Patents Assigned to General Tool, Inc.
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Patent number: 11123843Abstract: An abrasive finishing article with an adapter or hub to attach to an appropriate power tool, wherein the hub contains sets of slots to receive ribs positioned on a grinding wheel to permit adjustment of the height of the hub to change the overall height of the grinding wheel and abrasive finishing article.Type: GrantFiled: May 4, 2018Date of Patent: September 21, 2021Assignee: GENERAL TOOL, INC.Inventor: Joon Ho Park
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Publication number: 20180339400Abstract: An abrasive finishing article with an adapter or hub to attach to an appropriate power tool, wherein the hub contains sets of slots to receive ribs positioned on a grinding wheel to permit adjustment of the height of the hub to change the overall height of the grinding wheel and abrasive finishing article.Type: ApplicationFiled: May 4, 2018Publication date: November 29, 2018Applicant: GENERAL TOOL, INC.Inventor: Joon Ho PARK
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Patent number: 8656901Abstract: A cutting tip for a cutting tool used to cut or drill a brittle workpiece such as stone, brick, concrete, or asphalt and a frame saw provided with the cutting tip are disclosed. The swing type cutting tip including abrasive particles has a specific arrangement capable of enhancing the cutting efficiency of the abrasive particles, and thus achieving an enhancement in cutting performance and an increase in lifespan. The cutting tip includes a plurality of abrasive particles to cut a workpiece while swing. At least a part of the abrasive particles are arranged in the form of abrasive particle groups. Each abrasive particle group is constituted by at least two abrasive particles. At least a part of the abrasive particles of the abrasive particle groups are overlapped in a cutting direction.Type: GrantFiled: February 28, 2007Date of Patent: February 25, 2014Assignees: Ehwa Diamond Industrial Co., Ltd., General Tool, Inc.Inventors: Soo-Kwang Kim, Hee-Dong Park, Nam-Kwang Kim
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Patent number: 8028687Abstract: The invention provides a segment type diamond tool capable of improving cutting rate and reducing the amount of fine debris generated during cutting by properly arranging diamond particles in a cutting segment of the diamond tool. In the invention, the layers of diamond particles are arranged such that cutting grooves formed on a workpiece by trailing layers of diamond particles are arranged between cutting grooves formed thereon by leading layers of diamond particles, respectively, in cutting of the work piece. The cutting segment has high-concentration and low-concentration areas. The high-concentration area shows a concentration higher than an average concentration and the low concentration area shows a concentration lower than the average concentration. Also, at least one low concentration area is formed on the leading and/or trailing section of the cutting segment. The diamond tool of the invention ensures superior cutting rate and reduced amount of fine debris generated during cutting.Type: GrantFiled: February 13, 2006Date of Patent: October 4, 2011Assignees: Ehwa Diamond Industrial Co., Ltd., General Tool, Inc.Inventors: Soo-Kwang Kim, Jong-Ho Kim, Hee-Dong Park
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Patent number: 8002858Abstract: A cutting segment for a cutting tool used for cutting or drilling brittle workpieces, such as stone, brick, concrete and asphalt, a method for manufacturing the segment, and a cutting tool comprising the segment are disclosed. The segment comprises layers of diamond particles and two kinds of plate-shaped metal matrix layers comprising soft and hard metal matrix layers having different ductility. The plate-shaped metal matrix layers are arranged perpendicular to a cutting surface while being parallel to a cutting direction, and are alternately stacked perpendicular to the cutting direction. The layers of diamond particles are suitably arranged in the plate-shaped soft and hard metal matrix layers. The segment and the cutting tool comprising the same have excellent cutting ability, and the manufacturing process thereof can be simplified, thereby remarkably enhancing productivity.Type: GrantFiled: April 14, 2006Date of Patent: August 23, 2011Assignees: EHWA Diamond Industrial Co., Ltd., General Tool, Inc.Inventors: Soo-Kwang Kim, Hee-Dong Park
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Patent number: 7954483Abstract: The invention provides a cutting segment for a cutting tool for cutting or drilling a brittle work piece such as stone, bricks, concrete and asphalt, and a cutting tool having the cutting segment. The cutting segment includes a cutting surface for cutting a work piece and a plurality of abrasive particle layers. The abrasive particle layers are disposed perpendicular to a cutting direction. Each of the abrasive layers has a plurality of abrasive particle rows in a width direction of the cutting segment. Each of the abrasive rows has a plurality of abrasive particles arranged in a line. Further, the abrasive layers have a plurality of blank sections therebetween. In the blanks sections, abrasive particles are absent or have a concentration of 70% or less with respect to those in the abrasive rows. In addition, the blank sections include relatively thick blank sections and relatively thin blank sections.Type: GrantFiled: April 19, 2006Date of Patent: June 7, 2011Assignees: Ehwa Diamond Industrial Co., Ltd., General Tool, Inc.Inventors: Soo-Kwang Kim, Hee-Dong Park, Joon-Ho Chang, Jong-Ho Kim
