Patents Assigned to GITech Inc.
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Patent number: 11870185Abstract: A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. One or more signal pins in a contact array are electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins.Type: GrantFiled: March 18, 2023Date of Patent: January 9, 2024Assignee: GITech, Inc.Inventor: John Williams
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Patent number: 11715912Abstract: A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. Embodiments provide one or more signal pins in a contact array electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins.Type: GrantFiled: August 2, 2022Date of Patent: August 1, 2023Assignee: GITech, Inc.Inventor: John Williams
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Patent number: 11626696Abstract: A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. One or more signal pins in a contact array are electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins.Type: GrantFiled: April 29, 2021Date of Patent: April 11, 2023Assignee: GITech, Inc.Inventor: John Williams
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Patent number: 11619653Abstract: A testing apparatus comprises a tester base, a supporting member, a frame, one or more electrical connectors and an upper cover. Each electrical connector includes a set of contact members that are positioned on a substrate and having first and second arm portions made of an electrically conductive material. The one or more electrical connectors are mounted on top of ribs in the supporting members and each of the electrical connectors is separated from an adjacent electrical connector by a respective pair of protrusions formed on opposite sides of the frame. Each of the second arm portions of the set of contact members of each electrical connector are disposed in a respective through hole formed in a panel of the supporting member.Type: GrantFiled: May 24, 2021Date of Patent: April 4, 2023Assignee: GITech Inc.Inventor: John Williams
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Patent number: 11522306Abstract: An electrical connector including a substrate, a pitch transformation routing assembly formed on the substrate and including pitch transformation routing members, a first set of contact members, each contact member extends away from a first end of a corresponding pitch transformation routing member, and a second set of contact members, each contact member extends away from a second end of a corresponding pitch transformation routing member. A first subset of the pitch transformation routing members each includes a first routing section extending in a first direction and a second routing section extending in a second direction. A pitch of the first set of contact members associated with the first subset of the pitch transformation routing members is different from a pitch of the second set of contact members associated with the first subset of the pitch transformation routing members.Type: GrantFiled: February 19, 2021Date of Patent: December 6, 2022Assignee: GITech Inc.Inventor: John Williams
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Publication number: 20220352678Abstract: A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. One or more signal pins in a contact array are electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins.Type: ApplicationFiled: April 29, 2021Publication date: November 3, 2022Applicant: GITech, Inc.Inventor: John Williams
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Patent number: 11411351Abstract: A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. Embodiments provide one or more signal pins in a contact array electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins.Type: GrantFiled: December 27, 2020Date of Patent: August 9, 2022Assignee: GITech, Inc.Inventor: John Williams
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Publication number: 20220209466Abstract: A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. Embodiments provide one or more signal pins in a contact array electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins.Type: ApplicationFiled: December 27, 2020Publication date: June 30, 2022Applicant: GITech, Inc.Inventor: John Williams
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Publication number: 20220022348Abstract: A scalable, detachable interconnect system is provided that includes a shielded-frame structure having alignment features that forms a separable interconnect assembly which can be used to electrically couple at least two semiconductor devices. The interconnect system functions to protect, secure, and align electrical contacts on a first and a second semiconductor device coupled together. In this manner, the interconnect assembly realizes an electrical-mechanical interposer system that can securely connect semiconductor devices (e.g., printed circuit boards and semiconductor device packages) together while presenting electrical optimization features such as internal ground shielding and mechanical properties such as resilience, compliance, reusability, and reliable scrub motion to remove oxide from the pads or bumps.Type: ApplicationFiled: July 9, 2021Publication date: January 20, 2022Applicant: GITech, Inc.Inventor: John Williams
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Patent number: 11067603Abstract: An electrical connector comprises a bottom assembly extending in a first direction, a first contact assembly, a first substrate assembly, a second contact assembly, a second substrate assembly, a third contact assembly, a top assembly and a plurality of conductive vias. The bottom assembly, the first contact assembly, the first substrate assembly, the second contact assembly, the second substrate assembly, the third contact assembly, and the top assembly are arranged in a second direction. The plurality of conductive vias extends in the second direction to penetrate the bottom assembly, the first substrate assembly, the second substrate assembly, and the top assembly. Each of the contact member of the first contact assembly, the second contact assembly, and the third contact assembly are of a letter V shape.Type: GrantFiled: April 25, 2019Date of Patent: July 20, 2021Assignee: GITech Inc.Inventor: John Williams
