Patents Assigned to Gould Electronics Inc.
  • Publication number: 20040094890
    Abstract: A sheet stacking device for stacking sheets of generally rigid material, comprised of at least one gripper device operable to releasably grip an edge of a sheet material and gripper drive means operable to move the gripper device from a first location to a second location. A support device supports the sheet as the sheet moves from the first location to the second location. The support device has a supporting position, wherein the support device supports the sheet and a non-supporting position wherein support for the sheet is removed. A stacking platform is provided below the second location. Control means control the gripper device, the gripper drive means and the support device.
    Type: Application
    Filed: November 14, 2002
    Publication date: May 20, 2004
    Applicant: Gould Electronics Inc.
    Inventors: Maurice Chiasson, Stephen Copley, Albert Burgun
  • Patent number: 6622374
    Abstract: A method of manufacturing a resistor foil, comprised of a copper layer having a first side and a second side. A tiecoat metal layer having a thickness of between 5 Å and 70 Å is disposed on the first side of the copper layer. A first layer of a first resistor metal having a thickness of between 100 Å and 500 Å is disposed on the tiecoat metal layer, and a second layer of a second resistor metal having a thickness of between 100 Å and 500 Å is disposed on the first layer of the first resistor metal. The first resistor metal has a resistance different from the second resistor metal.
    Type: Grant
    Filed: September 22, 2000
    Date of Patent: September 23, 2003
    Assignee: Gould Electronics Inc.
    Inventors: Jiangtao Wang, Michael A. Centanni, Sidney J. Clouser
  • Publication number: 20030150840
    Abstract: A resistive etching solution containing thiourea, which is particularly suitable for etching an electrically resistive material comprised of a nickel-chromium alloy. The resistive etching solution allows for fast and effective etching of a nickel-chromium alloy in cases where the ratio of (a) copper surface area to (b) nickel/chromium surface area, is relatively large, and where fine feature etching is desired.
    Type: Application
    Filed: February 11, 2002
    Publication date: August 14, 2003
    Applicant: Gould Electronics Inc.
    Inventors: Dan Lillie, Jiangtao Wang
  • Publication number: 20030153169
    Abstract: A method and apparatus for forming a relatively thin releasable layer of copper on a carrier substrate. First, a separation facilitating layer is provided on the carrier substrate. A layer of vapor-deposited copper is then formed over the separation facilitating layer to protect the separation facilitating layer during subsequent processing. Thereafter, the thickness of the copper layer is increased by the electrodeposition of copper onto the vapor-deposited layer. The copper layer is applied to a dielectric and is released from the carrier substrate at the separation facilitating layer.
    Type: Application
    Filed: February 13, 2002
    Publication date: August 14, 2003
    Applicant: Gould Electronics Inc.
    Inventors: Jiangtao Wang, Dan Lillie, David B. Russell, Sidney J. Clouser
  • Patent number: 6589381
    Abstract: In one embodiment, the present invention relates to a method of increasing resin dust resistance of metal foil comprising contacting the metal foil with an inert silane, titanate or zirconate compound to form a resin dust resistant film having a thickness from about 0.001 microns to about 1 micron on a surface of the metal foil. In another embodiment, the present invention relates to a method of treating metal foil comprising contacting a first side of the metal foil with a hydrocarbylsilane solution to form a resin dust resistant film on a surface of the metal foil, the hydrocarbylsilane solution comprising from about 0.01% to about 10% v/v of a hydrocarbylsilane; and laminating a second side of the metal foil to a prepreg.
    Type: Grant
    Filed: April 10, 2001
    Date of Patent: July 8, 2003
    Assignee: Gould Electronics, Inc.
    Inventors: Charles A. Poutasse, Michael A. Centanni
  • Patent number: 6589413
    Abstract: A composite for use in forming a multi-layer printed circuit board, comprised of an INVAR® sheet having a thickness of between 0.5 mil and 5 mil; and a layer of electrodeposited copper on at least one side thereof. The copper has a thickness of between 1&mgr; and 50&mgr;, wherein the composite has a thermal coefficient of expansion (TCE) of about 2.8 to 6.0 ppm at temperatures between 0° F. and 200° F.
    Type: Grant
    Filed: August 9, 2001
    Date of Patent: July 8, 2003
    Assignee: Gould Electronics Inc.
