Abstract: A method for making circular diode chips which includes procedures of coating a diffused wafer with a photoresister coating and exposing it to develop the pattern; groove etching with an acid solution; removing the photoresister coating and cleaning it with deionized water; filling up the etched regions on the wafer with a glass slurry and then treating it through a glass firing process; nickel plating and sintering the wafer; mounting a sand substrate and the circular iron plates on the wafer at two opposite sides by melted wax; sand blasting the iron plate and glass substrate attached wafer and removing the iron plate so as to obtain the finished chips.