Abstract: A hybrid chip-on-heatsink device comprises at least one LED die, at least one printed circuit board (PCB), and a thermally conductive substrate or heatsink. The LED die is physically and thermally coupled to the thermally conductive substrate. The PCB is physically coupled to the thermally conductive substrate. The LED die is electrically coupled to the PCB. The thermally conductive substrate acts as a spreader and as a heatsink, whereby heat is efficiently dissipated away from the LED die. The PCB may optionally contain other electrical components, and circuitry to create a “smart” LED package or light engine.

Abstract: A lighting unit having a substrate, a light source coupled to the substrate, the light source being configured to generate light. The lighting unit further includes an optical layer positioned over the light source and arranged relative to the substrate to define a region between a top side of the substrate and a bottom side of the optical layer, and a light reflector coupled to the optical layer. The light reflector being structured to reflect at least a portion of the light generated by the light source toward the top side of the substrate, and further structured to define a plurality of light transmissive regions which individually permit transmission of at least a portion of the light generated by the light source.