Abstract: A package structure and an electronic device including the package structure are disclosed. The package structure includes a substrate, a wire layer disposed on the substrate, a visual unit disposed on the substrate, and an encapsulation element disposed on the substrate. The wire layer includes a plurality of patterned circuits. The visual unit includes a first area and a second area defined along a periphery of the first area. The first area is configured with a photoelectric element, and the photoelectric element is electrically connected to and disposed corresponding to at least one of the patterned circuits. The encapsulation element completely covers the first area of the visual unit and overlaps the corresponding patterned circuit, such that an average reflectance inside the encapsulation element is greater than an average reflectance outside the encapsulation element.

Abstract: An electronic device and manufacturing method of the electronic device are disclosed. The manufacturing method includes: providing a substrate; forming a thin film circuit on the substrate, wherein the thin film circuit comprises at least one thin film transistor and at least one conductive trace; forming at least one first connection pad on the substrate, wherein the first connection pad is electrically connected with the thin film transistor through the conductive trace; disposing the substrate on a driving circuit board, wherein the driving circuit board comprises at least one second connection pad adjacent to and corresponding to the first connection pad; and forming a conductive member covering at least a part of the second connection pad and the first connection pad, wherein the second connection pad is electrically connected with the first connection pad through the conductive member.

Abstract: A light emitting apparatus receives an external power. A switching unit is electrically connected with a light emitting unit to form a serial circuit. A first electrical connection element is electrically connected with the external power and the light emitting unit. A second electrical connection element is electrically connected with the external power and the switching unit. A sensing unit is electrically connected with the first electrical connection element, the second electrical connection element and the switching unit. When filament currents flow between two electrical input terminals of the first electrical connection element and between two electrical input terminals of the second electrical connection element, the sensing unit controls the switching unit to turn on to enable the light emitting unit to receive the external power and start to emit light. Thus, users can avoid the risk of electric shock when installing the light emitting apparatus.

Abstract: A display apparatus comprises a substrate, a plurality of scan lines, a plurality of data lines crossing the scan lines on the substrate, a plurality of light emitting units disposed in a display area of the substrate and at least a control integrated circuit (IC) chip. The control IC chip is disposed within the display area of the substrate and electrically connected to at least one of the scan lines and at least one of the data lines. The light emitting units are electrically connected to at least one of the control IC chip, which is controlled by at least one of the scan lines and receives a data signal from at least one of the data lines to control the luminous states of the light emitting units according to the data signal.

Abstract: A light emitting device is electrically connected to a three-phase AC power source and comprises three light emitting modules. The light emitting modules respectively receives three phase power sources of the three-phase AC power source. Each of the light emitting modules includes a light emitting unit and a control circuit electrically connected to the light emitting unit. Each of the control circuits controls the light output power of the corresponding light emitting unit according to the voltage variation or phase variation of the received phase power source, and the three light emitting modules are collectively kept a stable gross light output power.

Abstract: A light-emitting apparatus includes a substrate, at least one light emitting diode (LED) die, a sealant align layer, and a first sealant. The substrate has a die disposing area. The LED die is disposed on the die disposing area. The sealant align layer is disposed on the substrate. The first sealant at least partially covers the LED die and contacts with the sealant align layer. The light-emitting apparatus can avoid the light emitted from the LED die to be blocked and can have higher light efficiency.

Abstract: A light emitting apparatus receives an external power and includes a light-emitting unit, two rectifiers, a first electrical connection element and a second electrical connection element. Each of the rectifiers has a first input terminal, a second input terminal, an output terminal and a ground terminal. The output terminals are electrically connected together and are electrically connected with the light-emitting unit. The first electrical connection element is electrically connected with the external power and the first input terminals. The second electrical connection element is electrically connected with the external power and the second input terminals. The light emitting apparatus can replace the traditional fluorescent tube without changing the circuit of the lighting.

Abstract: A light emitting unit includes a substrate, a first reflecting element, a light-emitting diode (LED), and a second reflecting element. At least one part of the substrate is light permeable. The LED is disposed between the substrate and the first reflecting element, and the first and second reflecting elements are disposed on two opposite sides of the substrate, respectively.

Abstract: A single-stage AC to DC conversion device includes an energy storage unit, a magnetic unit, and a switch unit. The magnetic unit electrically connects the energy storage unit with the switch unit, and has a core, a first winding, a second winding, a third winding, and at least one output winding. The first winding couples with the core and transfers a first electric energy to the core. The second winding couples with the core and stores a second electric energy in the energy storage unit. The third winding couples with the core and transfers the second electric energy to the core. The output winding couples with the core that transfers the first electric energy and the second electric energy, and outputs a third electric energy through the output winding.

Abstract: A die bonding apparatus cooperates to a die and a substrate having a die bonding surface. The die bonding apparatus includes a carrier, a die ejecting mechanism and a substrate holding mechanism. The carrier carries the die. The die ejecting mechanism has at least one ejecting unit. The substrate holding mechanism holds the substrate and is disposed opposite to the die ejecting mechanism. The substrate and the carrier move relatively to each other in two dimensions on a plane parallel to the die-bonding surface. The carrier is located between the die ejecting mechanism and the substrate. The ejecting unit pushes against the carrier for transferring the die on the carrier onto the die bonding surface of the substrate.

Abstract: A light emitting diode (LED) unit includes a carrier, a plurality of LED dies, a reflecting element and a molding material. A length-width ratio of the carrier is greater than or equal to 5. The LED dies are disposed on the carrier along a longitudinal direction of the carrier. The reflecting element has two reflecting portions disposed on the carrier along the longitudinal direction. The LED dies are disposed between the reflecting portions. The molding material covers the LED dies and contacts with the reflecting element.

Abstract: A light emitting apparatus includes a substrate, at least one LED (light-emitting diode) die, a sealant, a cover sheet and a protecting material. The LED die is disposed on the substrate. The sealant covers the LED die and has a top surface and a side surface. The cover sheet is disposed on the top surface of the sealant. The protecting material is disposed at the side surface, and connected with the cover sheet and the substrate. Accordingly, the light emitting apparatus can prevent from moisture or gas that may affect the luminous efficiency thereof, thereby extending the lifetime of the light emitting apparatus.

Abstract: A back plate of a light emitting unit includes a bottom plate, a plurality of first extruding elements, a plurality of second extruding elements and a plurality of connecting elements. The first extruding elements are respectively disposed on two opposite edges of the bottom plate, and the second extruding elements are respectively disposed on the other two opposite edges of the bottom plate. Each of the connecting elements connects the corresponding first and second extruding elements. The first extruding elements, the second extruding elements and the connecting elements form a closed region.