Patents Assigned to G. I. Corporation
  • Patent number: 7124909
    Abstract: A container including a receptacle with a closed bottom, an interior space, and an open top encircled by a top receptacle edge, a lid for closing the top of the receptacle where the lid is pivotably attached at a portion of the top receptacle edge and includes a portion extending beyond the edge, and a pillow portion attached to the lid and dimensioned to rest within the interior space of the receptacle when the lid is closed.
    Type: Grant
    Filed: January 9, 2004
    Date of Patent: October 24, 2006
    Assignee: V V G I Corporation
    Inventor: Keith Armato
  • Patent number: 5375360
    Abstract: A recoil pad assembly (10) fitted to the stock of a weapon (W) such as a rifle or shotgun for cushioning a shooter (M) against recoil forces produced when the weapon is discharged. A first pad member (12) is installed on a butt end (E) of the stock (T) of the weapon. A second pad member (14) is pressed against a shoulder (S) of the shooter when the shooter prepares to discharge the weapon. The second pad member interfits with the first pad member for movement of the pad members relative to each other when the weapon is discharged. Compression springs (56) then restore the pad members to their original position relative to each other. A seal is effected between the pad members when the weapon is discharged trapping air between the members. Relative movement of the pad members then compresses the air producing a cushioning effect which lessens the recoil force to which the shooter is subjected.
    Type: Grant
    Filed: April 22, 1993
    Date of Patent: December 27, 1994
    Assignee: C.G.I. Corporation
    Inventor: Oskar F. Vatterott
  • Patent number: 5342805
    Abstract: This invention concerns itself with an improved method of producing sharply defined misfit dislocations; (MD) with a new, inexpensive method of doping these misfit dislocations with Au; with invention that a combination of Au and Pt doping in misfit dislocations is superior to any amount of Au and to some specific placements of the misfit dislocations in the device structure.
    Type: Grant
    Filed: July 1, 1993
    Date of Patent: August 30, 1994
    Assignee: G.I. Corporation
    Inventors: Joseph Y. Chan, Larry Laterza, Dennis Garbis, William G. Einthoven
  • Patent number: 5317825
    Abstract: A choke assembly (10) is attachable to the muzzle end of a shotgun barrel (G) to produce a tightened shot pattern when the shotgun is fired. A shotgun shell includes shot (S) and a wading (W). The wading is spun through the barrel by discharge gases created when the shell is fired, and this spinning motion tends to increase the size of the shot pattern. The choke comprises an elongate hollow tube (12) having an inner end (14) receivable in the muzzle end (M) of the barrel. An inner diameter (D1) of the tube corresponds to that of the barrel at its muzzle end. An outer end (24) of the tube extends beyond the muzzle. The inner diameter of the tube decreases from the inner to the outer end of the tube to effect a choke. The outer end of the tube also has a plurality of longitudinally extending slots (28) formed therein, these being spaced circumferentially about the tube. Discharge gases propelling the wading through the barrel tends to force the wading radially outwardly through the slots.
    Type: Grant
    Filed: March 11, 1993
    Date of Patent: June 7, 1994
    Assignee: C.G.I. Corporation
    Inventors: Oskar F. Vatterott, Robert K. Scott
  • Patent number: 5298457
    Abstract: The all epitaxial process starts with a high resistivity silicon substrate. Alternating layers of silicon and silicon-germanium are epitaxially grown on the substrate under conditions which create a region with misfit dislocations. A low resistivity silicon layer is then grown over the region. The material is inverted such that the high resistivity layer can be used to form the base of the device. The thickness of the high resistivity layer is adjusted to equal the width of the base of the semiconductor device to be fabricated.
    Type: Grant
    Filed: July 1, 1993
    Date of Patent: March 29, 1994
    Assignee: G. I. Corporation
    Inventors: William G. Einthoven, Joseph Y. Chan, Dennis Garbis