Abstract: The invention relates to a data carrier (1) having an integrated circuit (7) and at least one insulating supporting substrate (10) on which a transfer element (2) for transferring data to an external device is disposed. The integrated circuit (7) can alternatively be mounted in the data carrier (1) directly or packed in an electronic module (4). For establishing an electric connection between the integrated circuit (7) or electronic module (4) and the transfer element (2), the data carrier (1) has electroconductive surfaces (3, 17) opposite the two main faces of the electronic module (4) or integrated circuit (7). The electroconductive surfaces (3, 17) are connected with the opposing contact surfaces (5) of the electronic module (4) or the contacts (8) of the integrated circuit (7) and connected in pairs with the electroconductive surfaces (3, 17) disposed on the other side of the electronic module (4) or integrated circuit (7).