Abstract: A memory overclocking method adapted for a computer device is provided. The computer device includes a basic input output system and a memory. The memory overclocking method includes the following steps. A boot loader of the computer device is executed, and an overclocking module is executed by the basic input output system, wherein a first memory clock frequency for overclocking is preset in a serial presence detect of a memory. A second memory clock frequency by the overclocking module is generated by the overclocking module, wherein the second memory clock frequency is higher than the first memory clock frequency. Whether the second memory clock frequency meets a boot condition of the computer device is determined to decide whether to operate the memory at the second memory clock frequency. In addition, a computer device applying the memory overclocking method is also provided.

Abstract: A BIOS control method for PCI-E lanes includes the following steps. A BIOS obtains information of whether a first expansion card and a second expansion card are respectively inserted in a first PCI-E slot and a second PCI-E slot, and if the second expansion card is inserted in the second PCI-E slot, then the BIOS instructs a CPU to reverse the order of PCI-E lanes electrically connected between the CPU and the second PCI-E slot.

Abstract: A power connector includes housing, partition plate, first and second pins, first and second wires and filler. The housing has an interior space, first and second slots. The partition plate divides the interior space into first and second wire channels. Each first and second pin has an inserting portion and a wire connecting portion. The wire connecting portions of the first and second pins are respectively located in the first and second wire channels. The first and the second wires are respectively located in the first and second wire channels. The first and second wires are electrically connected to the wire connecting portions of the first and the second pins respectively. A material of the filler is different from the housing. The filler is filled in the interior space to enclose and separate the first wires and the second wires.

Abstract: An electronic system and a method for recognizing status of a power-supply device are provided. The electronic system includes a power-supply device and an electronic device. The power-supply device generates a working power and stores an accumulated operation time length and a suggested operation time length of the power-supply device. The electronic device is coupled to the power-supply device and receives the working power to perform a booting operation. The electronic device reads the accumulated operation time length and the suggested operation time length from the power-supply device and compares the accumulated operation time length and the suggested operation time length. If the accumulated operation time length is greater than or equal to the suggested operation time length, the electronic device generates a warning message to indicate that the power-supply device has reached a life time.

Abstract: A heat dissipater resilient structure is adapted to be fixed to a connector of a motherboard and for an expansion card heat dissipater to be disposed on. The heat dissipater resilient structure includes a body, an arm and a fixing member. The body is adapted to be fixed to the connector. The arm extends from the body and is bendable between a first position and a second position. The fixing member is located at the body or the arm. The expansion card heat dissipater is adapted to be fixed to the fixing member and lean against the arm to move with the arm. When pressed, the expansion card heat dissipater is adapted to move with the arm from the first position to the second position. When not pressed, the arm moves with the expansion card heat dissipater to return to the first position. A connector module is further provided.

Abstract: An assembly includes a second member and a latch. The second member has a through hole. The latch includes a hollow pillar and a bolt. The hollow pillar includes a first engaging portion and a second engaging portion opposite to each other. The hollow pillar has an inserting hole. The inserting hole passes through the first engaging portion and the second engaging portion. The first engaging portion is disposed through the through hole. The bolt is inserted into the inserting hole and is movable between a first inserting position and a second inserting position. When the bolt is moved to the second inserting position along a direction from the first engaging portion pointing to the second engaging portion, the second engaging portion is expanded by the bolt to make the size of the second engaging portion become larger.

Abstract: A connector cover module adapted to be disposed on a connector on a mother board is provided. The connector cover module includes a cover body and at least one light guide bar. The cover body includes a top surface, a plurality of lateral surfaces, and at least one arm extending from one of the lateral surfaces and bending outward to form an accommodating groove. The light guide bar is disposed beside one of the lateral surfaces, held by the arms, and located in the accommodating groove bent and formed by the arms. A cover body is further provided.

