layer and a protection layer are disposed to cover the relatively small width of the recess, thereby shielding the illumination unit.

Abstract: An integrated multi-layered illuminating unit and an integrated multi-layered illuminating assembling unit are provided in the disclosure. The illuminating unit provided in the present invention can be adapted to different purposes and locations of use through a flexible number of heat dissipating bases used and adaptable assembling methods, in other words, the present invention provides an illuminating unit which can be assembled into specific forms depending on different applications and purposes. The illuminating unit and can provide various irradiation intensity and rage, wherein the heat dissipating bases are connected and assembled with each other through connecting members with an easy, fast and convenient method, thus the illuminating unit provided is very time and effort saving regarding its production and maintenance.

Abstract: A multi-layer array type LED device is provided, which includes a substrate, an encapsulation body, two lead frames, a plurality of LED dices, and a set of optical lens. The outer circumferential edge and the upper and lower periphery of the substrate are completely encapsulated by the encapsulation body so that the multi-layer array type LED device can be tightly packaged. In the present invention, a fluorescent layer is disposed between an optical grease layer and a silica gel protection layer, and thereby the fluorescent layer is protected, and is capable of preventing moisture from permeating therein. On the other hand, in the present invention, the reflection coefficient of the optical grease layer is at least larger than a certain value so that the probability of the light emitted out of the optical chamber can be increased.

Abstract: An integrally formed multi-layer light-emitting device is provided, which includes a seat, a plurality of light-emitting elements, and two lead frames. The seat is integrally formed in such a manner that the light-emitting elements can fit in the chamber which is formed on the top portion of the central main body. The seat is made of metal, and thereby the seat can effectively absorb heat from the light-emitting elements, and rapidly transmit it to the surrounding environment. Therefore, the packing module is not needed to be used in the present invention so that the consumption of the package material is reduced, and the manufacturing process is simplified.

Abstract: A thin multi-layer LED array engine is provided, which includes a substrate having a phosphor layer and a silica gel protection layer formed thereon. The phosphor layer is disposed on LED dices and makes direct contact with the substrate, and the silica gel protection layer is disposed on the phosphor layer. The LED dices are covered with the phosphor layer, and thereby the phosphor particles in the phosphor layer can be uniformly dispersed around the LED dices, so that the narrow color temperature distribution can be achieved. Furthermore, the phosphor layer makes direct contacts with the substrate, and thereby heat generated in the phosphor layer can be effectively dissipated through the substrate, and thereby the reliability of the optical components can be increased.

Abstract: A method of filling and sealing a fluorescent layer in a slot space defined by two optical lenses and a partition ring is disclosed, in which a slot space is defined by two optical glasses and a partition frame having a partition ring on the inner wall surface. The partition frame is installed with two slots diametrically opposite to each other, and the slot space is evacuated to allow filling of a fluorescent material, and then the two slots are sealed so that the moisture is prevented from permeating into the fluorescent layer, and thus the optical performance can be maintained over a long period.

Abstract: An integrally formed high-efficient multi-layer light-emitting device is provided, which includes a heat dissipation seat, a plurality of light-emitting dies, and a lead frame. The heat dissipation seat includes a chamber having an accommodating space, and a groove having two inclined inner sidewalls is formed around the periphery of a bottom of the chamber, The groove is very fine so that only very small amounts of the phosphor and silicone are used for filling the groove and covering the light-emitting dies, and thereby the material cost and the manufacturing cost are greatly reduced. The light can be reflected out of the chamber so that the brightness and the evenness of the light output will be improved.

Abstract: A multi-layer LED array engine is provided. The multi-layer LED array engine includes a base plate frame, a molded platform, two lead frames, a lighting element, a dome, a protection layer, and a phosphorous layer. The molded platform is disposed on and secured to the base plate frame. The two lead frames are combined with two lead frame grooves of the base plate frame. The lighting element is disposed on a lighting area of the base plate frame. The protection layer is provided on the lighting element, and the phosphorous layer is provided on the protection layer. The dome is secured to the molded platform for covering the molded platform and the lighting element.

