Abstract: The present invention relates to a compliant leaded interposer for resiliently attaching and electrically connecting a ball grid array package to a circuit board. The interposer may include a substrate, a plurality of pads, and a plurality of pins. The plurality of pads may be positioned substantially on the top surface of the substrate and arranged in a predetermined pattern substantially corresponding to the solder ball pattern on the ball grid array package. The plurality of pins may be positioned substantially perpendicular to the substrate and may extend through the substrate and the plurality of pads. The interposer may be configured to attach the ball grid array package to the circuit board such that each of the solder balls on the ball grid array package contacts at least a portion the plurality of pins and at least a portion of the plurality of pads and such that the each of the plurality of pins also connects to a contact on the circuit board.

Abstract: A cable and system for manufacturing the same is provided. The cable includes a core communications medium and an outer jacket surrounding the core communications medium. A plurality of grooves are in the outer surface of the outer jacket. Each of the grooves has a recess and an opening to access the recess, the recess having a larger width than the opening. Each of the plurality of conductors is exposed to the external environment and can be reached directly from the external environment.