Abstract: A cutting device for cutting a material includes: a frame structure arranged to be pivoted around a pivot axis, wherein the frame structure includes at least two essentially parallelly arranged frame portions arranged at a distance (d) from each other along a first axis (x), wherein a cutting wire is arranged between the frame portions and connected to the respective frame portions, wherein the material is cut and formed by the cutting wire during a pivoting relative movement between the frame structure and the material around a pivot axis (p).