Abstract: A temporary self-adherence of the individual components in a stack of semiconductor components is accomplished by the use of adhesive bodies either separate from the solder preforms used in the stack or included within the solder in the form of a tacky paste. The adhesive bodies may comprise relatively high-purity water, and adhesion of the adjoining parts is achieved by the surface tension of the water. During a single heating step, preferably performed in a protective, non-oxidizing atmosphere, the water is completely evaporated while the solder preforms are heated to form the desired solder joints.

Abstract: A semiconductor device having a semiconductor substrate and an epitaxial layer deposited thereon which supports a patterned insulating layer on which a metal layer is provided. To achieve a lower capacitance of the semiconductor device with unchanged forward voltage, the epitaxial layer consists of first and second epitaxial layers, the first epitaxial layer which adjoins the semiconductor substrate having a higher dopant concentration than and being of the same conductivity type as the second epitaxial layer.