    Inventors: Chin-Ho Lee, Thomas J. Ameen, John P. Callahan
  • Publication number: 20030039760
    Abstract: A component for use in manufacturing electronic interconnection devices, comprised of a polyimide film having a thickness of between about 12 &mgr;m and about 125 &mgr;m. A chromium tiecoat on a surface of the polyimide film, the chromium tiecoat having a thickness of between about 300 Å and about 350 Å and a copper layer on the tiecoat, the copper layer having a thickness between about 300 Å and about 70 &mgr;m.
    Type: Application
    Filed: September 27, 2002
    Publication date: February 27, 2003
    Applicant: Gould Electronics Inc.
    Inventors: Tad R. Bergstresser, Rocky L. Hilburn, Jerome S. Sallo
  • Publication number: 20030029730
    Abstract: A composite for use in forming a multi-layer printed circuit board, comprised of an INVAR® sheet having a thickness of between 0.5 mil and 5 mil; and a layer of electrodeposited copper on at least one side thereof. The copper has a thickness of between 1&mgr; and 50&mgr;, wherein the composite has a thermal coefficient of expansion (TCE) of about 2.8 to 6.0 ppm at temperatures between 0° F. and 200° F.
    Type: Application
    Filed: August 9, 2001
    Publication date: February 13, 2003
    Applicant: Gould Electronics Inc.
    Inventors: Chin-Ho Lee, Thomas J. Ameen, John P. Callahan
  • Publication number: 20030017357
    Abstract: A component for use in manufacturing articles such as printed circuit boards having a sheet of copper foil and a metal sheet. One surface of each of the copper sheet and the metal sheet are essentially uncontaminated and engageable with each other at an interface. The copper sheet and the metal sheet are maintained together to define an unjoined and substantially uncontaminated central zone inwardly of the edges of the sheets. A bond is formed between the copper sheet and the metallic sheet along the peripheral edges thereof. The bond has sufficient adhesive strength to maintain the sheets together during manual handling of the component at room temperatures. The bond is temperature-sensitive, wherein the bond deteriorates when exposed to temperatures in excess of about 180° F. (about 82° C.).
    Type: Application
    Filed: July 13, 2001
    Publication date: January 23, 2003
    Applicant: Gould Electronics Inc.
    Inventors: R. Richard Steiner, Robert E. Batson
  • Patent number: 6489034
    Abstract: A method of applying a metal onto a copper layer, comprising the steps of: stabilizing a surface of a copper layer by applying a stabilization layer thereto, the stabilization layer comprised of zinc oxide, chromium oxide, nickel, nickel oxide or a combination thereof and having a thickness of between about 5 Å and about 70 Å; and vapor depositing a metal selected from the group consisting of aluminum, nickel, chromium, copper, iron, indium, zinc, tantalum, tin, vanadium, tungsten, zirconium, molybdenum and alloys thereof onto the stabilized surface of the copper layer, and a sheet material formed thereby.
    Type: Grant
    Filed: February 8, 2000
    Date of Patent: December 3, 2002
    Assignee: Gould Electronics Inc.
    Inventors: Jiangtao Wang, John Callahan, Dan Lillie
  • Patent number: 6489035
    Abstract: A sheet material, comprised of a copper foil treated to have a stabilization layer thereon. The stabilization layer is comprised of zinc oxide, chromium oxide or a combination thereof having a thickness between about 5 Å and about 70 Å. A vapor deposited resistive material is provided on the stabilization layer.
    Type: Grant
    Filed: July 31, 2000
    Date of Patent: December 3, 2002
    Assignee: Gould Electronics Inc.
    Inventors: Jiangtao Wang, John Callahan, Dan Lillie
  • Publication number: 20020146556
    Abstract: A resistor foil comprised of a layer of copper foil and a coating of an organic molecular semiconductor material on one side of the copper foil.
    Type: Application
    Filed: April 4, 2001
    Publication date: October 10, 2002
    Applicant: GA-TEK Inc. (dba Gould Electronics Inc.)
    Inventors: Joel W. Pankow, Michael A. Centanni
  • Patent number: 6447929
    Abstract: A component for use in forming a printed circuit board comprised of a copper foil, a layer of chromium chemically deposited thereon, the layer of chromium having a thickness of less than about 0.10 &mgr;m; and a layer of electrodeposited copper on the layer of chromium, the layer of electrodeposited copper having a thickness of less than 35 &mgr;m. A nodular treatment layer is provided on the copper foil and the layer of electrodeposited copper.
    Type: Grant
    Filed: August 29, 2000
    Date of Patent: September 10, 2002
    Assignee: Gould Electronics Inc.
