Patents Assigned to GLOBAL SCIENTIFIC
  • Publication number: 20140098002
    Abstract: An antenna module includes a printed circuit board, multiple conductive clamps bonded to the printed circuit board, each conductive clamp having elastic clamping arms at two opposite lateral sides thereof, and an antenna inserted in between the clamping arms of each conductive clamp and secured and electrically conducted to the printed circuit board by the conductive clamps for signal feed-in and grounding.
    Type: Application
    Filed: February 26, 2013
    Publication date: April 10, 2014
    Applicants: UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD., UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
    Inventors: Cheng-Ta LI, Jui-Chih CHIEN, Hung-Wei CHIU, UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD.
  • Publication number: 20140084483
    Abstract: A package structure comprises a substrate, a plurality of first electronic components, at least a second electronic component, a first covering layer and a wiring layer. A surface of the substrate includes a first region and a second region. The first electronic components are disposed in the first region, wherein at least one of the first electronic components has a first conductive contact. The second electronic component is disposed in the second region. The first covering layer includes a recess and a first exposing region for exposing the first conductive contact. The wiring layer is formed on the recess and electronically coupled to the first conductive contact.
    Type: Application
    Filed: January 17, 2013
    Publication date: March 27, 2014
    Applicants: Universal Global Scientific Industrial Co., Ltd., Universal Scientific Industrial (Shanghai) Co., Ltd.
    Inventors: JENCHUN CHEN, HSIN CHIN CHANG
  • Publication number: 20140085857
    Abstract: An electronic module includes a circuit board, a plurality of electronic components, a plurality of molding layers, at least one first conductive layer, at least one insulating filler, and one second conductive layer. The circuit board has a first plane and at least one grounding pad on the first plane. The electronic components are mounted on the first plane and electrically connected with the circuit board. The molding layers cover the electronic components and the first plane. The trench appears between two adjacent molding layers. The grounding pad is positioned at the bottom of the trench. The first conductive layer covers the sidewall of the trench and the grounding pad. The grounding pad electrically connected with the first conductive layer. The insulating filler is positioned in the trench. The second conductive layer covers the molding layers and the insulating filler, and electrically connects with the first conductive layer.
    Type: Application
    Filed: January 23, 2013
    Publication date: March 27, 2014
    Applicants: UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD., UNIVERSAL SCIENTIFIC INDUSTRIAL ( SHANGHAI ) CO., LTD.
    Inventors: UNIVERSAL SCIENTIFIC INDUSTRIAL ( SHANGHAI ) CO., LTD., UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD.
  • Publication number: 20140070395
    Abstract: An electronic device and the manufacturing method thereof are provided. The method comprises providing a module, in which the module includes a substrate, at least one component mounted on the substrate and a molding, and the molding encapsulates the component and a portion of the substrate; forming a first hole to expose a ground pad of the component; forming a first conductive layer which covers the module and is electrically connected to the ground pad.
    Type: Application
    Filed: January 20, 2013
    Publication date: March 13, 2014
    Applicants: UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD., UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
    Inventor: JEN-CHUN CHEN
  • Publication number: 20140047932
    Abstract: A method and system for locating subsurface ore bodies. Samples of near surface soil are collected over a predetermined geographical area. The samples are analysed to discover any chemical anomalies in the dust particles as a way of identifying possible subcropping mineralization. A tine (22) and collection tube (24) engage into subsurface soil and samples are drawn up the tube into a dust collection module (12). Sub 5 micron particles are captured on an electrostatically charged tape (40). Consecutive samples are indexed on the tape e.g. with a barcode. Collected dust samples are ablated by a laser ablation cell (72) and the ablated sample analysed by a mass spectrometer for presence of ions indicating presence of a resource body, such as a body of ore, minerals or hydrocarbons.
