Abstract: A fan module includes a fan, a fan frame, a pair of quick release brackets, and a connector set. The fan frame has a bottom wall and sidewalls surrounding the bottom wall to form an accommodating space. The fan is suitable for being placed in the accommodating space. The quick release brackets are assembled at two opposite sides of the fan. The connector set includes first and second connectors. The first connector is fixed at one of the quick release brackets. The second connector is fixed at the fan frame. When the fan is placed at the accommodating space, the first connector and the second connector are inserted into each other, and an orthographic projection of the first connector at the bottom wall of the fan frame falls within a range of an orthographic projection of the quick release bracket at the bottom wall of the fan frame.

Abstract: A cooling system includes a compressor, a condenser, an evaporator, a first one-way valve, and a second one-way valve. The compressor includes a compressor inlet and a compressor outlet. The condenser includes a condenser inlet and a condenser outlet, and the compressor outlet communicates with the condenser inlet. The evaporator includes an evaporator inlet and an evaporator outlet, the condenser outlet communicates with the evaporator inlet, and the evaporator outlet communicates with the compressor inlet and the condenser inlet. The first one-way valve is disposed on a first flow path between the compressor outlet and the condenser inlet. The second one-way valve is disposed on a second flow path between the evaporator outlet and the condenser inlet.

Abstract: A heat sink and an electronic device are provided. The electronic device includes a circuit board and a heat sink. The circuit board has a heat source, and the heat sink contacts the heat source to dissipate the heat. The heat sink includes a heat dissipating plate and a cover plate. The heat dissipating plate has an inlet region, an outlet region and a vaporization region between the inlet region and the outlet region. The vaporization region is disposed corresponding to the heat source. The cover plate covers on the heat dissipating plate, and a space between the cover plate and the heat dissipating plate forms a channel with an inlet and an outlet. A cooling liquid flows into the channel from the inlet, is vaporized to a gas while passing through the vaporization region, and the vaporized gas dissipates outside the channel through the outlet.

Abstract: A heat dissipation system adapted to dissipate heat for an electronic device includes a tank, a first heat exchanger, and a fluid delivery device. The tank includes a first zone and a second zone. A cooling fluid is located in the first and second zones. The electronic device is adapted to be disposed in the first zone and immersed in the cooling fluid. The first heat exchanger is located at a junction of the first and second zones to reduce a temperature of the cooling fluid. The cooling fluid flows from the first zone to the second zone through the fluid delivery device. The cooling fluid is adapted to flow to the first zone from the second zone after passing through the first heat exchanger, so as to dissipate heat for the electronic device, and then flows to the second zone through the fluid delivery device, such that a cycle is formed.