Abstract: A light guide bar adapted to be interleaved between two connectors which are disposed on a main board. Each of the connectors has a connector lateral wall. At least one connector includes a positioning protrusion. The light guide bar includes a body. The body includes two opposite light guide bar lateral walls and at least one positioning recess. Each positioning recess is formed on one of the light guide bar lateral walls. The at least one positioning recess is adapted to be positioned on the positioning protrusion of the at least one connector. A connector assembly having the light guide bar and the two connectors is further provided.

Abstract: A server device includes a chassis and at least one server assembly. The chassis has at least one accommodating space, at least one first surface, at least one second surface, at least one opening and at least one front side. The first surface and the second surface face each other, and respectively located at two opposite sides of the accommodating space. The opening is located at the front side and connected to the accommodating space. The server assembly is slidably disposed in the accommodating space from the opening. The server assembly includes a first server and a second server. The first server is closer to the first surface than the second server. The first surface and the front side are orthogonal to a reference plane. An orthogonal projection of the first server on the reference plane partially overlaps an orthogonal projection of the second server on the reference plane.

Abstract: A light guide heat dissipation module includes a first heat dissipation member, a second heat dissipation member, a light guide member, and a light source assembly. The first heat dissipation member includes an opening. The second heat dissipation member is thermally coupled to the first heat dissipation member. The light guide member is disposed between the first heat dissipation member and the second heat dissipation member. The opening of the first heat dissipation member exposes a portion of the light guide member. The light guide member includes a light incident surface. The light source assembly includes a light source and a pad electrically connected to the light source. The light source is disposed beside the light incident surface of the light guide member. The pad is disposed on a bottom surface of the second heat dissipation member away from the first heat dissipation member. An electronic device including the light guide heat dissipation module is further provided.

Abstract: A connector cover module adapted to be disposed on a connector on a mother board is provided. The connector cover module includes a cover body and at least one light guide bar. The cover body includes a top surface, a plurality of lateral surfaces, and at least one arm extending from one of the lateral surfaces and bending outward to form an accommodating groove. The light guide bar is disposed beside one of the lateral surfaces, held by the arms, and located in the accommodating groove bent and formed by the arms. A cover body is further provided.

Abstract: A heat dissipater resilient structure is adapted to be fixed to a connector of a motherboard and for an expansion card heat dissipater to be disposed on. The heat dissipater resilient structure includes a body, an arm and a fixing member. The body is adapted to be fixed to the connector. The arm extends from the body and is bendable between a first position and a second position. The fixing member is located at the body or the arm. The expansion card heat dissipater is adapted to be fixed to the fixing member and lean against the arm to move with the arm. When pressed, the expansion card heat dissipater is adapted to move with the arm from the first position to the second position. When not pressed, the arm moves with the expansion card heat dissipater to return to the first position. A connector module is further provided.

Abstract: A motherboard module having switchable PCI-E lanes includes a CPU, a first PCI-E slot, a second PCI-E slot, a first switch, and a second switch. 1st to a-th processor pin sets of the CPU are switchably electrically connected to 1st to a-th first PCI-E pin sets of the first PCI-E slot or (2N?a+1)th to 2N-th second PCI-E pin sets of the second PCI-E slot via the first switch to form PCI-E lanes whose number is a. (a+1)-th to 2N-th processor pin sets of the CPU are connected to the second input terminal of the second switch, and the second output terminal of the second switch is switchably electrically connected to (a+1)-th to 2N-th first PCI-E pin sets of the first PCI-E slot or 1st to (2N?a)th second PCI-E pin sets of the second PCI-E slot to form PCI-E lanes whose number is 2N?a, wherein 1<a<2N.

