Abstract: Provided is a storage media, including a nonvolatile semiconductor storage device, from which data is erasable with certainty on a file-by-file basis so that files leaks are prevented to a maximum possible degree. In a file storing method for storing a file in the storage media including a nonvolatile semiconductor storage device having a plurality of erase blocks each including a plurality of memory cells from which data is erasable as a whole, (a) one file is stored to one erase block, or (b) an overwrite operation of writing prescribed data or random data to a bit of a memory cell, at which a file to be erased is stored, is performed.

Abstract: A storage medium using a nonvolatile semiconductor storage device for erasing data with certainty on a file-by-file basis and preventing an inadvertent file leak as much as possible is provided. A file erasing method includes (a) reading data other than data in a file which is a target of erase from an erase block having the file as the target of erase recorded therein; (b) writing the read data other than the data in the file which is the target of erase to another erase block; and (c) erasing all the data in the erase block in which the file as the target of erase is recorded.

Abstract: A storage medium using a nonvolatile semiconductor storage device for preventing an inadvertent file leak as much as possible is provided. A storage medium using a nonvolatile semiconductor storage device includes a control unit for writing data to memory cells which store data corresponding to files stored on the storage medium, such that all the memory cells are put into the same electronic state, or for erasing data from the memory cells, after a lapse of a set time period.

Abstract: A semiconductor device can be manufactured with a high non-defect ratio, making it possible to easily guarantee the KGD (Known-Good-Die) of semiconductor chips, when configuring one packaged semiconductor device on which a plurality of semiconductor chips is mounted. Utilizing each semiconductor chip is made possible without limits on terminal position, pitch, signal arrangement, and so on. Protrusions provided to a semiconductor chip mounted sealing sub-board are attached to a package substrate. A plurality of semiconductor bare chips is disposed in a space formed between the semiconductor chip mounted sealing sub-board and the package substrate, making wiring possible.

Abstract: A semiconductor device can be manufactured with a high non-defect ratio, making it possible to easily guarantee the KGD (Known-Good-Die) of semiconductor chips, when configuring one packaged semiconductor device on which a plurality of semiconductor chips is mounted. Utilizing each semiconductor chip is made possible without limits on terminal position, pitch, signal arrangement, and so on. Protrusions provided to a semiconductor chip mounted sealing sub-board are attached to a package substrate. A plurality of semiconductor bare chips is disposed in a space formed between the semiconductor chip mounted sealing sub-board and the package substrate, making wiring possible.

Abstract: A semiconductor device can be manufactured with a high non-defect ratio, making it possible to easily guarantee the KGD (Known-Good-Die) of semiconductor chips, when configuring one packaged semiconductor device on which a plurality of semiconductor chips is mounted. Utilizing each semiconductor chip is made possible without limits on terminal position, pitch, signal arrangement, and so on. Protrusions provided to a semiconductor chip mounted sealing sub-board are attached to a package substrate. A plurality of semiconductor bare chips is disposed in a space formed between the semiconductor chip mounted sealing sub-board and the package substrate, making wiring possible.