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Patent number: 11047878Abstract: An electrical connector comprises a substrate, a datum reference position, a first plurality of intermediary members, and a first plurality of contact members. Each contact member has first and second arms extending away from a base towards opposite side surfaces to form a letter V with an opening facing the datum reference position. A connector array comprises one or more of the electrical connectors. A testing apparatus comprises a tester base, a supporting member, a frame, one or more of the connector arrays, and an upper cover.Type: GrantFiled: January 13, 2019Date of Patent: June 29, 2021Assignee: GITech Inc.Inventor: John Williams
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Patent number: 10985480Abstract: An electrical connector comprises a plurality of substrates, a first plurality of spacers, a second plurality of spacers, a plurality of pitch transformation routing assemblies, and a plurality of contact assemblies. The plurality of substrates each extends along a first direction. Each of the second plurality of spacers and a respective spacer of the first plurality of spacers connect a respective substrate of the plurality of substrates to a respective adjacent substrate of the plurality of substrates. Each of the plurality of pitch transformation routing assemblies is surrounded by a corresponding substrate of the plurality of substrates, a corresponding spacer of the first plurality of spacers, a corresponding adjacent substrate of the plurality of substrates, and a corresponding spacer of the second plurality of spacers.Type: GrantFiled: July 16, 2019Date of Patent: April 20, 2021Assignee: GITech Inc.Inventor: John Williams
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Publication number: 20210055329Abstract: An electrical connector comprises a bottom assembly, a first contact assembly, a first substrate assembly, a second contact assembly, a second substrate assembly, a third contact assembly, a top assembly and a plurality of conductive vias. The bottom assembly, the first contact assembly, the first substrate assembly, the second contact assembly, the second substrate assembly, the third contact assembly, and the top assembly are arranged in the given order. The plurality of conductive vias penetrate the bottom assembly, the first substrate assembly, the second substrate assembly, and the top assembly. Each of the contact member of the first contact assembly, the second contact assembly, and the third contact assembly are of a letter V shape.Type: ApplicationFiled: April 25, 2019Publication date: February 25, 2021Applicant: GITech Inc.Inventor: John Williams
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Publication number: 20200343658Abstract: An electrical connector comprises a plurality of substrates, a first plurality of spacers, a second plurality of spacers, a plurality of pitch transformation routing assemblies, and a plurality of contact assemblies. The plurality of substrates each extends along a first direction. Each of the second plurality of spacers and a respective spacer of the first plurality of spacers connect a respective substrate of the plurality of substrates to a respective adjacent substrate of the plurality of substrates. Each of the plurality of pitch transformation routing assemblies is surrounded by a corresponding substrate of the plurality of substrates, a corresponding spacer of the first plurality of spacers, a corresponding adjacent substrate of the plurality of substrates, and a corresponding spacer of the second plurality of spacers.Type: ApplicationFiled: July 16, 2019Publication date: October 29, 2020Applicant: GITech Inc.Inventor: John Williams
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Publication number: 20200227844Abstract: An electrical connector comprises a plurality of substrates, a first plurality of spacers, a second plurality of spacers, a plurality of pitch transformation routing assemblies, and a plurality of contact assemblies. The plurality of substrates each extends along a first direction. Each of the second plurality of spacers and a respective spacer of the first plurality of spacers connect a respective substrate of the plurality of substrates to a respective adjacent substrate of the plurality of substrates. Each of the plurality of pitch transformation routing assemblies is surrounded by a corresponding substrate of the plurality of substrates, a corresponding spacer of the first plurality of spacers, a corresponding adjacent substrate of the plurality of substrates, and a corresponding spacer of the second plurality of spacers.Type: ApplicationFiled: July 16, 2019Publication date: July 16, 2020Applicant: GITech Inc.Inventor: John Williams
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Publication number: 20190391180Abstract: An electrical connector comprises a bottom assembly, a first contact assembly, a first substrate assembly, a second contact assembly, a second substrate assembly, a third contact assembly, a top assembly and a plurality of conductive vias. The bottom assembly, the first contact assembly, the first substrate assembly, the second contact assembly, the second substrate assembly, the third contact assembly, and the top assembly are arranged in the given order. The plurality of conductive vias penetrate the bottom assembly, the first substrate assembly, the second substrate assembly, and the top assembly. Each of the contact member of the first contact assembly, the second contact assembly, and the third contact assembly are of a letter V shape.Type: ApplicationFiled: April 25, 2019Publication date: December 26, 2019Applicant: GITech Inc.Inventor: John Williams
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Publication number: 20190331712Abstract: An electrical connector comprises a substrate, a datum reference position, a first electrical terminal, a second electrical terminal, a first plurality of intermediary members, a first plurality of contact members, a second plurality of intermediary members, and a second plurality of contact members. The first plurality of intermediary members is between the first electrical terminal and the datum reference position. The second plurality of intermediary members is between the second electrical terminal and the datum reference position. A connector array comprises one or more of the electrical connectors. A testing apparatus comprises a tester base, a supporting member, a frame, one or more of the connector arrays, and an upper cover.Type: ApplicationFiled: January 13, 2019Publication date: October 31, 2019Applicant: GITech Inc.Inventor: John Williams