Abstract: A hard disk tray adapted for accommodating a hard disk having a plurality of screw holes at two sides is provided. The hard disk tray includes a body and a cover. The body includes two body lateral walls and a plurality of fixing members protruding from the two body lateral walls and corresponding to at least a part of the screw holes. The cover is pivoted to the body and includes two cover lateral walls. When the hard disk is placed in the hard disk tray, the fixing members extend into the at least a part of the screw holes, and when the cover is closed to the body, the two cover lateral walls are located outside the two body lateral walls so as to prevent the two body lateral walls from moving outwardly. A hard disk rack assembly is further provided.

Abstract: A memory clock frequency adjusting method suitable for a computer device is provided. The computer device includes a basic input output system (BIOS) and a memory. The memory clock frequency adjusting method includes following steps. A boot process of the computer device is executed, and the memory is operated at a memory clock frequency set by the BIOS. Whether the computer device is successfully booted is determined by the BIOS to decide whether the boot process of the computer device is to be re-executed. A setting of the memory clock frequency is adjusted by the BIOS when the computer device re-executes the boot process to lower the memory clock frequency, so that the memory is operated at the lowered memory clock frequency. In addition, a mainboard and a computer operating system applying the memory clock frequency adjusting method are also provided.

Abstract: A memory overclocking method adapted for a computer device is provided. The computer device includes a basic input output system and a memory. The memory overclocking method includes the following steps. A boot loader of the computer device is executed, and an overclocking module is executed by the basic input output system, wherein a first memory clock frequency for overclocking is preset in a serial presence detect of a memory. A second memory clock frequency by the overclocking module is generated by the overclocking module, wherein the second memory clock frequency is higher than the first memory clock frequency. Whether the second memory clock frequency meets a boot condition of the computer device is determined to decide whether to operate the memory at the second memory clock frequency. In addition, a computer device applying the memory overclocking method is also provided.

Abstract: A display device comprises a casing, at least one adhesive member, a display panel and a flexible frame. The casing comprises a bottom plate and a plurality of lateral plates, and the plurality of lateral plates respectively connected to sides of the bottom plate so as to form an accommodating space within. The adhesive member attaches the bottom plate. The display panel disposes in the accommodating space and attaches the adhesive member. The flexible element comprises three side bars. Each side bar comprises a support part, a side part and a cover part. The side part connects to the support part and the cover part. The three side parts respectively disposes on three adjacent sides of the display panel and a portion of the display panel is sandwiched between the support part and the cover part.

Abstract: A hard disk tray adapted for accommodating a hard disk having a plurality of screw holes at two sides is provided. The hard disk tray includes a body and a cover. The body includes two body lateral walls and a plurality of fixing members protruding from the two body lateral walls and corresponding to at least a part of the screw holes. The cover is pivoted to the body and includes two cover lateral walls. When the hard disk is placed in the hard disk tray, the fixing members extend into the at least a part of the screw holes, and when the cover is closed to the body, the two cover lateral walls are located outside the two body lateral walls so as to prevent the two body lateral walls from moving outwardly. A hard disk rack assembly is further provided.

Abstract: A connector module including a connector and a heatsink is provided. The connector includes a shaft. The heatsink includes a groove recessed in a single direction. The heatsink is adapted to move along a direction opposite to the recessed direction of the groove to insert the shaft into the groove. The shaft is pivoted in the groove so that the heatsink is adapted to pivotally rotate relative to the connector.

Abstract: A hard disk drive (HDD) tray adapted to carry a HDD includes a base and a cover pivoted to the base. The base includes a bottom plate and two base lateral plates connected to the bottom plate. The cover includes a top plate and two cover lateral plates connected to the top plate. One of each of the cover lateral plates and the corresponding base lateral plate includes a first fixing member which is retractable, and the other includes a fixing hole corresponding to the first fixing member. The HDD is located between the base and the cover. When the cover covers the base, the first fixing members extend into the corresponding fixing holes to fix the relative location of the cover and the base. When the cover is pivoted upward relative to the base, each first fixing member is drawn back along an inner wall of the fixing hole to exit the corresponding fixing hole. A HDD rack assembly is also provided.