Abstract: A package structure of multi-layer array type LED device is disclosed, wherein a peripheral area of a substrate and a surface of lead frame are respectively installed with a convex/concave surface structure. The convex/concave surface structure increases the surface roughness of the peripheral area of the substrate and the surface of the lead frame, so a liquid package material can be filled in cavities and concave parts; thus a package member formed through the package material being solidified can be firmly combined with the substrate and the lead frame as one piece. In addition, the bottom of a lens is provided with a binder for increasing the sealing level of the lens. Moreover, the present invention adopted a soldering paste added with material having good heat conductivity, so heat generated by LED dices can be rapidly dissipated to the exterior.

Abstract: A method for packaging an airtight multi-layer array type LED is disclosed. The method includes: integrally forming a metal substrate with an airtight metal frame surrounding an accommodating space; forming a light outlet platform surrounding a light outlet opening on a bottom of the accommodating space; forming two horizontal sealing through holes in the airtight metal frame, wherein each sealing through hole has one lead frame inserted therethrough, and all interstitial space in the two horizontal sealing through holes is completely sealed with a sealing material; disposing the optical units and optical components in the accommodating space; sequentially forming a dice protection layer, a fluorescent layer, and a silicone layer on the LED dices; and installing an optical glass cover on the top surface of the airtight metal frame to seal the packaging structure of the present invention.

Abstract: An airtight multi-layer array type LED is disclosed, which comprises a metal substrate with an airtight metal frame formed thereon, and the metal substrate is integrally formed with the airtight metal frame, and an airtight sealing frame slot is formed around the upper surface of the airtight metal frame, the airtight metal frame is installed with two sets of sealing through hole pairs accommodating the lead frames. The interior of the airtight metal frame can be installed with packaging materials or optical components. The sealing holes are sealed with a glass or ceramic material. A fluorescent layer is formed on a silica gel layer, wherein the fluorescent layer can also be installed inside a silica glass package cover. The silica glass package cover is installed on the top surface of the airtight metal frame, and the silica glass package cover is engaged and sealed to a sealing rack.

Abstract: An optical lens having a fluorescent layer is provided. The optical lens is adapted for being employed in an LED packaging structure. The optical lens includes a substrate, at least one lens body, a lens shade, and a packaging member. The substrate is positioned at a bottommost side of the packaging structure, and the lens shade is positioned at a topmost side of the packaging structure. The lens body is positioned over the substrate and beneath the lens shade. A plurality of light emitting units are disposed on the substrate. The packaging member is adapted for packaging the substrate and the lens shade. The lens body is secured by the packing member so as to be positioned over the light emitting units. The lens body includes a fluorescent layer buried inside the lens body, and the lens body is positioned apart from the light emitting units for a certain distance.

Abstract: An optical lens assembly having a fluorescent layer is disclosed, which includes a partition frame with a partition ring protruding inwardly from an inner wall surface of the partition frame, two optical lenses, and a fluorescent layer, wherein a slot space is defined by the two optical lenses and the partition ring of the partition frame, and the fluorescent layer is accommodated within the slot space. The top optical lens can be a flat slab lens, or a convex lens. When the optical lens assembly having a fluorescent layer is used in the optical device, the moisture can be prevented from entering the fluorescent layer, and thus the optical performance of the fluorescent layer can be maintained over a long period.

Abstract: An illuminating apparatus having a heat dissipation base and a multilayer array-type LED module is provided. The multilayer array-type LED module serves as a light source, and a heat dissipation element is provided. The multilayer array-type LED module is featured with a high luminescent efficiency and consumes less power, and the heat dissipation element is adapted for dissipating the heat generated by the multilayer array-type LED module by natural air convection. The combination of the multilayer array-type LED module and the heat dissipation element achieves a better performance of the illuminating apparatus, and can be conveniently further combined with other lamps, or even customized for satisfying different requirements and demands.