Abstract: An acoustic board having displaced and passably abutted multiple through-holes comprises an outer surface and an inner surface, in which the first through-holes formed from the outer surface toward the inner surface and the second through-holes formed from the inner surface toward the outer surface are displaced and passably abutted thereby conjunctively constituting acoustically absorptive micro-orifices. Herein at least some of the second through-holes have a cross-sectional area of greater than 1 mm2 and are displaced and passably abutted to at least some of the first through-holes, thereby collectively forming a plurality of acoustically absorptive micro-orifices having a cross-sectional area of smaller than 1 mm2, and, in comparison with the total area of the acoustic board, the opening rate for the sum of the cross-sectional areas of all such acoustically absorptive micro-orifices is less than 3%.

Abstract: A plastic lamp base includes an insulated body defining therein an enabling channel which extends from a bottom end thereof. Also, the insulated body defines therein an auxiliary channel which extends from a mounting end thereof to communicate with the enabling channel. The enabling channel and the auxiliary channel are filled with a conductive plastic to form a zigzag electrical conductor, which has one end exposed at the bottom end of the insulated body and has an opposite end exposed at the mounting end of the insulated body and electrically connected to one contact of an LED component. A ground electrical conductor, being electrically insulated from the zigzag electrical conductor, has one end exposed at the outer surface of the insulated body and has an opposite end exposed at the mounting end of the insulated body and electrically connected to the other contact of the LED component.

Abstract: A thermal exchange food processing device includes a thermal conductive body, a thermal insulation layer and a phase change material. The thermal conductive body has an acting region and an inner thermal conductive region corresponding to, and in thermal connection with, the acting region. The thermal insulation layer has a lower thermal conductivity coefficient than the thermal conductive body and encapsulates, at least in part, the thermal conductive body, so that the acting region of the thermal conductive body is exposed while the remaining regions of the thermal conductive body other than the acting region are thermally insulated from ambient temperature. The thermal conductive body, alone or together with the thermal insulation layer, defines an accommodation space, and the inner thermal conductive region is situated to face the accommodation space. The phase change material is within the accommodation space.

Abstract: A thermal exchange food processing device is comprised of a thermal conductive body, thermal insulation layer and phase change material. The thermal conductive body consists of an acting region and an inner thermal conductive region disposed in accordance to and in thermal connection to the acting region. The thermal insulation layer has a lower thermal conductivity coefficient compared with the thermal conductive body and encapsulates at least in part the thermal conductive body, so that the acting region of the thermal conductive body is exposed while remaining regions of the thermal conductive body other than the acting region are thermally insulated from ambient temperature; wherein the thermal conductive body alone or together with the thermal insulation layer defines an accommodation space and the inner thermal conductive region is disposed to face the accommodation space; and the phase change material disposed within the accommodation space.