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Patent number: 7661419Abstract: The invention relates to a cutting segment of a diamond tool for cutting or drilling a brittle workpiece such as stone, bricks, concrete and asphalt, and a diamond tool having the same. The invention allows superior cutting rate and lengthy useful life without suffering from R wear during cutting. In the cutting segment, a number of diamond particles are arranged in a plurality of plate-shaped layers stacked perpendicular to a cutting direction. Each of the diamond particle layers has a plurality of particle rows on a cutting surface. Further, at least two of the diamond particle layers are superimposed on at least one side of the cutting segment seen from the front of the cutting segment in cutting direction. The invention ensures uniform cutting by significantly reducing R wear that arises during cutting and thus enables superior cutting rate and longer useful life.Type: GrantFiled: April 20, 2006Date of Patent: February 16, 2010Assignees: Ehwa Diamond Industrial Co., Ltd., General Tool, Inc.Inventors: Soo-Kwang Kim, Hee-Dong Park, Jong-Ho Kim, Joon-Ho Chang
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Publication number: 20080219783Abstract: A cutting segment of a cutting tool for cutting or drilling a brittle work piece such as stone, bricks, concrete and asphalt, and a cutting tool. The cutting segment includes a cutting surface for cutting a work piece and a number of abrasive particles arranged in a plurality of rows. Each of the abrasive rows includes high-concentration parts and low-concentration parts. The high-concentration parts are grouped together to form a high-concentration area on the cutting surface and the low-concentration parts are grouped together to form a low-concentration area on the cutting surface. The cutting segment and the cutting tool are capable of improving cutting rate and useful life.Type: ApplicationFiled: December 28, 2005Publication date: September 11, 2008Applicants: EHWA DIAMOND INDUSTRIAL CO., LTD., GENERAL TOOL, INC.Inventors: Soo-Kwang Kim, Joon Ho Chang, Hee-Dong Park, Jong-Ho Kim
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Publication number: 20080202488Abstract: The invention provides a cutting segment for a cutting tool for cutting or drilling a brittle work piece such as stone, bricks, concrete and asphalt, and a cutting tool having the cutting segment. The cutting segment includes a cutting surface for cutting a work piece and a plurality of abrasive particle layers. The abrasive particle layers are disposed perpendicular to a cutting direction. Each of the abrasive layers has a plurality of abrasive particle rows in a width direction of the cutting segment. Each of the abrasive rows has a plurality of abrasive particles arranged in a line. Further, the abrasive layers have a plurality of blank sections therebetween. In the blanks sections, abrasive particles are absent or have a concentration of 70% or less with respect to those in the abrasive rows. In addition, the blank sections include relatively thick blank sections and relatively thin blank sections.Type: ApplicationFiled: April 19, 2006Publication date: August 28, 2008Applicants: EHWA DIAMOND INDUSTRIAL CO., LTD., GENERAL TOOL, INC.Inventors: Soo-Kwang Kim, Hee-Dong Park, Joon-Ho Chang, Jong-Ho Kim
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Publication number: 20080171505Abstract: The invention relates to a cutting segment of a diamond tool for cutting or drilling a brittle workpiece such as stone, bricks, concrete and asphalt, and a diamond tool having the same. The invention allows superior cutting rate and lengthy useful life without suffering from wear during cutting. In the cutting segment, a number of diamond particles are arranged in a plurality of plate-shaped layers stacked perpendicular to a cutting direction. Each of the diamond particle layers has a plurality of particle rows on a cutting surface. Further, at least two of the diamond particle layers are superimposed on at least one side of the cutting segment seen from the front of the cutting segment in cutting direction. The invention ensures uniform cutting by significantly reducing R wear that arises during cutting and thus enables superior cutting rate and longer useful life.Type: ApplicationFiled: April 20, 2006Publication date: July 17, 2008Applicants: EHWA Diamond Industrial Co., Ltd., General Tool, Inc.Inventors: Soo-Kwang Kim, Hee-Dong Park, Jong-Ho Kim, Joon-Ho Chang
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Publication number: 20080148648Abstract: A cutting segment for a cutting tool used for cutting or drilling brittle workpieces, such as stone, brick, concrete and asphalt, a method for manufacturing the segment, and a cutting tool comprising the segment are disclosed. The segment comprises layers of diamond particles and two kinds of plate-shaped metal matrix layers comprising soft and hard metal matrix layers having different ductility. The plate-shaped metal matrix layers are arranged perpendicular to a cutting surface while being parallel to a cutting direction, and are alternately stacked perpendicular to the cutting direction. The layers of diamond particles are suitably arranged in the plate-shaped soft and hard metal matrix layers. The segment and the cutting tool comprising the same have excellent cutting ability, and the manufacturing process thereof can be simplified, thereby remarkably enhancing productivity.Type: ApplicationFiled: April 14, 2006Publication date: June 26, 2008Applicants: Ehwa Diamond Industrial Co., Ltd., General Tool, Inc.Inventors: Soo-Kwang Kim, Hee-Dong Park
