Patents Assigned to General Dynamics Advanced Information
  • Patent number: 6651988
    Abstract: An actuator for use in an active mount system for reducing vibration transmission from a vibrating component to a support structure. The actuator is disposed in a housing that is attached to the vibrating component or the support structure. The actuator includes a piston moveably disposed in a casing, and a piston rod assembly that is connected to the other one of the vibrating component or the support structure. A seal assembly, disposed either in a groove in the piston or in a groove in the casing, provides a seal between the piston and casing. The seal assembly includes an annular seal member comprising polytetrafluoroethylene resin, backing rings on each side of the seal member, and an annular compression spring in the groove between one of the backing rings and one edge of the groove.
    Type: Grant
    Filed: December 27, 2000
    Date of Patent: November 25, 2003
    Assignee: General Dynamics Advanced Information Systems, Inc.
    Inventors: Gregory Waston Terpay, George Gustave Zipfel
  • Patent number: 6644590
    Abstract: An active mount is provided for use in a rotary wing aircraft between each of the gearbox and airframe mounting locations for mechanically suspending the airframe from the gearbox. The active mount comprises first and second linear hydraulic actuators each having a principal axis. The length of the actuators is variable along the principal axis for providing relative movement between the airframe and the gearbox. The principal axes of the actuators are adapted to lie in the directional planes of the primary forces necessary for supporting the airframe and acting on the transmission gearbox mounting locations for providing movement of the gearbox relative to the airframe in the planes at a frequency for reducing the transfer of vibration through the active mount to the airframe. A system for reducing vibration in the rotary wing aircraft further comprises a hydraulic system for supplying a controlled flow of pressurized hydraulic fluid to the actuators.
    Type: Grant
    Filed: September 14, 2001
    Date of Patent: November 11, 2003
    Assignee: General Dynamics Advanced Information Systems, Inc.
    Inventors: Gregory Weston Terpay, George G. Zipfel, William Welsh
  • Patent number: 6634862
    Abstract: A seal assembly is provided for use in a hydraulic actuator of the type including a cylinder, a piston movably disposed in the cylinder, and a piston rod connected to the piston and extending from an end of the cylinder. The seal assembly comprises a seal member formed of a material impervious to hydraulic fluid and having an inner edge and an outer peripheral edge. The inner edge of the seal member defines a central opening which is larger than the outside diameter of the piston rod for receiving the rod. The outer edges of the seal member are attached adjacent the end of the cylinder so that the inner edge of the seal member is radially spaced from the outside diameter of the piston rod and the seal member forms a fluid impervious wall for preventing hydraulic fluid from contacting the elastomeric portion of the bearing assembly.
    Type: Grant
    Filed: September 14, 2001
    Date of Patent: October 21, 2003
    Assignee: General Dynamics Advanced Information Systems, Inc.
    Inventors: Gregory Weston Terpay, Ronald G. Ernst
  • Publication number: 20030174484
    Abstract: The present invention provides a number of techniques for laminating and interconnecting multiple high-layer-count (HLC) substrates to form a multilayer package or other circuit component. A solder bump may be formed on the conductive pad of at least one of two HLC substrates. The solder bump preferably is formed from an application of solder paste to the conductive pad(s). An adhesive film may be positioned between the surfaces of the HLC substrates having the conductive pads, where the adhesive film includes an aperture located substantially over the conductive pads such that the conductive pads and/or solder bumps confront each other through the aperture. The HLC substrates then may be pressed together to mechanically bond the two substrates via the adhesive. The solder bump(s) may be reflowed during or after the lamination to create a solder segment that provides an electrical connection between the two conductive pads through the aperture in the adhesive film.
    Type: Application
    Filed: March 14, 2003
    Publication date: September 18, 2003
    Applicant: General Dynamics Advanced Information Systems, Inc
    Inventors: Deepak K. Pai, Ronald R. Denny