Abstract: In one embodiment, the present invention relates to a method of increasing resin dust resistance of metal foil comprising contacting the metal foil with an inert silane, titanate or zirconate compound to form a resin dust resistant film having a thickness from about 0.001 microns to about 1 micron on a surface of the metal foil. In another embodiment, the present invention relates to a method of treating metal foil comprising contacting a first side of the metal foil with a hydrocarbylsilane solution to form a resin dust resistant film on a surface of the metal foil, the hydrocarbylsilane solution comprising from about 0.01% to about 10% v/v of a hydrocarbylsilane; and laminating a second side of the metal foil to a prepreg.
Type:
Grant
Filed:
December 14, 1998
Date of Patent:
October 9, 2001
Assignee:
Gould Electronics Incl
Inventors:
Charles A. Poutasse, Michael A. Centanni