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Publication number: 20070056574Abstract: A cutting segment for a cutting tool used for cutting or drilling brittle workpieces, such as stone, brick, concrete and asphalt, a method for manufacturing the segment, and a cutting tool comprising the segment are disclosed. The segment comprises layers of diamond particles and two kinds of plate-shaped metal matrix layers comprising soft and hard metal matrix layers having different ductility. The plate-shaped metal matrix layers are arranged perpendicular to a cutting surface while being parallel to a cutting direction, and are alternately stacked perpendicular to the cutting direction. The layers of diamond particles are suitably arranged in the plate-shaped soft and hard metal matrix layers. The segment and the cutting tool comprising the same have excellent cutting ability, and the manufacturing process thereof can be simplified, thereby remarkably enhancing productivity.Type: ApplicationFiled: April 13, 2006Publication date: March 15, 2007Applicants: GENERAL TOOL, INC., EHWA DIAMOND INDUSTRIAL CO., LTDInventors: Soo-Kwang Kim, Hee-Dong Park
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Patent number: 7134430Abstract: A cutting segment for a cutting tool used for cutting or drilling a brittle workpiece, such as stone, brick, concrete and asphalt, a method of manufacturing the segment and a cutting tool provided with the segment are disclosed. The segment comprises a plurality of plate-shaped metal matrix layers laminated perpendicular to a cutting surface of the segment while being parallel to a cutting direction of the segment, the plate-shaped metal matrix layers being integrally combined with each other and made of a ferrous or non-ferrous material; and diamond particle layers arranged between the plate-shaped metal matrix layers such that diamond particles can be provided in an array on the cutting surface. The segment has an excellent cutting capability, and can be made by a simplified manufacturing process, thereby remarkably reducing manufacturing costs.Type: GrantFiled: December 9, 2004Date of Patent: November 14, 2006Assignees: Ehwa Diamond Industrial Co. Ltd., General Tool, Inc.Inventors: Soo-Kwang Kim, Hee-Dong Park
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Publication number: 20050235978Abstract: A cutting segment for a cutting tool used for cutting or drilling a brittle workpiece, such as stone, brick, concrete and asphalt, a method of manufacturing the segment and a cutting tool provided with the segment are disclosed. The segment comprises a plurality of plate-shaped metal matrix layers laminated perpendicular to a cutting surface of the segment while being parallel to a cutting direction of the segment, the plate-shaped metal matrix layers being integrally combined with each other and made of a ferrous or non-ferrous material; and diamond particle layers arranged between the plate-shaped metal matrix layers such that diamond particles can be provided in an array on the cutting surface. The segment has an excellent cutting capability, and can be made by a simplified manufacturing process, thereby remarkably reducing manufacturing costs.Type: ApplicationFiled: December 9, 2004Publication date: October 27, 2005Applicants: General Tool, Inc., EHWA DIAMOND INDUSTRIAL CO., LTD.Inventors: Soo-Kwang Kim, Hee-Dong Park
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Patent number: 6638152Abstract: A diamond tool having segment type cutting tip for cutting, grinding or drilling workpieces. The diamond tool comprising a plurality of segment type cutting tips circumferentially fixed on the wheel of the diamond tool, each of which has at least two diamond layers longitudinally disposed parallel with the rotation direction of the diamond tool, and capable of effectively cutting, grinding or drilling workpieces as forming at least two microscopic linear cutting groves in the workpieces when cutting operation.Type: GrantFiled: May 31, 2001Date of Patent: October 28, 2003Assignees: Ehwa Diamond, Ind., Co., Ltd., General Tool, Inc.Inventors: Soo Kwang Kim, So Young Yoon, Chang Hyun Lee
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Patent number: 6626167Abstract: A segment type diamond tool, used for cutting or drilling brittle substances, such as stones, bricks, concrete structures, or asphalt structures, is disclosed. In the diamond tool, the segments are each set with diamonds in a single-layered structure or a multi-layered structure, and are alternately or intermittently arranged on a steel core, different from conventional diamond tools having segments randomly set with diamonds. Such a diamond arrangement of this invention allows the diamonds to more effectively perform their cutting action, and so the diamond tool has an increased cutting rate, in addition to reducing the amount of fine debris generated during a cutting or drilling process to ill-affect worker's health or cause environmental pollution.Type: GrantFiled: November 20, 2001Date of Patent: September 30, 2003Assignees: Ehwa Diamond Industrial Co., Ltd., General Tool, Inc.Inventors: Soo Kwang Kim, So Young Yoon, Jong Ho Kim
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Publication number: 20030089364Abstract: A segment type diamond tool, used for cutting or drilling brittle substances, such as stones, bricks, concrete structures, or asphalt structures, is disclosed. In the diamond tool, the segments are each set with diamonds in a single-layered structure or a multi-layered structure, and are alternately or intermittently arranged on a steel core, different from conventional diamond tools having segments randomly set with diamonds. Such a diamond arrangement of this invention allows the diamonds to more effectively perform their cutting action, and so the diamond tool has an increased cutting rate, in addition to reducing the amount of fine debris generated during a cutting or drilling process to ill-affect worker's health or cause environmental pollution.Type: ApplicationFiled: November 20, 2001Publication date: May 15, 2003Applicant: GENERAL TOOL, INC.Inventors: Soo Kwang Kim, So Young Yoon, Jong Ho Kim