Abstract: The present invention relates to a thermosetting resin composition with excellent electrical properties comprising (a) one or more terminally unsaturated urethane resins, (b) styrene, and (c) brominated styrene. The aforementioned composition finds great utility as a printed circuit board laminate suitable for use at microwave frequencies.
Type:
Application
Filed:
June 11, 2003
Publication date:
November 20, 2003
Applicant:
GIL Technologies, a division of The Alpha Corporation
Inventors:
Scott A. Lane, Donald C. Rollen, Timothy W. Austill
Abstract: The present invention relates to a thermosetting resin composition with excellent electrical properties comprising (a) one or more terminally unsaturated urethane resins, (b) styrene, and (c) brominated styrene. The aforementioned composition finds great utility as a printed circuit board laminate suitable for use at microwave frequencies.
Type:
Application
Filed:
June 11, 2003
Publication date:
November 13, 2003
Applicant:
GIL Technologies, a division of The Alpha, Corporation
Inventors:
Scott A. Lane, Donald C. Rollen, Timothy W. Austill
Abstract: The present invention relates to a thermosetting resin composition with excellent electrical properties comprising (a) one or more terminally unsaturated urethane resins, (b) styrene, and (c) brominated styrene. The aforementioned composition finds great utility as a printed circuit board laminate suitable for use at microwave frequencies.
Type:
Grant
Filed:
December 3, 1997
Date of Patent:
July 29, 2003
Assignee:
GIL Technologies, a division of the Alpha Corporation
Inventors:
Scott A. Lane, Donald C. Rollen, Timothy W. Austill