Abstract: MEMS microphone packages and fabrication methods thereof are disclosed. One method for fabricating a MEMS microphone package, includes providing a substrate, forming a cavity enclosed by a top cover part, wherein a housing wall part surrounds and supports the top cover part, and the substrate supports the housing wall part and the cover part, forming a MEMS sensing element and an IC chip inside the cavity, forming an opening comprising an acoustic passage connecting the cavity to an ambient space, and forming a conductive casing enclosing the top cover part and the housing wall, wherein the conductive casing is soldered to a PCB board and is electrically connected to a common analog ground lead on the PCB board.

Abstract: A silicon microphone package is provided, including an integrated microphone die having opposing first and second surfaces, a first cover member formed over the first surface of the integrated microphone die to form a first chamber therebetween, and a second cover member formed over the second surface of the integrated microphone die to form a second chamber therebetween.

Abstract: MEMS microphone packages and fabrication methods thereof are disclosed. A MEMS microphone package includes a casing with a conductive part disposed over a substrate, to enclose a cavity. A MEMS acoustic sensing element and an IC chip are disposed inside the cavity. An opening with an acoustic passage connects the cavity to an ambient space. A first ground pad is disposed on a backside of the substrate connecting to the conductive part of the casing through a via hole of the substrate. A second ground pad is disposed on the backside of the substrate connecting to the MEMS acoustic sensing element or the IC chip through an interconnection of the substrate, wherein the first ground pad and the second ground pad are isolated from each other.

Abstract: MEMS microphone packages and fabrication methods thereof are disclosed. One method for fabricating a MEMS microphone package, includes providing a substrate, forming a cavity enclosed by a top cover part, wherein a housing wall part surrounds and supports the top cover part, and the substrate supports the housing wall part and the cover part, forming a MEMS sensing element and an IC chip inside the cavity, forming an opening comprising an acoustic passage connecting the cavity to an ambient space, and forming a conductive casing enclosing the top cover part and the housing wall, wherein the conductive casing is soldered to a PCB board and is electrically connected to a common analog ground lead on the PCB board.

Abstract: MEMS microphone packages and fabrication methods thereof are disclosed. A MEMS microphone package includes a cavity that houses a MEMS sensing element, an IC chip and other passive elements supported by a common substrate. The cavity is formed by a top cover member, a housing wall surrounds and supports the top cover member and the common substrate supports the housing wall. A conductive casing encloses and surrounds the cavity, and is electrically connected to a common analog ground lead on a PCB board. The top cover member and the housing wall are non-conductive. And the conductive casing is not connected directly to the ground leads of the package. An acoustic absorption layer is sandwiched between the conductive casing and the cavity which is formed by the top cover member, the housing wall and the substrate.

Abstract: A silicon microphone package is provided, including an integrated microphone die having opposing first and second surfaces, a first cover member formed over the first surface of the integrated microphone die to form a first chamber therebetween, and a second cover member formed over the second surface of the integrated microphone die to form a second chamber therebetween.

Abstract: MEMS microphone packages and fabrication methods thereof are disclosed. A MEMS microphone package includes a cavity that houses a MEMS sensing element, an IC chip and other passive elements supported by a common substrate. The cavity is formed by a top cover member, a housing wall surrounds and supports the top cover member and the common substrate supports the housing wall. A conductive casing encloses and surrounds the cavity, and is electrically connected to a common analog ground lead on a PCB board. The top cover member and the housing wall are non-conductive. And the conductive casing is not connected directly to the ground leads of the package. An acoustic absorption layer is sandwiched between the conductive casing and the cavity which is formed by the top cover member, the housing wall and the substrate.

Abstract: The present invention relates to an acoustic transducer that includes one or more capsules, side walls and a backing plate. Each capsule contains a cavity formed by the side walls and a plurality of film stacks. Each film stack has one or more membranes that can be a piezoelectric layer. Two or more of the film stacks that form the first cavity faces each other. A film stack and the backing plate face each other and form the wall of a second cavity. The transducers of this invention have a broadband response, can radiate sounds uni-directionally, and produce high quality sounds at low frequencies and at high intensities. They can be driven by AC signals. They can be fabricated using conventional integrated circuit manufacturing processes and therefore can be mass produced easily and inexpensively.

Abstract: This invention relates to a micromachined capacitive microphone having a shallowly corrugated diaphragm that is anchored at one or more locations on the support has a plurality of dimples to support itself and rest freely on the perforated backplate. The diaphragm whose ends are not anchored is bounded by the taps of edge rail. Also disclosed includes: a fixed perforated backplate having one or more regions; an adjustable cantilever formed by the diaphragm, the support and the backplate; a plurality of dimples maintaining vertical separation between diaphragm and backplate; and the patterning of conductor electrodes carried by diaphragm and backplate.

Abstract: This invention relates generally to a micromachined acoustic transducer that has a scalable array of sealed cavities and perforated members forming capacitive cells that convert the electrical signal to acoustic signal or vice versa. It also relates to the method and more particularly to a micromachined acoustic transducer which includes a plurality of micromachined membranes and perforated members forming capacitive cells and more particularly to an acoustic transducer in which the capacitive cells are connected in a scalable array whereby electrical signals are applied to the said array and converted to acoustic signals. The transducer can either be used as an acoustic actuator or a microphone.

Abstract: A micromachined capacitive acoustic transducer including an electrode formed by a perforated plate and another electrode formed by a shallowly corrugated membrane anchored at one or more positions on the substrate which also supports the said perforated plate is described. Also disclosed includes: a fixed perforated plate; a movable shallowly corrugated membrane having holes to form acoustic filter to a certain frequency or a range of frequencies spaced from the perforated plate that is anchored in one or more location but loose at other locations; a support structure in the perforated plate maintaining the minimum separation between the membrane and the perforated plate near the perimeter.

Abstract: A Capacitive Micromachined Ultrasonic RF (CMURF) pressure sensor is described. This micromachined pressure sensor has: pressure sensitive capacitance elements including a scalable array of micromachined cells of the type including electrodes carried by a sealed membrane supported above a common electrode with conductive lines interconnecting the electrodes having an electrostatic capacitance ?Cm changing with a pressure to be detected; reference capacitance elements including a scalable array of micromachined cells of the type including electrodes carried by a stacked of membranes supported above a common electrode with conductive lines interconnecting the electrodes having an electrostatic capacitance Cm not changing with the pressure. A method of operating a pressure sensor array is also described.