Abstract: A manufacturing method using a micro-miniature LED as a light source for backlight thickness reduction and light efficiency improvement comprising a plurality of spaced apart light emitting diode chips on a substrate. Colloid with uniformly distributed diffusion particles is coated to fill gaps between LED chips. A roller is applied to the surface of the colloid and a continuous geometric structure is formed with a cone structure in the horizontal-vertical (XY axis) direction. An ultraviolet curing device is used for optical UV curing of the continuous geometric structure to create a brightness enhancement layer.