    Inventors: Jiangtao Wang, Dan Lillie, Sidney J. Clouser
  • Publication number: 20020119342
    Abstract: A component for use in manufacturing articles such as printed circuit boards, the component comprising:
    Type: Application
    Filed: February 23, 2001
    Publication date: August 29, 2002
    Applicant: GA-TEK Inc. (dba Gould Electronics Inc.)
    Inventor: R. Richard Steiner
  • Publication number: 20020088742
    Abstract: A sheet stacking device, comprised of a sheet support bed having a plurality of side-by-side rollers that are freely rotatable about an associated roller axis. A drive assembly moves the sheet support bed in a predetermined direction along a closed path. The path has a horizontal upper run and a horizontal lower run, and is dimensioned such that a space exists between the first end and the second end of the sheet support bed as the sheet support bed moves along the path.
    Type: Application
    Filed: November 5, 2001
    Publication date: July 11, 2002
    Applicant: Gould Electronics Inc.
    Inventor: Hermann Wursthorn
  • Publication number: 20020071637
    Abstract: A package for a fiber optic device or fiber optic component having at least one optical fiber extending therefrom. The package is comprised of a support substrate for supporting the optical device or optic component, the support substrate having at least one optical fiber extending therefrom. A housing surrounds the substrate and has an opening at one end. At least one optical fiber extends through the opening. A layer of metal seals the opening of each end of the tube and the glass fiber cladding where the optical fiber extends through the layer of metal.
    Type: Application
    Filed: December 11, 2000
    Publication date: June 13, 2002
    Applicant: GA-TEK Inc. (dba Gould Electronics Inc.)
    Inventors: Michael A. Centanni, Mark Kusner
  • Publication number: 20020050400
    Abstract: A component for use in forming a multi-layer printed circuit comprised of a film substrate formed of a first polymeric material. At least one layer of a flash metal is applied to a first side of the film substrate, and at least one layer of copper is applied on the layer of flash metal. A discrete area of a resistive material is disposed on a second side of the film substrate.
    Type: Application
    Filed: April 5, 2001
    Publication date: May 2, 2002
    Applicant: GA-TEK Inc. (dba Gould Electronics Inc.)
    Inventors: Mark Kusner, Michael A. Centanni
  • Publication number: 20020047773
    Abstract: A resistor foil, comprised of a copper layer having a first side and a second side. A tiecoat metal layer having a thickness of between 5 Å and 70 Å is disposed on the first side of the copper layer. A first layer of a first resistor metal having a thickness of between 100 Å and 500 Å is disposed on the tiecoat metal layer, and a second layer of a second resistor metal having a thickness of between 100 Å and 500 Å is disposed on the first layer of the first resistor metal. The first resistor metal has a resistance different from the second resistor metal.
    Type: Application
    Filed: August 2, 2001
    Publication date: April 25, 2002
    Applicant: GA-TEK Inc. (dba Gould Electronics Inc.)
    Inventors: Jiangtao Wang, Michael A. Centanni, Sidney J. Clouser
  • Publication number: 20020047771
    Abstract: A resistor foil, comprised of a copper layer having a first side and a second side. An intermediate layer having a thickness of between 5 Å and 70 Å is disposed on the first side of the copper layer. A first layer of a first resistor metal having a thickness of between 50 Å and 2 &mgr;m is disposed on the intermediate layer, and a second layer of a second resistor metal having a thickness of between 50 Å and 2 &mgr;m is disposed on the first layer of the first resistor metal. The first resistor metal has a resistance different from the second resistor metal.
    Type: Application
    Filed: August 2, 2001
    Publication date: April 25, 2002
    Applicant: Gould Electronics Inc.
    Inventors: Jiangtao Wang, Michael A. Centanni, Sidney J. Clouser
  • Patent number: 6376008
    Abstract: A method of forming a laminate for use in the production of printed circuit boards, comprising the steps of: a) forming a component comprised of a sheet of copper foil and a sheet of metal, the sheet of copper foil having an essentially uncontaminated surface facing an essentially uncontaminated surface of the sheet of metal, the surfaces of the sheets being in unattached contact with each other in an area that defines a substantially uncontaminated zone; b) applying a preformed adhesive film formed of a substantially uncured polymeric material onto an exposed surface of the copper foil, the adhesive film having a first surface and a second surface, the film being attached to the component with the first surface in contact with an exposed surface of the copper foil; and c) curing the adhesive film, wherein the second surface of the adhesive film is at least partially uncured.
    Type: Grant
    Filed: September 21, 1999
    Date of Patent: April 23, 2002
    Assignee: Gould Electronics Inc.
    Inventors: R. Richard Steiner, Shiuh-Kao Chiang