Abstract: An electrical apparatus can be used to modulate an apparent intensity of a vehicular braking indicator according to a specified pattern. When a duration of an initial brake application exceeds a specified initial modulation duration, the apparent intensity can continue to be modulated, but in a manner suppressing apparent variation in intensity until at least one of a release of brake application or until a specified timeout duration lapses. In an example, upon lapse of the timeout duration, modulation can be re-established to vary the apparent intensity of the vehicular braking indicator according to the specified pattern for another modulation duration corresponding to the initial modulation duration. The pattern can be customizable, such as provided to the electrical apparatus digitally, before installation. The customizability of the specified pattern can be inhibited, such as after installation by an installer or seller.

Abstract: Dynamic, asymmetric rings and related communication equipment and methods are disclosed. Various features may be implemented to provide any or all of several degrees of freedom for managing resources in a communication network. Communication rates may be optimized on a node-to-node basis or overall on a network level. Different rates may be configured and possibly dynamically adjusted between different nodes, and/or for different directions of traffic transfer. Bandwidth can be dynamically allocated along a string of the communication nodes in a ring or linear topology in some embodiments. Direction of traffic transfer represents an additional possible degree of freedom in a ring topology, in that traffic can be transferred in either direction in a ring, such as the direction of least delay.

Abstract: A blind-mate connector (10, 20, 100) has a barrel (11, 21, 105), a base (12, 22, 110) at the back end of the barrel, an insulator (17, 27) mounted in the base, and a center conductor (15, 25) extending from near the front end of the barrel, through the insulator, and extending beyond the back end of the base, with the center conductor being held by the insulator. One type has sidewalls (13, 23) extending rearwardly from the back end of the base, and alignment notches (14, 24) on the sidewalls, the alignment notches extending only partially from the back ends of the sidewalls toward the base. Another type has alignment tabs (125) extending rearwardly from the back end, and sidewalls (130) extending rearwardly from the back end of the base, the first tab being above the first sidewall.

Abstract: A package method includes steps of providing a light emitting module, a mold and a molding compound, wherein the light emitting module includes a substrate and at least one light emitting unit disposed on the substrate, the mold has at least one recess, and a side wall of the recess is parallel to a side surface of the light emitting unit; filling the recess with the molding compound; placing the substrate on the mold reversely, so that the light emitting unit is immersed into the recess and the molding compound directly encapsulates the light emitting unit; and heating and pressing the substrate and the mold, so as to solidify the molding compound.

Abstract: The present invention provides automated devices for use in supporting various cell therapies and tissue engineering methods. The present invention provides an automated cell separation apparatus capable of separating cells from a tissue sample for use in cell therapies and/or tissue engineering. The cell separation apparatus can be used in combination with complementary devices such as cell collection device and/or a sodding apparatus to support various therapies. The automated apparatus includes media and tissue dissociating chemical reservoirs, filters, a cell separator and a perfusion flow loop through a graft chamber which supports a graft substrate or other endovascular device. The present invention further provides methods for using the tissue grafts and cell samples prepared by the devices described herein in a multitude of therapies including revascularization, regeneration and reconstruction of tissues and organs, as well as treatment and prevention of diseases.

Abstract: A two dimensional structure such as a disk or belt is shaped or distorted to form a buckling wave. At least one contact touches the wave, two contacts squeezing the wave between them providing a firmer connection. The wave is propagated along the structure by any of a variety of means including magnets or piezo actuators. This movement of the wave moves the contacts relative to the two dimensional structure, providing a high leverage ratio.

Abstract: A nitride semiconductor structure and a semiconductor light emitting device including the same are revealed. The nitride semiconductor structure mainly includes a stress control layer disposed between a light emitting layer and a p-type carrier blocking layer. The p-type carrier blocking layer is made from AlxGa1-xN (0<x<1) while the stress control layer is made from AlxInyGa1-x-yN (0<x<1, 0<y<1, 0<x+y<1). The light emitting layer has a multiple quantum well structure formed by a plurality of well layers and barrier layers stacked alternately. There is one well layer disposed between the two barrier layers. Thereby the stress control layer not only improves crystal quality degradation caused by lattice mismatch between the p-type carrier blocking layer and the light emitting layer but also reduces effects of compressive stress on the well layer caused by material differences.

Abstract: A light emitting module including a substrate, a plurality of first light emitting diode (LED) chips and a plurality of second LED chips is provided. The substrate has a cross-shaped central region and a peripheral region surrounding the cross-shaped central region. The first LED chips are disposed on the substrate and at least located in the cross-shaped central region. The second LED chips are disposed on the substrate and at least located in the peripheral region. A size of each second LED chip is smaller than a size of each first LED chip. The number of the first LED chips located in the peripheral region is smaller than that in the cross-shaped central region. The number of the second LED chips located in the cross-shaped central region is smaller than that in the peripheral region.

Abstract: A system, method, and computer-readable storage device for sending a spoken message as a text message. The method includes receiving from a subscriber a spoken message and spoken disambiguating information indicating how to deliver the spoken message to a recipient. The method further includes converting the spoken message to text and communicating the text to the recipient address. The method can also include determining a recipient address for the recipient based on spoken disambiguating information.

Abstract: A thin-film flip-chip light emitting diode (LED) having a roughened surface and a method for manufacturing the same are provided. First, a substrate having a patterned structure on a surface of the substrate is provided, and the surface is roughened. A first semiconductor layer is then formed on the surface; a light emitting structure layer is then formed on the first semiconductor layer; a second semiconductor layer is then formed on the light emitting structure layer. The first and second semiconductor layers possess opposite electrical characteristics. A first contact electrode and a second contact electrode are then formed on the first semiconductor layer and the second semiconductor layer, respectively. Finally, a sub-mount is formed on the first and second contact electrodes, and the substrate is removed to form the thin-film flip-chip LED having the roughened surface. Here, the light emitting efficiency of the thin-film flip-chip LED is improved.

