Abstract: In a device for encapsulating blanks of metallic high temperature alloys, particularly TiAL alloys, which are subjected to forging or rolling for hot forming, at least a first inner envelope is supported on the blank in closely spaced relationship therefrom and a second envelope surrounds the first envelope and both envelopes consist of a metallic material.
Type:
Grant
Filed:
April 22, 2000
Date of Patent:
July 16, 2002
Assignee:
GKSS-Forschungszentrum Gaesthacht GmbH
Inventors:
Fritz Appel, Uwe Lorenz, Michael Oehrling, Richard Wagner