Patents Assigned to Goertek lnc.
  • Publication number: 20240056736
    Abstract: The present disclosure provides a reinforcing part for a speaker diaphragm, the reinforcing part being an overlapped multilayer structure, the reinforcing part includes a heat dissipation layer as well as a first support layer and a second support layer that are fixed and bonded on surfaces of two sides of the heat dissipation layer respectively, and the first support layer and the second support layer each includes through holes penetrating the surfaces of two sides thereof, and the reinforcing part further includes fillers located within the through holes and configured for heat conduction, the fillers having thermal conductivity higher than that of the support layers.
    Type: Application
    Filed: December 20, 2018
    Publication date: February 15, 2024
    Applicant: Goertek lnc.
    Inventors: Yong Li, Cuili Zhang
  • Publication number: 20220326550
    Abstract: Disclosed is a smart head-mounted device, and the smart head-mounted device comprises at least one lens and at least one arm, the arm is connected to the lens and has a cavity therein; further comprises a sound production apparatus provided inside the cavity and dividing the cavity into a front acoustic cavity and a back acoustic cavity; a sound outlet and a main sound leakage hole provided on the arm, the sound outlet is in communication with the front acoustic cavity, and the main sound leakage hole is in communication with the back acoustic cavity.
    Type: Application
    Filed: December 26, 2019
    Publication date: October 13, 2022
    Applicant: Goertek lnc.
    Inventors: Tongyan XU, Chengxiang Zhai
  • Publication number: 20210400390
    Abstract: Disclosed is a reinforcing part for a speaker diaphragm. The reinforcing part includes a body layer, and the body layer includes through-holes penetrating surfaces of two sides of the body layer. The reinforcing part further includes fillers located within the through holes and configured for heat conduction. The fillers have a thermal conductivity higher than that of the body layer. The reinforcing part of the present invention improves the heat conduction capability between two sides of a support layer by providing through holes on the support layer and providing a heat-conducting filler within the through holes.
    Type: Application
    Filed: December 20, 2018
    Publication date: December 23, 2021
    Applicant: Goertek lnc.
    Inventors: Yong Li, Cuili Zhang