Abstract: A sheet stacking device for stacking sheets of generally rigid material, comprised of at least one gripper device operable to releasably grip an edge of a sheet material and gripper drive means operable to move the gripper device from a first location to a second location. A support device supports the sheet as the sheet moves from the first location to the second location. The support device has a supporting position, wherein the support device supports the sheet and a non-supporting position wherein support for the sheet is removed. A stacking platform is provided below the second location. Control means control the gripper device, the gripper drive means and the support device.

Abstract: A method of manufacturing a resistor foil, comprised of a copper layer having a first side and a second side. A tiecoat metal layer having a thickness of between 5 Å and 70 Å is disposed on the first side of the copper layer. A first layer of a first resistor metal having a thickness of between 100 Å and 500 Å is disposed on the tiecoat metal layer, and a second layer of a second resistor metal having a thickness of between 100 Å and 500 Å is disposed on the first layer of the first resistor metal. The first resistor metal has a resistance different from the second resistor metal.

Abstract: A resistive etching solution containing thiourea, which is particularly suitable for etching an electrically resistive material comprised of a nickel-chromium alloy. The resistive etching solution allows for fast and effective etching of a nickel-chromium alloy in cases where the ratio of (a) copper surface area to (b) nickel/chromium surface area, is relatively large, and where fine feature etching is desired.

Abstract: A method and apparatus for forming a relatively thin releasable layer of copper on a carrier substrate. First, a separation facilitating layer is provided on the carrier substrate. A layer of vapor-deposited copper is then formed over the separation facilitating layer to protect the separation facilitating layer during subsequent processing. Thereafter, the thickness of the copper layer is increased by the electrodeposition of copper onto the vapor-deposited layer. The copper layer is applied to a dielectric and is released from the carrier substrate at the separation facilitating layer.

Abstract: A composite for use in forming a multi-layer printed circuit board, comprised of an INVAR® sheet having a thickness of between 0.5 mil and 5 mil; and a layer of electrodeposited copper on at least one side thereof. The copper has a thickness of between 1&mgr; and 50&mgr;, wherein the composite has a thermal coefficient of expansion (TCE) of about 2.8 to 6.0 ppm at temperatures between 0° F. and 200° F.

Abstract: A component for use in manufacturing electronic interconnection devices, comprised of a polyimide film having a thickness of between about 12 &mgr;m and about 125 &mgr;m. A chromium tiecoat on a surface of the polyimide film, the chromium tiecoat having a thickness of between about 300 Å and about 350 Å and a copper layer on the tiecoat, the copper layer having a thickness between about 300 Å and about 70 &mgr;m.

Abstract: A composite for use in forming a multi-layer printed circuit board, comprised of an INVAR® sheet having a thickness of between 0.5 mil and 5 mil; and a layer of electrodeposited copper on at least one side thereof. The copper has a thickness of between 1&mgr; and 50&mgr;, wherein the composite has a thermal coefficient of expansion (TCE) of about 2.8 to 6.0 ppm at temperatures between 0° F. and 200° F.

Abstract: A component for use in manufacturing articles such as printed circuit boards having a sheet of copper foil and a metal sheet. One surface of each of the copper sheet and the metal sheet are essentially uncontaminated and engageable with each other at an interface. The copper sheet and the metal sheet are maintained together to define an unjoined and substantially uncontaminated central zone inwardly of the edges of the sheets. A bond is formed between the copper sheet and the metallic sheet along the peripheral edges thereof. The bond has sufficient adhesive strength to maintain the sheets together during manual handling of the component at room temperatures. The bond is temperature-sensitive, wherein the bond deteriorates when exposed to temperatures in excess of about 180° F. (about 82° C.).

Abstract: A method of applying a metal onto a copper layer, comprising the steps of: stabilizing a surface of a copper layer by applying a stabilization layer thereto, the stabilization layer comprised of zinc oxide, chromium oxide, nickel, nickel oxide or a combination thereof and having a thickness of between about 5 Å and about 70 Å; and vapor depositing a metal selected from the group consisting of aluminum, nickel, chromium, copper, iron, indium, zinc, tantalum, tin, vanadium, tungsten, zirconium, molybdenum and alloys thereof onto the stabilized surface of the copper layer, and a sheet material formed thereby.

Abstract: A sheet material, comprised of a copper foil treated to have a stabilization layer thereon. The stabilization layer is comprised of zinc oxide, chromium oxide or a combination thereof having a thickness between about 5 Å and about 70 Å. A vapor deposited resistive material is provided on the stabilization layer.

Abstract: A component for use in forming a printed circuit board comprised of a copper foil, a layer of chromium chemically deposited thereon, the layer of chromium having a thickness of less than about 0.10 &mgr;m; and a layer of electrodeposited copper on the layer of chromium, the layer of electrodeposited copper having a thickness of less than 35 &mgr;m. A nodular treatment layer is provided on the copper foil and the layer of electrodeposited copper.

