Abstract: The present invention provides a number of techniques for laminating and interconnecting multiple high-layer-count (HLC) substrates to form a multilayer package or other circuit component. A solder bump may be formed on the conductive pad of at least one of two HLC substrates. The solder bump preferably is formed from an application of solder paste to the conductive pad(s). An adhesive film may be positioned between the surfaces of the HLC substrates having the conductive pads, where the adhesive film includes an aperture located substantially over the conductive pads such that the conductive pads and/or solder bumps confront each other through the aperture. The HLC substrates then may be pressed together to mechanically bond the two substrates via the adhesive. The solder bump(s) may be reflowed during or after the lamination to create a solder segment that provides an electrical connection between the two conductive pads through the aperture in the adhesive film.

Abstract: The present invention provides a number of techniques for laminating and interconnecting multiple substrates to form a multilayer package or other circuit component. A solder bump may be formed on the conductive pad of at least one of two or more substrates. The solder bump preferably is formed from an application of solder paste to the conductive pad(s). Adhesive films may be positioned between the surfaces of the substrates having the conductive pads, where the adhesive films include apertures located substantially over the conductive pads such that the conductive pads and/or solder bumps confront each other through the aperture. The two or more substrates then may be pressed together to mechanically bond the two or more substrates via the adhesive films. The solder bump(s) may be reflowed during or after the lamination to create a solder segment that provides an electrical connection between the conductive pads through the aperture in the adhesive films.

Abstract: Two neural networks are used to control adaptively a vibration and noise-producing plant. The first neural network, the emulator, models the complex, nonlinear output of the plant with respect to certain controls and stimuli applied to the plant. The second neural network, the controller, calculates a control signal which affects the vibration and noise producing characteristics of the plant. By using the emulator model to calculate the nonlinear plant gradient, the controller matrix coefficients can be adapted by backpropagation of the plant gradient to produce a control signal which results in the minimum vibration and noise possible, given the current operating characteristics of the plant.

Abstract: The present invention provides a number of techniques for laminating and interconnecting multiple high-layer-count (HLC) substrates to form a multilayer package or other circuit component. A solder bump may be formed on the conductive pad of at least one of two HLC substrates. The solder bump preferably is formed from an application of solder paste to the conductive pad(s). An adhesive film may be positioned between the surfaces of the HLC substrates having the conductive pads, where the adhesive film includes an aperture located substantially over the conductive pads such that the conductive pads and/or solder bumps confront each other through the aperture. The HLC substrates then may be pressed together to mechanically bond the two substrates via the adhesive. The solder bump(s) may be reflowed during or after the lamination to create a solder segment that provides an electrical connection between the two conductive pads through the aperture in the adhesive film.

Abstract: Method and apparatus for determining the positioning of volumetric detection array lines. In the case of a sonar array, ultrasonic frequencies are used. Transmitter subsystems including ceramic transducers, and sensors such as hydrophones, are deployed on the lines of the array and code division multiple access (CDMA) type pseudo-random numbers are used to identify each transmitter. Transit times between transducers and sensors, as determined by detector electronics, are sent to a ship-board receiver in any of various formats, so that array line position can be determined.

Abstract: The present invention provides a number of techniques for laminating and interconnecting multiple high-layer-count (HLC) substrates to form a multilayer package or other circuit component. A solder bump may be formed on the conductive pad of at least one of two HLC substrates. The solder bump preferably is formed from an application of solder paste to the conductive pad(s). An adhesive film may be positioned between the surfaces of the HLC substrates having the conductive pads, where the adhesive film includes an aperture located substantially over the conductive pads such that the conductive pads and/or solder bumps confront each other through the aperture. The HLC substrates then may be pressed together to mechanically bond the two substrates via the adhesive. The solder bump(s) may be reflowed during or after the lamination to create a solder segment that provides an electrical connection between the two conductive pads through the aperture in the adhesive film.

Abstract: A device for injecting light from one of a first group of optical fibers into a corresponding one of a second group of optical fibers includes a holder for locating each of the fibers in the first and second groups, a clamp for securing fibers in the second group to the holder, and a depressor for laterally displacing each of the fibers in the second group, thus forming a bend in each of the fibers in the second group. The maximum curvature in the bend occurs where the fibers in the second group exit the clamp. Light is injected from fibers in the first group into corresponding fibers in the second group at the point of maximum curvature. An optical gel may be used to used to promote optical coupling between fibers in the first group and fibers in the second group. The optical fibers in the second group may include a lens for focusing the light to be injected. The device can function in reverse to extract light from fibers in the second group into fibers in the first group.

Abstract: An actuator for use in an active mount system for reducing vibration transmission from a vibrating component to a support structure. The actuator is disposed in a housing that is attached to the vibrating component or the support structure. The actuator includes a piston moveably disposed in a casing, and a piston rod assembly that is connected to the other one of the vibrating component or the support structure. A seal assembly, disposed either in a groove in the piston or in a groove in the casing, provides a seal between the piston and casing. The seal assembly includes an annular seal member comprising polytetrafluoroethylene resin, backing rings on each side of the seal member, and an annular compression spring in the groove between one of the backing rings and one edge of the groove.

Abstract: An active mount is provided for use in a rotary wing aircraft between each of the gearbox and airframe mounting locations for mechanically suspending the airframe from the gearbox. The active mount comprises first and second linear hydraulic actuators each having a principal axis. The length of the actuators is variable along the principal axis for providing relative movement between the airframe and the gearbox. The principal axes of the actuators are adapted to lie in the directional planes of the primary forces necessary for supporting the airframe and acting on the transmission gearbox mounting locations for providing movement of the gearbox relative to the airframe in the planes at a frequency for reducing the transfer of vibration through the active mount to the airframe. A system for reducing vibration in the rotary wing aircraft further comprises a hydraulic system for supplying a controlled flow of pressurized hydraulic fluid to the actuators.

Abstract: A seal assembly is provided for use in a hydraulic actuator of the type including a cylinder, a piston movably disposed in the cylinder, and a piston rod connected to the piston and extending from an end of the cylinder. The seal assembly comprises a seal member formed of a material impervious to hydraulic fluid and having an inner edge and an outer peripheral edge. The inner edge of the seal member defines a central opening which is larger than the outside diameter of the piston rod for receiving the rod. The outer edges of the seal member are attached adjacent the end of the cylinder so that the inner edge of the seal member is radially spaced from the outside diameter of the piston rod and the seal member forms a fluid impervious wall for preventing hydraulic fluid from contacting the elastomeric portion of the bearing assembly.

Abstract: The present invention provides a number of techniques for laminating and interconnecting multiple high-layer-count (HLC) substrates to form a multilayer package or other circuit component. A solder bump may be formed on the conductive pad of at least one of two HLC substrates. The solder bump preferably is formed from an application of solder paste to the conductive pad(s). An adhesive film may be positioned between the surfaces of the HLC substrates having the conductive pads, where the adhesive film includes an aperture located substantially over the conductive pads such that the conductive pads and/or solder bumps confront each other through the aperture. The HLC substrates then may be pressed together to mechanically bond the two substrates via the adhesive. The solder bump(s) may be reflowed during or after the lamination to create a solder segment that provides an electrical connection between the two conductive pads through the aperture in the adhesive film.