Abstract: An array module containing an array of electronic units is mounted in an installation frame. The electronic units can be mounted by rails in a hermetically sealed array housing and blind-mate connectors can connect the units to a rear plate. Blind-mate connectors also can connect the rear plate to the installation frame for external connection. A plurality of resilient mounts are fastened to the installation frame to protect the frame and storage array module from external shock. A thermal transfer mechanism transfers thermal energy between the electronic units and a region exterior to the installation frame. The electronic units can be enclosed in hermetically sealed chambers having side rails for rigidly fastened to the unit and a resilient support connecting the side rails to at least one of the covers of the hermetically sealed chamber.