Abstract: A sheet stacking device, comprised of a sheet support bed having a plurality of side-by-side rollers that are freely rotatable about an associated roller axis. A drive assembly moves the sheet support bed in a predetermined direction along a closed path. The path has a horizontal upper run and a horizontal lower run, and is dimensioned such that a space exists between the first end and the second end of the sheet support bed as the sheet support bed moves along the path.

Abstract: A resistor foil, comprised of a copper layer having a first side and a second side. An intermediate layer having a thickness of between 5 Å and 70 Å is disposed on the first side of the copper layer. A first layer of a first resistor metal having a thickness of between 50 Å and 2 &mgr;m is disposed on the intermediate layer, and a second layer of a second resistor metal having a thickness of between 50 Å and 2 &mgr;m is disposed on the first layer of the first resistor metal. The first resistor metal has a resistance different from the second resistor metal.

Abstract: A method of forming a laminate for use in the production of printed circuit boards, comprising the steps of: a) forming a component comprised of a sheet of copper foil and a sheet of metal, the sheet of copper foil having an essentially uncontaminated surface facing an essentially uncontaminated surface of the sheet of metal, the surfaces of the sheets being in unattached contact with each other in an area that defines a substantially uncontaminated zone; b) applying a preformed adhesive film formed of a substantially uncured polymeric material onto an exposed surface of the copper foil, the adhesive film having a first surface and a second surface, the film being attached to the component with the first surface in contact with an exposed surface of the copper foil; and c) curing the adhesive film, wherein the second surface of the adhesive film is at least partially uncured.

Abstract: A laminate for use as a surface laminate in a multi-layer printed circuit board. The laminate is comprised of a film substrate formed of a first polymeric material. At least one layer of a flash metal is applied to a first side of the film substrate. At least one layer of copper is disposed on the layer of flash metal. An adhesive layer formed of a second polymeric material has a first surface that is attached to a second side of the film substrate.

Abstract: An electrolytic cell comprised of a tank for holding electrolytic solution, and a drum rotatable about a horizontal axis having a non-conductive cylindrical outer surface disposed within the tank, and a plurality of elongated, like anodes arranged about the outer surface of the drum. The anodes together form a generally continuous cylindrical surface spaced from, and generally conforming to, the outer surface of the drum. Each of the anodes has at least one end projecting through the tank. A plurality of power sources is provided together with connection means for connecting groups of one or more of the projecting ends of the anodes to each power source.

Abstract: This invention relates to an improved adhesiveless flexible laminate, comprising: a polymer film having a plasma treated surface; a nickel tie coat layer comprising nickel or a nickel alloy adhered to said plasma treated surface; and a copper seed coat layer adhered to the nickel layer. In one embodiment, another layer of copper is adhered to the copper seed coat layer. This invention also relates to a process for making the foregoing adhesiveless flexible laminate, the process comprising the steps of: (A) contacting at least one side of a polymeric film with a plasma comprising ionized oxygen produced from a non-metallizing cathode to provide a plasma treated surface; (B) depositing a tie coat of nickel or nickel alloy on said plasma treated surface; and (C) depositing a seed coat layer of copper on said nickel tie coat layer. The process also includes the optional step of (D) depositing another layer of copper over the copper seed coat layer from step (C).

Abstract: This invention relates to an annealable electrodeposited copper foil having a substantially uniform unoriented grain structure that is essentially columnar grain free, said foil being characterized by a fatigue ductility of at least about 25% after being annealed at 177.degree. C. for 15 minutes. In one embodiment, the foil is annealed, said foil being characterized by a fatigue ductility of at least about 65%. The invention also relates to a process for making an electrodeposited copper foil using an electrolyte solution characterized by a critical concentration of chloride ions of up to about 5 ppm and organic additives of up to about 0.2 ppm.

Abstract: A method for determining the resistance of a shunt for use with a current limiting device that exhibits PTC characteristics to protect an electrical circuit. The method comprises steps for determining maximum and minimum resistance values based on operating criteria and component characteristics and selecting resistance values that fall within selected ranges.

Abstract: An electrolytic cell comprised of a tank for holding electrolytic solution, and a drum rotatable about a horizontal axis having a non-conductive cylindrical outer surface disposed within the tank, and a plurality of elongated, like anodes arranged about the outer surface of the drum. The anodes together form a generally continuous cylindrical surface spaced from, and generally conforming to, the outer surface of the drum. Each of the anodes has at least one end projecting through the tank. A plurality of power sources is provided together with connection means for connecting groups of one or more of the projecting ends of the anodes to each power source.