Abstract: An electroplating solution recovery system is disclosed which includes an electroplating tank containing an electroplating solution and one or more rinse tanks containing rinse solutions. A tubular interconnection extends between a first of the rinse tanks and the electroplating tank and is operative for transferring rinse solution from the first rinse tank to the electroplating tank by a siphoning process when the level in the plating tank is significantly lower than the level in the rinse tank. Additional tubular interconnections extend between the other rinse tanks for interconnecting them in series relation so that the solution in the tanks is automatically replenished as it is consumed, the solution level in the last tank in the series, however, being replenished from a continuous water supply. Maximum recovery of plating solution is assured by the system, and the pollution levels in the overflow effluent from the last rinse tank are minimized.