    Type: Application
    Filed: February 24, 2012
    Publication date: February 20, 2014
    Applicant: GLOBAL SCIENTIFIC SERVICES PTY LTD
    Inventors: Stephen Coote, John Watling
  • Patent number: 8651541
    Abstract: A holding support for electronic device is disclosed, which includes a case and a bracket. A bracket compartment is formed on the case and defined by an opening formed on the outer surface of the case. The bracket has a body and at least one finger hole formed thereon for sliding a finger through. The bracket can be retracted in or extended from the bracket compartment by being arranged at a retracted position or extended position, respectively. Therefore, the user can firmly secure the electronic device and prevent from dropping it accidentally.
    Type: Grant
    Filed: April 9, 2012
    Date of Patent: February 18, 2014
    Assignees: Universal Scientific Industrial (Shanghai) Co., Ltd., Universal Global Scientific Industrial Co., Ltd.
    Inventors: Ming-Jen Chen, Kuo-Kuang Liu
  • Publication number: 20140001471
    Abstract: A conformal shielding module comprising a substrate, at least one electronic component mounted on the substrate, and a molding compound covering the electronic component. The molding compound includes a vertical channel extending from a surface of the molding component to the electronic component, and an electrically conductive structure formed inside the vertical channel. The electrically conductive structure is electrically connected to the electronic component and includes a testing contact on the surface of the molding compound for in-circuit test of the electronic component.
    Type: Application
    Filed: June 29, 2012
    Publication date: January 2, 2014
    Applicants: UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD., UNIVERSAL SCIENTIFIC INDUSTRIAL CO., LTD.
    Inventor: Kuan-Hsing LI
  • Publication number: 20130257462
    Abstract: A package structure with conformal shielding includes a substrate providing electrically connected inner grounding structures, a chip module mounted on the substrate, a molding compound covering the chip module and one surface of the substrate, and a conductive shielding layer covering the molding compound and the lateral sides of the substrate, and electrically connected with a part of the inner grounding structures. The substrate further provides one or multiple independent conductive structures electrically connected with the conductive shielding layer and exposed to the outside. By measuring the resistance value between one independent conductive structure and the conductive shielding layer or another independent conductive structure or one ground contact and then comparing the measured resistance value with a predetermined reference value, the EMI shielding performance of the package structure is determined.
    Type: Application
    Filed: March 27, 2012
    Publication date: October 3, 2013
    Applicants: UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD., UNIVERSAL SCIENTIFIC INDUSTRIAL CO., LTD.
    Inventors: Jaw-Ming DING, Chien-Yeh Liu, Chih-Hao Chiang
  • Publication number: 20130243221
    Abstract: An exemplary embodiment illustrates an equalization pre-processing method, adapted for characterizing a second sound receptor unit in a sound receiving system based on knowing the internal structure parameters of a first sound receptor unit.
    Type: Application
    Filed: December 20, 2012
    Publication date: September 19, 2013
    Applicants: UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD., UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
    Inventors: UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD., UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD.
  • Publication number: 20130201648
    Abstract: The instant disclosure provides a self-sealed stacked structure which includes a substrate unit, a first frame, a conductive unit and a blocker unit. The substrate unit includes a first and a second substrate, and a first frame sandwiched there-between. The conductive unit includes a plurality of first conductors and second conductors electrically connecting the first substrate, the first frame and the second substrate. The first and the second conductors are in electrical connection. A blocker unit including at least two first and at least two second blockers are surroundingly arranged around the plurality of first and second conductors, respectively. The first substrate and the first frame are connected in a sealed manner through the first blockers combined by the solder, where the first frame and the second substrate are connected in a sealed manner through the second blockers combined by the solder.
    Type: Application
    Filed: May 12, 2012
    Publication date: August 8, 2013
    Applicants: UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD., UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
    Inventor: TSUNG-JUNG CHENG
  • Publication number: 20130151748
    Abstract: A structure for transmitting signals of PCI express and a method thereof provides a converting device and a high-definition multimedia interface (HDMI) cable. The converting device has a plug connector to into a PCI express slot, along with a HDMI connector. The signal converting circuit connects the signal pins of the PCI express slot to the signal pins of HDMI connector. One end of the HDMI cable is connected with the HDMI connector of the converting device. The present invention can extends the signal distance of the PCI express to exactly perform the signal test.