Abstract: A light emitting device includes a light emitting unit, a light transmissive layer and an encapsulant. The light emitting unit includes a substrate, an epitaxial structure layer disposed on the substrate, and a first electrode and a second electrode disposed on the same side of the epitaxial structure layer, respectively. The light emitting unit is disposed on the light transmissive layer and at least a part of the first electrode and a part of the second electrode are exposed by the light transmissive layer. The encapsulant encapsulates the light emitting unit and at least exposes a part of the first electrode and a part of the second electrode. Each of the first electrode and the second electrode extends outward from the epitaxial structure layer, and covers at least a part of an upper surface of the encapsulant, respectively.

Abstract: A nitride semiconductor structure and a semiconductor light emitting device including the same are revealed. The nitride semiconductor structure includes a multiple quantum well structure formed by a plurality of well layers and barrier layers stacked alternately. One well layer is disposed between every two barrier layers. The barrier layer is made of AlxInyGa1-x-yN (0<x<1, 0<y<1, 0<x+y<1) while the well layer is made of InzGa1-zN (0<z<1). Thereby quaternary composition is adjusted for lattice match between the barrier layers and the well layers. Thus crystal defect caused by lattice mismatch is improved.

Abstract: A thickness of material may be detached from a substrate along a cleave plane, utilizing a cleaving process controlled by a releasable constraint plate. In some embodiments this constraint plate may comprise a plate that can couple side forces (the “P-plate”) and a thin, softer compliant layer (the “S-layer”) situated between the P-plate and the substrate. In certain embodiments a porous surface within the releasable constraint plate and in contact to the substrate, allows the constraint plate to be secured to the substrate via a first pressure differential. Application of a combination of a second pressure differential within a pre-existing cleaved portion, and a linear force to a side of the releasable constraint plate bound to the substrate, generates loading that results in controlled cleaving along the cleave plane.

Abstract: A multiple quantum well structure includes a plurality of well-barrier sets arranged along a direction. Each of the well-barrier sets includes a barrier layer, at least one intermediate level layer, and a well layer. A bandgap of the barrier layer is greater than an average bandgap of the intermediate level layer, and the average bandgap of the intermediate level layer is greater than a bandgap of the well layer. The barrier layers, the intermediate level layers, and the well layers of the well-barrier sets are stacked by turns. Thicknesses of at least parts of the well layers in the direction gradually decrease along the direction, and thicknesses of at least parts of the intermediate level layers in the direction gradually increase along the direction. A method for manufacturing a multiple quantum well structure is also provided.

Abstract: The present invention provides for a removable second stage biocompatible substrate filter that includes biocompatible implant material configured to trap second stage operative particulate matter that may include at least one of bone fragments, plasma, stem cells, cellular matter, and growth factors captured from irrigation fluid. The second stage biocompatible substrate filter may be configured to combine with bone fragments captured from irrigation fluid by a first stage filter and may be configured to be operable with a reaming and collection device.

Abstract: Dynamic, asymmetric rings and related communication equipment and methods are disclosed. Various features may be implemented to provide any or all of several degrees of freedom for managing resources in a communication network. Communication rates may be optimized on a node-to-node basis or overall on a network level. Different rates may be configured and possibly dynamically adjusted between different nodes, and/or for different directions of traffic transfer. Bandwidth can be dynamically allocated along a string of the communication nodes in a ring or linear topology in some embodiments. Direction of traffic transfer represents an additional possible degree of freedom in a ring topology, in that traffic can be transferred in either direction in a ring, such as the direction of least delay.

Abstract: Apparatus and methods relating to bonded interconnection of local communication networks are disclosed. Bonded communication links, including multiple constituent links that have been bonded together, are terminated to enable communications over the bonded links using bandwidth available on the constituent links. A cross-connect function determines whether received communication traffic is to be forwarded to one or more of a local communication network and the terminated bonded links. The received communication traffic is forwarded in accordance with the determination. The local communication networks may include ring networks, linear networks, or both. The bonded links and links between nodes in a local communication network are bonded DSL (Digital Subscriber Line) links in some embodiments. Bonding of DSL links in this manner can be used, for instance, to extend the reach of DSL service without sacrificing bandwidth.

Abstract: The present invention relates to a light emitting diode (LED) and a flip-chip packaged LED device. The present invention provides an LED device. The LED device is flipped on and connected electrically with a packaging substrate and thus forming the flip-chip packaged LED device. The LED device mainly has an Ohmic-contact layer and a planarized buffer layer between a second-type doping layer and a reflection layer. The Ohmic-contact layer improves the Ohmic-contact characteristics between the second-type doping layer and the reflection layer without affecting the light emitting efficiency of the LED device and the flip-chip packaged LED device. The planarized buffer layer id disposed between the Ohmic-contact layer and the reflection layer for smoothening the Ohmic-contact layer and hence enabling the reflection layer to adhere to the planarized buffer layer smoothly.

Abstract: A light emitting device package structure includes at least one light emitting device, a wavelength conversion adhesive layer, and a protection element. The light emitting device has an upper surface, a lower surface opposite to the upper surface, and a side surface connecting the upper surface and the lower surface. The wavelength conversion adhesive layer is disposed on the upper surface of the light emitting device and has a first edge and a second edge opposite to each other. The protection element encapsulates the side surface of the light emitting device and the second edge of the wavelength conversion adhesive layer and exposes the lower surface of the light emitting device. A third edge of the protection element is aligned with the first edge of the wavelength conversion adhesive layer.