Abstract: A process for manufacturing a microcircuit carrier having resistive or capacitive lead terminations which comprises the steps of preparing a plate-up pattern on the substrate, laying out resistive lead terminations, capacitive lead terminations, or a combination of resistive and capacitive lead terminations, and packaging the carrier. The step of laying out resistive lead terminations comprises depositing resistor material along a resistive pattern, and laser trimming the resistor material to value. The step of laying out the capacitive lead terminations comprises depositing lower capacitor pads, hard anodizing said lower capacitor pads, and depositing the upper capacitor pads.