    Type: Application
    Filed: December 12, 2011
    Publication date: June 13, 2013
    Applicants: UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD., UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
    Inventors: JHIH-REN YANG, JU-CHI CHUNG
  • Publication number: 20130062111
    Abstract: A stacked substrate module includes a first and a second substrate. The first substrate has several pads which extend respectively from a stacked area of the first substrate to the outside of the stacked area. The second substrate has several welding areas arranged on the outer lateral side thereof; each welding area extends respectively from the outer lateral side of the second substrate to an upper and a lower surface of the second substrate. The second substrate is stacked in the stacked area of the first substrate, wherein the lateral side of the second substrate is aligned to the edge of the stacked area of the first substrate. The aforementioned pads correspond to the welding areas respectively. It is suitable to position a solder paste between the pads and the welding areas which can be reflowed to connect the pads and the welding areas.
    Type: Application
    Filed: October 27, 2011
    Publication date: March 14, 2013
    Applicants: UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD., UNIVERSAL SCIENTIFIC INDUSTRIAL ( SHANGHAI ) CO., LTD.
    Inventors: HSUN-FA LI, YUN-TSUNG LI, CHUN-CHI CHIU
  • Publication number: 20130056603
    Abstract: An angle-adjustable support includes a base, a carrier and a pivot mechanism. The base includes a sidewall and a bottom. The sidewall has a first pivot and a second pivot. The pivot mechanism pivotally connects the carrier with the base. The pivot mechanism has three working states. The carrier is locked when the pivot mechanism works in a first working state. The carrier is capable of pivoting relative to the base in a clockwise or anticlockwise when the pivot mechanism works in a second working state. The carrier is free to rotate when the pivot mechanism works in a third working state.
    Type: Application
    Filed: April 24, 2012
    Publication date: March 7, 2013
    Applicants: Universal Global Scientific Industrial Co., Ltd., Universal Scientific Industrial (Shanghai) Co., Ltd.
    Inventors: YU-CHEN CHU, CHANG-CHENG LIN, KUO-KUANG LIU
  • Publication number: 20130044454
    Abstract: The instant disclosure relates to an angle adjustable device, which includes: a base having a fixing member disposed thereon, where the fixing member has a fixing surface; a switch mechanism having a locking ring, a first gear, and a second gear, while at least one block protrudes from the inner surface of the locking ring, with the first gear having a contact incline slidingly abutted by the block, where the contact incline is defined with a first end and a second end, where the first gear is received by the locking ring and capable of meshing with the second gear; and a rotator having at least one connecting member connected to the second gear. The instant disclosure also discloses an electronic display unit using the same.
    Type: Application
    Filed: April 19, 2012
    Publication date: February 21, 2013
    Applicants: UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD., UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
    Inventors: CHANG-CHENG LIN, MING-JEN CHEN, KUO-KUANG LIU
  • Publication number: 20130043693
    Abstract: The instant disclosure relates to a holding support for electronic device, which includes a case and a bracket. A bracket compartment is formed on the case and defined by an opening formed on the outer surface of the case. The bracket has a body and at least one finger hole formed thereon for sliding a finger through. The bracket can be retracted in or extended from the bracket compartment by being arranged at a retracted position or extended position, respectively. Therefore, the user can firmly secure the electronic device and prevent from dropping it accidentally.
    Type: Application
    Filed: April 9, 2012
    Publication date: February 21, 2013
    Applicants: UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD., UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
    Inventors: MING-JEN CHEN, KUO-KUANG LIU
  • Patent number: 8350373
    Abstract: A chip stacked structure and method of fabricating the same are provided. The chip stacked structure includes a first chip and a second chip stacked on the first chip. The first chip has a plurality of metal pads disposed on an upper surface thereof and grooves disposed on a side surface thereof. The metal pads are correspondingly connected to upper openings of the grooves. The second chip has a plurality of grooves on a side surface of the second chip, locations of which are corresponding to that of the grooves on the side surface of the first chip. Conductive films are formed on the grooves of the first chip and the second chip and the metal pads to electronically connect the first chip and second chip. The chip stacked structure may simplify the process and improve the process yield rate.
