Abstract: A method and apparatus for modeling and thermal analysis of semiconductor chip designs is provided. One embodiment of a novel method for performing thermal testing of a semiconductor chip design includes calculating full-chip temperatures over the semiconductor chip design (e.g., to identify steep thermal gradients) and modeling the full-chip temperatures in accordance with a geometric multi-grid technique. The geometric multi-grid technique is tailored to determine temperatures within the semiconductor chip design based at least in part on the physical attributes or geometry of the design.

Abstract: A method and apparatus for retrofitting semiconductor chip performance analysis tools with full-chip thermal analysis capabilities is provided. One embodiment of a novel method for performing performance analysis of a semiconductor chip design includes receiving at least one input calculated in accordance with an actual (e.g., purposefully calculated rather than assumed or estimated) temperature of a semiconductor device and/or an interconnects in the semiconductor ship design. This input is then used to assess at least one temperature-dependent performance parameter of the semiconductor chip design.

Abstract: A method and apparatus for full-chip thermal analysis of semiconductor chip designs is provided. One embodiment of a novel method for performing thermal analysis of a semiconductor chip design comprises receiving at least one input relating to a semiconductor chip design to be analyzed. The input is then processed to produce a three-dimensional thermal model of the semiconductor chip design. In another embodiment, thermal analysis of the semiconductor chip design is performed by calculating power dissipated by transistors and interconnects included in the semiconductor chip design and distributing power dissipated by the interconnects.

Abstract: A method and apparatus for normalizing thermal gradients over semiconductor chip designs is provided. One embodiment of a novel method for normalizing an expected thermal gradient includes determining a location of the thermal gradient in the semiconductor chip design and inserting at least one supplemental heat source into the semiconductor chip design such that the thermal gradient is normalized by heat dissipated by the supplemental heat source.

Abstract: A method and apparatus for thermal testing of semiconductor chip designs is provided. One embodiment of a novel method for performing thermal testing of a semiconductor chip design includes calculating full-chip temperatures over the semiconductor chip design (e.g., to identify steep thermal gradients) and positioning temperature sensors within a corresponding semiconductor chip in accordance with the calculated full-chip temperatures (e.g., in the regions of steep thermal gradients). Thus, temperature sensors are strategically placed in the regions where they are most likely to be needed, according to calculated temperatures, rather than randomly positioned throughout a test chip.