Abstract: Provided is a server cabinet, which is adapted to be connected to a liquid cooling system. The server cabinet includes a cabinet, a heat exchanger, at least two sever racks, two partitions, a first fan assembly and a second fan assembly. The cabinet includes an internal space. The internal space is a sealed space. The heat exchanger is disposed in the internal space and has a first end and a second end opposite to each other. The at least two server racks are respectively disposed on opposite sides of the heat exchanger and have multiple heat sources. The two partitions are respectively disposed between one of the at least two server racks and the heat exchanger. The first fan assembly is disposed at the first end and generates an airflow. The second fan assembly is disposed at the second end.

Abstract: A server includes a housing, a first sliding component, and a first power socket. The first sliding component is arranged in the housing and adjacent to a first side surface of the housing, and slides parallel to the first side surface. The first power socket is arranged in the first sliding component and has an opening toward a second side surface of the housing, wherein the second side surface is perpendicular to the first side surface.

Abstract: A performance control method, performed by a baseboard management controller (BMC), includes: obtaining a sensed temperature of a processor or a pulse-width modulation (PWM) chip, determining whether the sensed temperature is greater than a default temperature, lowering a underclocking standard of the PWM chip for the processor and operating power of the processor when the sensed temperature is greater than the default temperature, and increasing the underclocking standard of the PWM chip for the processor and the operating power of the processor when the sensed temperature is not greater than the default temperature.

Abstract: A connector including a main body, a connecting element and at least one reinforcing element is provided. The main body includes a connecting portion. The connecting element is connected to the main body, and the connecting element surrounds the connecting portion to form a connecting opening. The connecting element includes an inner surface facing the connecting portion. At least one reinforcing element is connected to the inner surface of the connecting element and extends along a plugging direction of the connecting portion.

Abstract: A fan module includes a fan, a fan frame, a pair of quick release brackets, and a connector set. The fan frame has a bottom wall and sidewalls surrounding the bottom wall to form an accommodating space. The fan is suitable for being placed in the accommodating space. The quick release brackets are assembled at two opposite sides of the fan. The connector set includes first and second connectors. The first connector is fixed at one of the quick release brackets. The second connector is fixed at the fan frame. When the fan is placed at the accommodating space, the first connector and the second connector are inserted into each other, and an orthographic projection of the first connector at the bottom wall of the fan frame falls within a range of an orthographic projection of the quick release bracket at the bottom wall of the fan frame.

Abstract: A cooling system includes a compressor, a condenser, an evaporator, a first one-way valve, and a second one-way valve. The compressor includes a compressor inlet and a compressor outlet. The condenser includes a condenser inlet and a condenser outlet, and the compressor outlet communicates with the condenser inlet. The evaporator includes an evaporator inlet and an evaporator outlet, the condenser outlet communicates with the evaporator inlet, and the evaporator outlet communicates with the compressor inlet and the condenser inlet. The first one-way valve is disposed on a first flow path between the compressor outlet and the condenser inlet. The second one-way valve is disposed on a second flow path between the evaporator outlet and the condenser inlet.

Abstract: A fan module includes a fan, a fan frame, a pair of quick release brackets, and a connector set. The fan frame has a bottom wall and sidewalls surrounding the bottom wall to form an accommodating space. The fan is suitable for being placed in the accommodating space. The quick release brackets are assembled at two opposite sides of the fan. The connector set includes first and second connectors. The first connector is fixed at one of the quick release brackets. The second connector is fixed at the fan frame. When the fan is placed at the accommodating space, the first connector and the second connector are inserted into each other, and an orthographic projection of the first connector at the bottom wall of the fan frame falls within a range of an orthographic projection of the quick release bracket at the bottom wall of the fan frame.

Abstract: A cooling system includes a compressor, a condenser, an evaporator, a first one-way valve, and a second one-way valve. The compressor includes a compressor inlet and a compressor outlet. The condenser includes a condenser inlet and a condenser outlet, and the compressor outlet communicates with the condenser inlet. The evaporator includes an evaporator inlet and an evaporator outlet, the condenser outlet communicates with the evaporator inlet, and the evaporator outlet communicates with the compressor inlet and the condenser inlet. The first one-way valve is disposed on a first flow path between the compressor outlet and the condenser inlet. The second one-way valve is disposed on a second flow path between the evaporator outlet and the condenser inlet.

Abstract: A heat sink and an electronic device are provided. The electronic device includes a circuit board and a heat sink. The circuit board has a heat source, and the heat sink contacts the heat source to dissipate the heat. The heat sink includes a heat dissipating plate and a cover plate. The heat dissipating plate has an inlet region, an outlet region and a vaporization region between the inlet region and the outlet region. The vaporization region is disposed corresponding to the heat source. The cover plate covers on the heat dissipating plate, and a space between the cover plate and the heat dissipating plate forms a channel with an inlet and an outlet. A cooling liquid flows into the channel from the inlet, is vaporized to a gas while passing through the vaporization region, and the vaporized gas dissipates outside the channel through the outlet.

Abstract: A two-phase immersion-cooling system, adapted for accommodating and cooling at least one heat source, includes a container, a pressure vessel, and a vapor compressor, the container includes a liquid-storing area and a vapor area, the liquid-phase coolant is configured for in thermal contact with at least one heat source and to be vaporized into a gas-phase coolant towards the vapor area and mixed with an air and a water vapor in the vapor area into a mixed gas. The pressure vessel is connected to the vapor area via a gas channel, the vapor compressor is disposed on the gas channel and configured to draw the mixed gas in the vapor area so as to decrease pressure of the vapor area and to inject the mixed gas into the pressure vessel so as to increase pressure of the pressure vessel.

Abstract: A heat dissipation system adapted to dissipate heat for an electronic device includes a tank, a first heat exchanger, and a fluid delivery device. The tank includes a first zone and a second zone. A cooling fluid is located in the first and second zones. The electronic device is adapted to be disposed in the first zone and immersed in the cooling fluid. The first heat exchanger is located at a junction of the first and second zones to reduce a temperature of the cooling fluid. The cooling fluid flows from the first zone to the second zone through the fluid delivery device. The cooling fluid is adapted to flow to the first zone from the second zone after passing through the first heat exchanger, so as to dissipate heat for the electronic device, and then flows to the second zone through the fluid delivery device, such that a cycle is formed.