    Type: Grant
    Filed: March 28, 2011
    Date of Patent: January 8, 2013
    Assignees: Universal Scientific Industrial (Shanghai) Co., Ltd., Universal Global Scientific Industrial Co., Ltd.
    Inventor: Ming-Che Wu
  • Publication number: 20130003277
    Abstract: A composite stylus retaining structure for an electronic device is provided. The composite stylus retaining structure includes a stylus and a housing. The stylus includes a body, a head and a connecting rod. The housing includes a first wall and a second wall connected to each other, and a first receiving groove and a second receiving groove are formed at an intersection of the first wall and the second wall. The first receiving groove is used to receive the head. A retaining member is disposed in the first receiving groove to retain the stylus. The second receiving groove is used to receive the head of the stylus.
    Type: Application
    Filed: April 16, 2012
    Publication date: January 3, 2013
    Applicants: Universal Global Scientific Industrial Co., Ltd., Universal Scientific Industrial (Shanghai) Co., Ltd.
    Inventors: Ming-Ju LIN, Shui-Hsu Chen, Chen-Chung Yang, Chia-Sheng Liu, Jih-Sheng Li, Shih-Yen Chen
  • Publication number: 20130007724
    Abstract: A firmware repairing method for customer premises equipment (CPE) is illustrated. The method includes reading and detecting whether a first firmware is damaged, reading and loading a second firmware so as to activate network services when the first firmware damaged, and enabling communication between the CPE and an external device via a network. The CPE may be controlled by the external device for executing a repairing grogram and may receive an updated firmware from the external device for replacing the damaged first firmware.
    Type: Application
    Filed: January 30, 2012
    Publication date: January 3, 2013
    Applicants: UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD., UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
    Inventors: Yan-Cheng LAI, Yi-Chun LO
  • Patent number: 8342707
    Abstract: A multi-wavelength light-emitting module that includes a PCB, a drive IC structure, a conductive structure, a multi-wavelength LED array set, a plurality of conductive elements, and an optical amplifier structure. The PCB has at least one input/output pad. The drive IC structure is disposed on the PCB and having at least one concave groove formed on top surface thereof. The conductive structure is electrically connected between the drive IC structure and the at least one input/output pad. The multi-wavelength LED array set is received in the at least one concave groove. The conductive elements are electrically connected between drive IC structure and the multi-wavelength LED array set, respectively. The optical amplifier structure is disposed over the multi-wavelength LED array set for receiving light sources from the multi-wavelength LED array set.
    Type: Grant
    Filed: February 15, 2008
    Date of Patent: January 1, 2013
    Assignees: Universal Scientific Industrial (Shanghai) Co., Ltd., Universal Global Scientific Industrial Co., Ltd.
    Inventor: Ming-Che Wu
  • Publication number: 20120267783
    Abstract: The stacked-substrate structure includes a first substrate having a first die embedded therein, a second substrate having a second die embedded therein, a plurality of soldering elements, and a third die. The soldering elements are disposed between the first and the second substrates and connected to the first and the second substrates. The first and the second substrates are electrically connected via the soldering elements. The first substrate, the second substrate, and the soldering elements define an accommodating space. The third die is arranged in the accommodating space and is connected to one surface of the first substrate. The third die is electrically connected to the first and the second dies via the first substrate. Thus, the thickness of the stacked-substrate structure can be reduced, and the first and the second dies of the stacked-substrate structure can be test separately in different platforms.
    Type: Application
    Filed: June 2, 2011
    Publication date: October 25, 2012
    Applicants: UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD., UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
    Inventors: YU-CHENG LIU, CHIEN-NAN CHEN