Abstract: A capacitive structure and technique for allowing near-instantaneous charge transport and reliable, wide-band RF ground paths in integrated circuit devices such as integrated circuit dies, integrated circuit packages, printed circuit boards, and electronic circuit substrates is presented. Methods for introducing resistive loss, dielectric loss, magnetic loss, and/or radiation loss in a signal absorption ring implemented around a non-absorptive area of one or more conductive layers of an integrated circuit structure to dampen laterally flowing Electro-Magnetic (EM) waves between electrically adjacent conductive layers of the device are also presented.

Abstract: A capacitive structure and technique for allowing near-instantaneous charge transport and reliable, wide-band RF ground paths in integrated circuit devices such as integrated circuit dies, integrated circuit packages, printed circuit boards, and electronic circuit substrates is presented. Methods for introducing resistive loss, dielectric loss, magnetic loss, and/or radiation loss in a signal absorption ring implemented around a non-absorptive area of one or more conductive layers of an integrated circuit structure to dampen laterally flowing Electro-Magnetic (EM) waves between electrically adjacent conductive layers of the device are also presented.

Abstract: A method and apparatus for sealing a package over/around a circuit is presented. A pressurized directional flow of plasma is applied between metal bonding edges of the package and a metal surface surrounding circuitry to be enclosed in the package. During the application of plasma between the bonding surfaces, a bonding devices direct contact fusion/diffusion bonds the metal bonding edges of the package to the metal bonding surface surrounding the circuitry to be enclosed.

Abstract: A method and apparatus for bonding solid sheets together is presented. A modulated directional flow of plasma is applied at and between the bonding surfaces of the sheets to be bonded prior to and during the application of pressure to compress the bonding surfaces together to form a direct contact or diffusion bond.

Abstract: A method and apparatus for bonding solid materials together is presented. A modulated directional flow of plasma is applied at and between the bonding surfaces of members to be bonded prior to and during the application of pressure to compress the bonding surfaces together to form a direct contact or diffusion bond.

Abstract: A method and apparatus for bonding solid plates together is presented. A modulated directional flow of plasma is applied at and between the bonding surfaces of the plates to be bonded prior to and during the application of pressure to compress the bonding surfaces together to form a direct contact or diffusion bond.

Abstract: The present invention is a novel technique and system that allows the pressure of a tire to be remotely monitored by sensing a tire parameter indicative of the tire's pressure without mounting any device on the tire itself, while the tire is or is not rotating. In the illustrative embodiment, a tire parameter indicative of the pressure inside the tire, such as the temperature, acoustical signature, or shape of the tire, is measured remotely with a remotely mounted sensor. The measured parameter is compared to a range of known acceptable limits for that particular parameter, and a warning signal is generated if the measured parameter is not within that range of acceptable limits.

Abstract: A method and apparatus for simultaneously cleaning and bonding a wire to a bonding surface is presented. In accordance with the invention, a gas is energized to form a plasma, which is then directed in a directional pressurized flow at the wire and bonding surface to form a dynamic plasma cleaning chamber bubble around the portion of the wire and bonding surface that are to be bonded together, and then the respective portions of the wire and bonding surface are bonded together within the plasma cleaning chamber bubble.

Abstract: A method and apparatus for simultaneously cleaning and bonding a wire to a bonding surface is presented. In accordance with the invention, a gas is energized to form a plasma, which is then directed in a directional pressurized flow at the wire and bonding surface to form a dynamic plasma cleaning chamber bubble around the portion of the wire and bonding surface that are to be bonded together, and then the respective portions of the wire and bonding surface are bonded together within the plasma cleaning chamber bubble.