Abstract: A film-closure apparatus is provided which is suitable for closing plastic film material using heat. The apparatus comprises a guide path along which at least part of a plastics film material can pass; a drive means for moving the film material along the guide path; and a printed circuit board comprising a circuit substrate having first and second major board surfaces and a perimeter edge surface, and an electrically conductive heating element which is provided on the circuit substrate along at least part of the perimeter edge surface. The electrically conductive heating element is positionable on the guide path to apply heat to the film material thereon.

Abstract: A method and apparatus for forming void-fill packaging wherein a tubular plastics material (11) is periodically fed via driver rollers (15) along a longitudinal guide path (12), first and second transverse spaced parallel heat seals are formed substantially across the plastics material via a transverse heat sealer (36, 38) to define a chamber (104) between the seals, a fluid is discharged into the chamber via a nozzle (20) positioned along the guide path and adapted to extend inside the tubular plastics material adjacent to one longitudinal edge of the plastic material, a third heat seal is formed via a longitudinal heat sealer (78) to seal the chamber (104), and the longitudinal edge of the tubular plastic material is cut via a cutting element (22) so that the movement of the tubular plastics material is not hindered by the nozzle.