Abstract: A digital controlled multi-light driving apparatus for driving and controlling a plurality of lights. The digital controlled multi-light driving apparatus includes a plurality of oscillation step-up circuits and a digital control circuit. The digital control circuit has a counter unit, a memory unit, a comparator unit, and a driving unit. The counter unit starts counting to generate a counting value whenever a digital start signal is generated. The memory unit stores at least one target counting value. The comparator unit is electrically connected to the counter unit and the memory unit to generate triggering signals whenever the counting value matches the target counting value.

Abstract: A method of manufacturing a glass circuit board includes the steps of: providing a glass substrate; forming a patterned metal layer on a surface of the glass substrate to expose a part of the surface; forming an insulating layer, with at least one opening, on the surface of the glass substrate and the patterned metal layer; and forming a metal connecting layer in the opening of the insulating layer. A glass circuit board manufactured by the method includes a glass substrate, a patterned metal layer, an insulating layer and a metal connecting layer. The glass substrate has a surface. The patterned metal layer is disposed on the surface of the glass substrate. The insulating layer is disposed on a part of the surface of the glass substrate and the patterned metal layer, and has at least one opening. The metal connecting layer is disposed in the opening of the insulating layer.

Abstract: A manufacturing method of a glass circuit board includes the steps of providing a glass substrate; forming a metal layer on a surface of the glass substrate; forming a metal connecting layer on the metal layer; patterning the metal layer and the metal connecting layer to expose a part of the surface of the glass substrate; and forming an insulation layer with at least one opening on the patterned metal connecting layer and the exposed part of the surface. A glass circuit board is also disclosed, which includes a glass substrate, a patterned metal layer, a patterned metal connecting layer and an insulation layer. The glass substrate has a surface. The patterned metal layer is disposed on the surface of the glass substrate, and a part of the surface is exposed from the patterned metal layer. The patterned metal connecting layer is disposed on the patterned metal layer.

Abstract: A method for driving an LCD includes a first brightness adjusting step and a second brightness adjusting step. In the first brightness adjusting step, the relative brightness of a plurality of light-emitting units is adjusted, so that the screen of the LCD presents a dark zone. The dark zone is caused by the brightness distribution of the light-emitting units and includes a scan line being activated. In the second brightness adjusting step, the relative brightness of the light-emitting units is readjusted after a specific scan timing. Therefore, the dark zone is shifted such that another scan line, which is being activated, is located in the shifted dark zone. Furthermore, a multi-light driving device and an LCD with the multi-light driving device and driven by the method are disclosed.

Abstract: A flip-chip attach method includes the steps of: attaching a chip on a transparent substrate such that each connecting pad of the chip is aligned with each electrical connection pad on the transparent substrate; and irradiating each connecting pad and each electrical connection pad from a side of the transparent substrate with a laser beam so as to weld the connecting pad to the electrical connection pad. Furthermore, the invention also provides a flip-chip attach structure including a transparent substrate and at least one chip. A surface of the transparent substrate is formed with a plurality of electrical connection pads, and the chip has a plurality of connecting pads. The connecting pads and the electrical connection pads are irradiated with a laser beam and are welded to each other. Thus, the chip is mounted to the transparent substrate.

Abstract: An optoelectronics processing module includes a transparent substrate and at least one optoelectronics component. One surface of the transparent substrate is formed with a plurality of first pads and a plurality of second pads. The optoelectronics component mounted on the transparent substrate has a plurality of connecting pads, which is irradiated with a laser beam and is then connected with the first pads.

Abstract: A multi-chip package includes a transparent substrate, at least two chips, a plurality of connecting terminals, and a molding compound. In this case, the transparent substrate has a conductive layer for electrical inter-connection. The chips are mounted on the transparent substrate, so that the chips and the conductive layer form a circuitry system. At least one of the chips is provided on the transparent substrate by way of flip-chip attachment. The connecting terminals electrically connect to the circuitry system through a plurality of wires. Thus, the circuitry system electrically connects to external devices with the wires and connecting terminals. The molding compound at least encapsulates the wires.